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1. 发明申请

US20110079511A1 MAGNET ARRANGEMENT FOR A TARGET BACKING TUBE AND TARGET BACKING TUBE COMPRISING THE SAME 审中-公开
标题翻译：用于目标支管的磁铁装置和包含其的目标支管
公开(公告)号：US20110079511A1
公开(公告)日：2011-04-07
申请号：US12641080
申请日：2009-12-17
申请人： Anke HELLMICH , Wolfgang KROCK
发明人： Anke HELLMICH , Wolfgang KROCK
IPC分类号： C23C14/34
CPC分类号： H01J37/3405 , H01J37/342 , H01J37/3452
摘要： The disclosure concerns a magnet arrangement for a target backing tube for a rotatable target of a sputtering system, the magnet arrangement having a longitudinal axis and a circumferential direction around the longitudinal axis, and being adapted for an arrangement in a cylindrical backing tube, wherein the magnet arrangement comprises in a circumferential sequence: a first magnet element extending in parallel to the longitudinal axis, a second magnet element extending in parallel to the longitudinal axis, and a third magnet element extending in parallel to the longitudinal axis, wherein each magnet element has a center axis extending in a radial direction, wherein the angular distance between the first and the third magnet elements, with respect to their center axis, is less than about 85 degrees. The disclosure also concerns a cylindrical target assembly and at least one target cylinder disposed around the target backing tube.
摘要翻译：本公开涉及用于用于溅射系统的可旋转靶的目标背衬管的磁体布置，磁体布置具有围绕纵向轴线的纵向轴线和周向方向，并且适于在圆柱形背衬管中布置，其中，磁体排列包括圆周顺序：平行于纵向轴线延伸的第一磁体元件，平行于纵向轴线延伸的第二磁体元件和平行于纵向轴线延伸的第三磁体元件，其中每个磁体元件具有沿径向方向延伸的中心轴线，其中第一和第三磁体元件之间相对于其中心轴线的角距离小于约85度。本公开还涉及圆柱形目标组件和围绕目标背衬管设置的至少一个目标圆柱体。

2. 发明申请

US20110005924A1 TARGET BACKING TUBE, CYLINDRICAL TARGET, AND CYLINDRICAL TARGET ASSEMBLY 审中-公开
标题翻译：目标支管，圆柱目标和圆柱目标组件
公开(公告)号：US20110005924A1
公开(公告)日：2011-01-13
申请号：US12505363
申请日：2009-07-17
申请人： Frank SCHNAPPENBERGER , Roland WEBER , Joerg KREMPEL-HESSE , Anke HELLMICH
发明人： Frank SCHNAPPENBERGER , Roland WEBER , Joerg KREMPEL-HESSE , Anke HELLMICH
IPC分类号： C23C14/34
CPC分类号： H01J37/3405 , H01J37/3435
摘要： A target backing tube is described. The target backing tube is for a rotatable target and includes a tube adapted for one or more non-bonded target cylinders to be disposed around the tube, the tube having an exterior surface adapted to face the at least one target cylinder and at least three or more protrusion receiving positions; and protrusions mounted on the exterior surface of the tube at each of the protrusion receiving positions for centering the target cylinders.
摘要翻译：描述了目标背衬管。目标背衬管用于可旋转的靶，并且包括适于一个或多个未粘合的目标圆柱体的管以围绕管布置，所述管具有适于面对至少一个目标圆柱体的外表面和至少三个或更多突出接收位置; 以及在用于使目标气缸对中的每个突起接收位置处安装在管的外表面上的突起。

