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    • 2. 发明授权
    • Robot system
    • 机器人系统
    • US08761929B2
    • 2014-06-24
    • US13327758
    • 2011-12-16
    • Satoshi Sueyoshi
    • Satoshi Sueyoshi
    • B23Q15/22
    • B25J9/042B25J5/02B25J9/046B25J19/0066
    • A robot system according to embodiments includes a robot and a control unit. The robot includes a plurality of movable units that operate in a predetermined direction and links connected to the movable units, and the control unit controls an operation of the movable units of the robot. Moreover, the robot system transfers a detachable member mounted on a predetermined movable unit by causing a movable unit other than the predetermined movable unit to operate in a state where the predetermined movable unit is stopped.
    • 根据实施方式的机器人系统包括机器人和控制单元。 机器人包括以预定方向操作的多个可移动单元和连接到可移动单元的链接,并且控制单元控制机器人的可移动单元的操作。 此外,机器人系统通过使预定可动单元以外的可动单元在预定的可动单元停止的状态下进行操作,从而传递安装在预定的可动单元上的可拆卸构件。
    • 6. 发明授权
    • Controlled electroplated solder bumps
    • 受控电镀焊锡凸块
    • US08741765B2
    • 2014-06-03
    • US13076881
    • 2011-03-31
    • Christian Schroiff
    • Christian Schroiff
    • H01L21/44
    • H01L24/11H01L24/742H01L24/94H01L2224/11462H01L2224/13111H01L2224/742H01L2224/94H01L2924/01029H01L2924/01033H01L2924/01047H01L2924/014H01L2224/11H01L2924/00012H01L2924/00014
    • The uniformity of the composition of plated solder bumps from one batch of wafers to another is improved by controlling the rotational speed of the wafers based on the particular solder bump pattern. Embodiments include sequentially horizontal fountain electroplating a pattern of solder bumps, e.g., SnAg solder bumps, on a plurality batches of wafers and controlling the rotational speed of each batch of wafers during electroplating based on a calibration plot of the concentration of a solder bump component, e.g., Ag, as a function of rotational speed for each solder bump pattern, such that the uniformity of the Ag concentration in the patterns of solder bumps is greater than 95%, e.g., greater than 98%. Embodiments further include electroplating in the same plater sequential batches of wafers having both different patterns and different solder bump compositions at the same high throughput.
    • 通过基于特定的焊料凸块图案来控制晶片的旋转速度,改善了从一批晶片到另一批晶片的电镀焊料凸起的组成的均匀性。 实施例包括在多个批次的晶片上依次水平喷镀电镀焊料凸块的图案,例如SnAg焊料凸块,并且基于焊料凸点组件的浓度的校准图来控制电镀期间每批晶片的旋转速度, 例如Ag,作为每个焊料凸块图案的旋转速度的函数,使得焊料凸块的图案中的Ag浓度的均匀性大于95%,例如大于98%。 实施例进一步包括在相同的高通量下,在具有不同图案和不同焊料凸块组成的相同的平板批次的晶片中进行电镀。
    • 7. 发明授权
    • Plant control apparatus
    • 植物控制装置
    • US08725393B2
    • 2014-05-13
    • US12984103
    • 2011-01-04
    • Koichiro TsuzukiYuji Yasui
    • Koichiro TsuzukiYuji Yasui
    • G06F19/00
    • F02D41/1401F02D35/023F02D35/024F02D41/1405F02D41/1406F02D41/222F02D41/40F02D41/401F02D41/402F02D2041/1412F02D2041/1433Y02T10/44
    • A plant control apparatus includes a plant model and a control input determining device. The plant model estimates a control variable of a plant based on an input including a control parameter to adjust a first control variable of the plant. The control input determining device is configured to correct a temporary value of the control parameter so that a first control variable model value satisfies a predetermined constraint. The control input determining device is configured to determine a control input for the plant based on the temporary value of the control parameter that has been corrected. The first control variable model value is defined as an estimated value of the first control variable calculated by the plant model when the temporary value of the control parameter is input to the plant model.
