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1. 发明申请

US20220013261A1 METHOD FOR MASS-MANUFACTURING OF MINIATURE RESISTOR 有权
公开(公告)号：US20220013261A1
公开(公告)日：2022-01-13
申请号：US17109703
申请日：2020-12-02
申请人： Ralec Electronic Corporation
发明人： Tim WANG
IPC分类号： H01C17/00
摘要： A method for mass-manufacturing of a miniature resistor includes the steps of: providing a foil sheet; forming intersecting rows of slits to define a patterned foil sheet having a matrix array of resistor blanks that are interconnected at intersections of the intersecting rows; forming first and second photoresist films on the patterned foil sheet; forming holes in the first photoresist film; forming protruding blocks to fill the holes; removing the first and second photoresist films; encapsulating the patterned foil sheet and the protruding blocks without covering outer surfaces of the protruding blocks; performing a cutting process to obtain individual resistor blanks; and forming two external electrodes respectively on the protruding blocks and on two side surfaces of the individual resistor blank to obtain the miniature resistor.

2. 发明申请

US20140055228A1 CHIP RESISTOR DEVICE AND METHOD FOR FABRICATING THE SAME 有权
标题翻译：芯片电阻器件及其制造方法
公开(公告)号：US20140055228A1
公开(公告)日：2014-02-27
申请号：US13790064
申请日：2013-03-08
申请人： RALEC ELECTRONIC CORPORATION
发明人： Wan-Ping Wang
IPC分类号： H01C17/00 , H01C1/142
CPC分类号： H01C17/006 , H01C1/142 , H01C13/02 , H01C17/281 , Y10T29/49082
摘要： A chip resistor device includes an insulating substrate, two indented patterns, and a resistor unit. The insulating substrate has opposite first and second surfaces. The first surface has two opposite edges and two electrode forming regions adjacent to the two opposite edges, respectively. The indented patterns are respectively formed in the electrode forming regions of the first surface and indented from the first surface. The resistor unit includes two contact electrodes respectively formed on the electrode forming regions of the first surface and filled into the indented patterns, and a resistor formed on the first surface between the two contact electrodes and electrically contacting the contact electrodes.
摘要翻译：片式电阻器件包括绝缘衬底，两个缩进图案和电阻器单元。绝缘基板具有相对的第一和第二表面。第一表面具有分别与两个相对边缘相邻的两个相对边缘和两个电极形成区域。凹入图案分别形成在第一表面的电极形成区域中并且从第一表面缩进。电阻器单元包括分别形成在第一表面的电极形成区域上并被填充到凹入图案中的两个接触电极，以及形成在两个接触电极之间的第一表面上并与接触电极电接触的电阻器。

3. 发明授权

US11581112B2 Method for manufacturing miniature resistor 有权
公开(公告)号：US11581112B2
公开(公告)日：2023-02-14
申请号：US17039550
申请日：2020-09-30
申请人： Ralec Electronic Corporation
发明人： Tim Wang
IPC分类号： H01C17/07 , H01C17/245
摘要： A method for manufacturing a miniature resistor includes the steps of: providing a foil sheet; forming intersecting rows of slits to define a patterned foil sheet having a matrix array of resistor blanks that are interconnected at intersections of the intersecting rows; forming a resin film on a bottom surface of the patterned foil sheet; forming a plurality of protruding blocks on each resistor blanks; forming an encapsulating layer on atop surface of each resistor blanks without covering outer surfaces of the protruding blocks; performing a die cutting process to obtain individual resistor blanks; and forming two external electrodes respectively on the protruding blocks and on two side surfaces of the individual resistor blanks to obtain the miniature resistor.

4. 发明申请

US20220270789A1 CHIP RESISTOR 有权
公开(公告)号：US20220270789A1
公开(公告)日：2022-08-25
申请号：US17354057
申请日：2021-06-22
申请人： Ralec Electronic Corporation
发明人： Tim WANG , Quo-Xiang CHI , Chia-Cheng CHENG , Wen-Chun CHEN
IPC分类号： H01C1/142 , H01C17/00 , H01C1/08
摘要： A chip resistor includes a main body having opposite first and second surfaces and a peripheral surface connected between the first and second surfaces, and first and second electrode units oppositely and separately disposed on the peripheral surface. The main body includes a resistance layer having opposite top and bottom surfaces, a metallic heat dissipation layer disposed on the top surface of the resistance layer, a metallic heat conductive layer disposed on the bottom surface of the resistance layer, and an insulating unit interposed between the resistance layer and the metallic heat dissipation layer, and between the resistance layer and the metallic heat conductive layer.