3. 发明授权

US6129856A Process for surface-finishing inner surfaces of hollow bodies and apparatus for carrying out the process 失效
标题翻译：中空体的表面精加工内表面的工艺和进行该工艺的装置
公开(公告)号：US6129856A
公开(公告)日：2000-10-10
申请号：US103288
申请日：1998-06-23
申请人： Thomas Jung , Anke Hellmich
发明人： Thomas Jung , Anke Hellmich
IPC分类号： C23C14/04 , C23C14/34 , C23C16/04 , C23C16/44 , C23C16/455 , C23C16/513 , C03C15/00
CPC分类号： C23C16/4558 , C23C14/046 , C23C14/34 , C23C16/045 , C23C16/513
摘要： In a process for surface-finishing inner surfaces of hollow bodies with ateast one opening the hollow body is finished from inside by means of a hollow-cathode glow discharge as the excitation source.
摘要翻译：在具有至少一个开口的中空体的表面精加工内表面的过程中，中空体通过中空阴极辉光放电作为激发源从内部完成。

4. 发明申请

US20110005923A1 SPUTTERING SYSTEM, ROTATABLE CYLINDRICAL TARGET ASSEMBLY, BACKING TUBE, TARGET ELEMENT AND COOLING SHIELD 审中-公开
标题翻译：喷射系统，可旋转圆柱形目标组件，背管，目标元件和冷却屏蔽
公开(公告)号：US20110005923A1
公开(公告)日：2011-01-13
申请号：US12505379
申请日：2009-07-17
申请人： Frank SCHNAPPENBERGER , Roland WEBER , Joerg KREMPEL-HESSE , Anke HELLMICH
发明人： Frank SCHNAPPENBERGER , Roland WEBER , Joerg KREMPEL-HESSE , Anke HELLMICH
IPC分类号： C23C14/34
CPC分类号： H01J37/342 , H01J37/3405 , H01J37/3435 , H01J37/3497
摘要： The application concerns a target backing tube for a rotatable cylindrical target assembly comprising: a tube for at least one target element to be disposed there around, wherein the tube has an exterior surface adapted to face the at least one target element, wherein a portion of the exterior surface of the tube has a mean emissivity of 0.7 to 1, wherein the portion is at least 50% of the exterior surface of the tube. Further, the application concerns a cooling shield for a sputtering system comprising a rotatable target, the cooling shield has an interior surface adapted to face a target element of a sputtering system and an exterior surface; wherein a portion of the interior surface of the cooling shield has a mean emissivity of 0.7 to 1, wherein the portion is at least 50% of the interior surface of the cooling shield. Additionally, the application concerns a target element for a rotatable cylindrical target assembly of a sputtering system, wherein the target element an interior surface adapted to face a target backing tube onto which the target cylinder is adapted to be disposed and exterior surface, wherein a portion of the interior surface of the target element has a mean emissivity of 0.7 to 1, wherein the portion is at least 50% of the interior surface of the target element.
摘要翻译：该应用涉及用于可旋转的圆柱形目标组件的目标背衬管，其包括：用于至少一个目标元件的管，其被布置在其周围，其中管具有适于面向至少一个目标元件的外表面，其中一部分管的外表面具有0.7至1的平均发射率，其中该部分至少为管外表面的50％。此外，该应用涉及包括可旋转靶的溅射系统的冷却屏蔽，冷却屏具有适于面对溅射系统的目标元件和外表面的内表面; 其中所述冷却罩的内表面的一部分的平均发射率为0.7比1，其中所述部分是所述冷却屏蔽的内表面的至少50％。另外，该应用涉及一种用于溅射系统的可旋转圆柱形目标组件的目标元件，其中目标元件适于面向目标背衬管的内表面，目标圆柱体适于布置在其上并且外表面，其中一部分目标元件的内表面的平均发射率为0.7比1，其中该部分是目标元件的内表面的至少50％。

5. 发明授权

US10818475B2 AC power connector, sputtering apparatus and method therefor 有权
公开(公告)号：US10818475B2
公开(公告)日：2020-10-27
申请号：US15105894
申请日：2013-12-18
申请人： Frank Schnappenberger , Anke Hellmich , Stefan Keller , Marcus Bender
发明人： Frank Schnappenberger , Anke Hellmich , Stefan Keller , Marcus Bender
IPC分类号： H01J37/34 , H01J37/32 , H01G5/12 , C23C14/34 , H03H7/00 , H01G5/04
摘要： An AC power connector for connecting an AC power supply with a device is provided. The AC power connector includes at least one first element connectable with the AC power supply and at least one second element connectable with the device, the first element and the second elements being arranged at a first distance with respect to each other for defining a capacitance, wherein the at least one first element and the at least one second element are rotatable with respect to each other, wherein the first element and the second element are configured for a transfer of an AC power between the at least one first element and the at least one second element.