    • 工厂控制装置包括工厂模型和控制输入确定装置。 植物模型基于包括控制参数的输入来估计植物的控制变量,以调整植物的第一控制变量。 控制输入​​确定装置被配置为校正控制参数的临时值,使得第一控制变量模型值满足预定约束。 控制输入​​确定装置被配置为基于已经被校正的控制参数的临时值来确定工厂的控制输入。 当控制参数的临时值输入到工厂模型时,第一个控制变量模型值被定义为由工厂模型计算的第一个控制变量的估计值。
    • 8. 发明授权
    • Plant controller
    • 工厂控制器
    • US08725304B2
    • 2014-05-13
    • US13239787
    • 2011-09-22
    • Michinori TaniKenichi MaedaAtsuhiro MiyauchiSeiji Watanabe
    • Michinori TaniKenichi MaedaAtsuhiro MiyauchiSeiji Watanabe
    • G06F19/00
    • G05B13/04F02D41/1401F02D2041/141
    • A plant controller includes a feedback controller configured to calculate a control input provided to a plant so that a control output of the plant matches a target value. The feedback controller includes a controller transfer function that is a transfer function of the feedback controller. The controller transfer function is expressed by a product of an inverse transfer function of a transfer function of a control target model obtained by modeling the plant and a disturbance sensitivity correlation function defined using a sensitivity function. The sensitivity function indicates sensitivity of a disturbance to be applied to the plant with respect to the control output. The sensitivity function is defined by using a response characteristic parameter that indicates a response characteristic of the plant.
    • 工厂控制器包括反馈控制器,其被配置为计算提供给工厂的控制输入,使得设备的控制输出与目标值匹配。 反馈控制器包括作为反馈控制器的传递函数的控制器传递函数。 控制器传递函数由通过对工厂进行建模获得的控制目标模型的传递函数的反向传递函数和使用灵敏度函数定义的干扰敏感度相关函数的乘积表示。 灵敏度功能表示相对于控制输出对工厂施加扰动的灵敏度。 灵敏度函数通过使用指示工厂的响应特性的响应特性参数来定义。
    • 9. 发明授权
    • ESD protection device with a tunable holding voltage for a high voltage programming pad
    • ESD保护器件,具有高压编程焊盘的可调保持电压
    • US08724272B2
    • 2014-05-13
    • US13454340
    • 2012-04-24
    • Ying-Chang LinDa-Wei Lai
    • Ying-Chang LinDa-Wei Lai
    • H02H3/22
    • H01L27/0262H02H9/04
    • An ESD protection device with a tunable holding voltage is disclosed. Embodiments include: providing a silicon-controlled rectifier (SCR) having a first n-type layer with a cathode connection, a first p-type layer with a first control connection, a second n-type layer with a second control connection, and a second p-type layer with an anode connection; coupling the anode connection to a power rail; coupling the cathode connection to a ground rail; providing a tunable holding voltage control unit including a first NMOS having a first gate, a first drain, and a first source, wherein during an ESD event, the first NMOS is turned off and a holding voltage of the SCR is low; coupling the first drain to the first control connection; coupling the first source to the ground rail; and coupling the first gate to a program circuit.
    • 公开了具有可调保持电压的ESD保护装置。 实施例包括:提供具有阴极连接的第一n型层的硅可控整流器(SCR),具有第一控制连接的第一p型层,具有第二控制连接的第二n型层,以及 具有阳极连接的第二p型层; 将阳极连接件连接到电源轨; 将阴极连接件连接到地面导轨上; 提供可调保持电压控制单元,其包括具有第一栅极,第一漏极和第一源极的第一NMOS,其中在ESD事件期间,第一NMOS截止,并且SCR的保持电压低; 将所述第一漏极耦合到所述第一控制连接; 将第一源耦合到地面导轨; 以及将所述第一栅极耦合到编程电路。