5. 发明申请

US20130342308A1 CHIP RESISTOR 审中-公开
标题翻译：芯片电阻
公开(公告)号：US20130342308A1
公开(公告)日：2013-12-26
申请号：US13778732
申请日：2013-02-27
申请人： RALEC ELECTRONIC CORPORATION
发明人： Full Chen
IPC分类号： H01C1/084
CPC分类号： H01C1/084 , H01C1/08 , H01C7/003
摘要： A chip resistor includes a resistor main body, an insulating layer, a heat dissipating layer, and two electrodes. The resistor main body is formed with plural longitudinally extending slits arranged and spaced apart from one another. The resistor main body has transversely opposite ends connected electrically and respectively to the electrodes. The heat dissipating layer dissipates heat generated by the resistor main body and is formed with a dividing slot extending across one of the slits and dividing the heat dissipating layer into two transversely spaced-apart portions. The insulating layer is sandwiched between the resistor main body and the heat dissipating layer and electrically insulates the heat dissipating layer from the resistor main body.
摘要翻译：芯片电阻器包括电阻器主体，绝缘层，散热层和两个电极。电阻器主体形成有彼此间隔开设置的多个纵向延伸的狭缝。电阻器主体具有电连接并分别连接到电极的横向相对端。散热层消散由电阻器主体产生的热量，并且形成有分隔槽，该分隔槽延伸穿过狭缝之一并将散热层分成两个横向间隔开的部分。绝缘层夹在电阻器主体和散热层之间，并使散热层与电阻器主体电绝缘。

6. 发明申请

US20130341301A1 METHOD FOR MANUFACTURING A CHIP RESISTOR 审中-公开
标题翻译：制造芯片电阻的方法
公开(公告)号：US20130341301A1
公开(公告)日：2013-12-26
申请号：US13783931
申请日：2013-03-04
申请人： RALEC ELECTRONIC CORPORATION
发明人： Full Chen
IPC分类号： H01C17/00 , H01C7/00
CPC分类号： H01C17/006 , H01C7/00 , H01C17/22 , Y10T156/108
摘要： In a method of manufacturing a chip resistor, a semi-product is formed by sandwiching an electric-insulating material layer between an electric-conducting material layer and a heat-dissipating material layer. Resistor sections arranged in an array on the semi-product are formed by forming longitudinal first slots and transverse second slots through the semi-product. Slits are formed on a first layer of each resistor section to form a resistor main body. A dividing slot is formed on a second layer of each resistor section. Two electrodes are formed to be electrically connected to opposite ends of the resistor main body. The resistor sections are trimmed from the semi-product to obtain the chip resistors.
摘要翻译：在制造片状电阻器的方法中，通过在导电材料层和散热材料层之间夹有电绝缘材料层而形成半成品。通过在半成品上形成纵向的第一槽和横向的第二槽而形成在半成品上排列成阵列的电阻部分。在每个电阻器部分的第一层上形成狭缝以形成电阻器主体。分隔槽形成在每个电阻器部分的第二层上。两个电极形成为电连接到电阻器主体的相对端。电阻器部分从半成品中调整以获得芯片电阻。

7. 发明申请

US20220013262A1 METHOD FOR MANUFACTURING MINIATURE RESISTOR 有权
公开(公告)号：US20220013262A1
公开(公告)日：2022-01-13
申请号：US17039550
申请日：2020-09-30
申请人： Ralec Electronic Corporation
发明人： Tim WANG
IPC分类号： H01C17/07 , H01C17/245
摘要： A method for manufacturing a miniature resistor includes the steps of: providing a foil sheet; forming intersecting rows of slits to define a patterned foil sheet having a matrix array of resistor blanks that are interconnected at intersections of the intersecting rows; forming a resin film on a bottom surface of the patterned foil sheet; forming a plurality of protruding blocks on each resistor blanks; forming an encapsulating layer on atop surface of each resistor blanks without covering outer surfaces of the protruding blocks; performing a die cutting process to obtain individual resistor blanks; and forming two external electrodes respectively on the protruding blocks and on two side surfaces of the individual resistor blanks to obtain the miniature resistor.