6. 发明申请

US20160244870A1 METHOD FOR CONTROLLING A GAS SUPPLY AND CONTROLLER 审中-公开
标题翻译：用于控制气体供应和控制器的方法
公开(公告)号：US20160244870A1
公开(公告)日：2016-08-25
申请号：US15024001
申请日：2013-09-24
申请人： Frank SCHNAPPENBERGER , Anke HELLMICH , Thomas KOCH , Thomas DEPPISCH
发明人： Frank SCHNAPPENBERGER , Anke HELLMICH , Thomas KOCH , Thomas DEPPISCH
IPC分类号： C23C14/00 , C23C14/54
CPC分类号： C23C14/0042 , C23C14/544 , H01J37/32449 , H01J37/32981 , H01J37/3299
摘要： A method for controlling a gas supply to a process chamber is provided. The method includes: measuring a gas parameter by each of two or more sensors provided in the process chamber; determining a combined gas parameter from the measured gas parameters; and controlling the gas supply to the process chamber based on the determined combined gas parameter.
摘要翻译：提供了一种用于控制对处理室的气体供应的方法。该方法包括：通过设置在处理室中的两个或更多个传感器中的每一个测量气体参数; 根据测量的气体参数确定组合气体参数; 以及基于所确定的组合气体参数来控制对所述处理室的气体供应。

7. 发明申请

US20070240977A1 Sputtering with cooled target 审中-公开
标题翻译：用冷却目标进行溅射
公开(公告)号：US20070240977A1
公开(公告)日：2007-10-18
申请号：US11708661
申请日：2007-02-20
申请人： Joerg Krempel-Hesse , Anke Hellmich , Gerd Orgeich , Thomas Hegemann
发明人： Joerg Krempel-Hesse , Anke Hellmich , Gerd Orgeich , Thomas Hegemann
IPC分类号： C23C14/34
CPC分类号： H01J37/32724 , H01J37/34 , H01J37/3408 , H01J37/3497
摘要： The present invention concerns a device and a method for coating substrates by means of sputtering a coating material in the form of a target, wherein the target is cooled during sputtering by means of a cooling medium fed at the target or past the region of the target or through the target, and the cooling medium has a feed temperature of less than 20° C.
摘要翻译：本发明涉及一种通过溅射靶材形式的涂层材料涂覆基材的装置和方法，其中靶材在溅射期间通过在目标物处供给的冷却介质或经过目标区域而被冷却或通过靶，并且冷却介质具有小于20℃的进料温度。

8. 发明授权

US10174415B2 Method for controlling a gas supply to a process chamber, controller for controlling a gas supply to a process chamber, and apparatus 有权
公开(公告)号：US10174415B2
公开(公告)日：2019-01-08
申请号：US15024001
申请日：2013-09-24
申请人： Frank Schnappenberger , Anke Hellmich , Thomas Koch , Thomas Deppisch
发明人： Frank Schnappenberger , Anke Hellmich , Thomas Koch , Thomas Deppisch
IPC分类号： C23C14/00 , H01J37/32 , C23C14/54
摘要： A method for controlling a gas supply to a process chamber is provided. The method includes: measuring a gas parameter by each of two or more sensors provided in the process chamber; determining a combined gas parameter from the measured gas parameters; and controlling the gas supply to the process chamber based on the determined combined gas parameter.