8. 发明申请

US20210343471A1 THIN-FILM INDUCTOR DEVICE 有权
公开(公告)号：US20210343471A1
公开(公告)日：2021-11-04
申请号：US16991617
申请日：2020-08-12
申请人： Ralec Electronic Corporation
发明人： Tim WANG , Hung-Pin LIN
IPC分类号： H01F27/29 , H01F27/32 , H01F17/04
摘要： A thin-film inductor device includes a substrate made of an electrically insulating material, a first coil unit, a second coil unit, and an inductance-enhancing structure. The first coil unit includes a first upper coil, a first lower coil, and two first electrodes electrically connected to the first upper and lower coils, respectively. The second coil includes a second upper coil, a second lower coil, and two second electrodes electrically connected to the second upper and lower coils, respectively. The first and second upper/lower coils are disposed spacedly and arranged by bifilar winding. The inductance-enhancing structure encapsulates the substrate, the first coil unit, and the second coil unit such that two terminal parts of each of the first electrodes and the second electrodes are exposed for external electrical connection.

9. 发明申请

US20210134525A1 THIN-FILM INDUCTOR AND METHOD FOR MANUFACTURING THE SAME 有权
公开(公告)号：US20210134525A1
公开(公告)日：2021-05-06
申请号：US16853510
申请日：2020-04-20
申请人： Ralec Electronic Corporation
发明人： Tim Wang
IPC分类号： H01F41/04 , H01F27/28 , H01F27/32 , H01F27/29 , H01F41/12
摘要： A method for manufacturing a thin-film inductor includes the steps of a) forming a separation film on a base plate, b) forming a first magnetic layer on the separation film, c) forming, on the first magnetic layer, a coil unit and an electrically insulating member enclosing the coil unit, d) forming a second magnetic layer on the first magnetic layer to cover the coil unit and the electrically insulating member and fill a space defined by the coil unit, e) removing peripheral portions of the first and second magnetic layers until a part of the separation film is exposed to obtain a semi-product, f) forming a cover insulating layer on the exposed separation film and the semi-product such that two contact regions of the coil unit are exposed, and g) removing the base plate. A thin-film inductor made by the method is also disclosed.

10. 发明授权

US08456273B2 Chip resistor device and a method for making the same 有权
标题翻译：片式电阻器件及其制造方法
公开(公告)号：US08456273B2
公开(公告)日：2013-06-04
申请号：US13226094
申请日：2011-09-06
申请人： Full Chen
发明人： Full Chen
IPC分类号： H01C1/012
CPC分类号： H01C1/012 , H01C1/08 , H01C17/006 , H01C17/06 , Y10T29/49082
摘要： A chip resistor device includes: a dielectric substrate that has top and bottom surfaces and two opposite edge faces interconnecting the top and bottom surfaces; two electrodes that are formed on two opposite sides of the dielectric substrate and that cover the edge faces and parts of the top and bottom surfaces; a resistor layer that is formed on one of the top and bottom surfaces of the dielectric substrate between the electrodes and that is brought into contact with the electrodes; and a heat conductive layer that is disposed on the resistor layer oppositely of the dielectric substrate and between the electrodes, that contacts the resistor layer and the two electrodes, and that has a higher resistance than that of the resistor layer. A method for making the chip resistor device is also disclosed.
摘要翻译：芯片电阻器件包括：电介质基片，其具有顶表面和底表面以及互连顶表面和底表面的两个相对的边缘面; 两个电极，形成在电介质基片的两个相对的两侧，并覆盖顶面和底面的边缘面和部分; 电阻层，其形成在所述电介质基板的所述顶表面和所述底表面之一之间，并且与所述电极接触; 以及导电层，其设置在与电介质基板相反的电阻层上，并且在电极之间，与电阻层和两个电极接触，并且具有比电阻层更高的电阻。还公开了制造芯片电阻器件的方法。

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