9. 发明申请

US20110192716A1 METHOD FOR PRODUCING AN ITO LAYER AND SPUTTERING SYSTEM 审中-公开
标题翻译：生产ITO层和溅射系统的方法
公开(公告)号：US20110192716A1
公开(公告)日：2011-08-11
申请号：US12707546
申请日：2010-02-17
申请人： Anke HELLMICH , Frank SCHNAPPENBERGER , Joerg KREMPEL-HESSE
发明人： Anke HELLMICH , Frank SCHNAPPENBERGER , Joerg KREMPEL-HESSE
IPC分类号： C23C14/34
CPC分类号： C23C14/086 , C23C14/3407 , C23C14/3421 , C23C14/35 , H01J37/3405 , H01J37/342
摘要： The present disclosure relates to a method for producing an indium-tin-oxide layer, comprising: providing a substrate to be coated in a sputtering chamber; providing a rotatable non-bonded target around a backing tube for coating the substrate in the sputtering chamber; and sputtering the material from the target in an atmosphere containing an O2/H2 mixture. Further the present disclosure relates to a sputtering system comprising a sputtering chamber having at least one gas inlet and being adapted for at least one backing tube for a non-bonded rotatable target, a control device adapted to control the flow through the gas inlet, wherein the control device is adapted to control the at least one gas inlet such that a coating on a substrate using a sputtering process is performed in an atmosphere containing an O2 /H2 mixture in the sputtering chamber for forming an indium-tin-oxide layer.
摘要翻译：本公开内容涉及一种制造铟锡氧化物层的方法，包括：在溅射室中提供待涂覆的基板; 在背衬管周围提供可旋转的未粘合的靶，用于在溅射室中涂覆基底; 并在包含O 2 / H 2混合物的气氛中从靶上溅射材料。此外，本公开涉及一种溅射系统，其包括具有至少一个气体入口并且适用于至少一个用于非粘合的可旋转靶的背衬管的溅射室，适于控制通过气体入口的流动的控制装置，其中控制装置适于控制至少一个气体入口，使得使用溅射工艺的衬底上的涂层在用于形成铟锡氧化物层的溅射室中的含有O 2 / H 2混合物的气氛中进行。

10. 发明申请

US20110005925A1 TARGET BACKING TUBE, CYLINDRICAL TARGET ASSEMBLY AND SPUTTERING SYSTEM 审中-公开
标题翻译：目标后支管，圆柱形目标组件和喷射系统
公开(公告)号：US20110005925A1
公开(公告)日：2011-01-13
申请号：US12505396
申请日：2009-07-17
申请人： Frank SCHNAPPENBERGER , Roland WEBER , Joerg KREMPEL-HESSE , Anke HELLMICH
发明人： Frank SCHNAPPENBERGER , Roland WEBER , Joerg KREMPEL-HESSE , Anke HELLMICH
IPC分类号： C23C14/34
CPC分类号： H01J37/3405 , H01J37/3435 , H01J37/3497
摘要： The present application concerns a target backing tube for a rotatable cylindrical target assembly comprising: a tube for at least one target element to be disposed there around, wherein the tube has an exterior surface adapted to be directed to the at least one target element; and a thermal reflection cover covering a portion of at least 20% of the exterior surface of the tube. Further, the present application concerns a rotatable cylindrical target assembly comprising: said target backing tube and at least one target element disposed around the target backing tube, wherein the thermal reflection cover disposed between the target backing tube and the at least one target element.
摘要翻译：本申请涉及一种用于可旋转圆柱形目标组件的目标背衬管，包括：用于至少一个目标元件的管子，其设置在其周围，其中所述管具有适于被引导到所述至少一个目标元件的外表面; 以及覆盖管的外表面的至少20％的一部分的热反射罩。此外，本申请涉及一种可旋转圆柱形目标组件，其包括：所述目标背衬管和围绕目标背衬管设置的至少一个目标元件，其中设置在目标背衬管和至少一个目标元件之间的热反射盖。

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