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1. 发明授权

US09096784B2 Method and system for allignment of graphite nanofibers for enhanced thermal interface material performance 有权
标题翻译：用于石墨纳米纤维排列的方法和系统，用于增强热界面材料性能
公开(公告)号：US09096784B2
公开(公告)日：2015-08-04
申请号：US13775157
申请日：2013-02-23
申请人： Joseph Kuczynski , Arvind Kumar Sinha , Kevin Albert Splittstoesser , Timothy Jerome Tofil
发明人： Joseph Kuczynski , Arvind Kumar Sinha , Kevin Albert Splittstoesser , Timothy Jerome Tofil
IPC分类号： B32B9/00 , C09K5/00 , B32B3/14 , C09K5/06 , B32B27/12 , B82Y30/00 , B32B5/24 , B32B5/02 , C23C16/26 , B23B5/12
CPC分类号： C09K5/00 , B23B5/12 , B32B3/14 , B32B5/02 , B32B5/12 , B32B5/24 , B32B27/12 , B82Y30/00 , C09K5/06 , C09K5/063 , C23C16/26 , Y10T428/24802 , Y10T428/30
摘要： The exemplary embodiments of the present invention provide an apparatus and a thermal interface material with aligned graphite nanofibers in the thermal interface material to enhance the thermal interface material performance. The thermal interface material having a thickness between a first surface and a second surface opposite the first surface. The comprising thermal interface material includes a plurality of carbon nanofibers (CNFs), wherein a majority of the CNFs are oriented orthogonal to a plane of the first surface. The apparatus includes the thermal interface material, and a first object having a third surface; and a second object having a fourth surface; wherein the thermal interface material is sandwiched between the third surface and the fourth surface.
摘要翻译：本发明的示例性实施例提供了一种在热界面材料中具有对准的石墨纳米纤维的装置和热界面材料，以增强热界面材料性能。所述热界面材料具有在第一表面和与所述第一表面相对的第二表面之间的厚度。包括热界面材料包括多个碳纳米纤维（CNF），其中大部分CNF定向成垂直于第一表面的平面。该装置包括热界面材料和具有第三表面的第一物体; 和具有第四表面的第二物体; 其中所述热界面材料夹在所述第三表面和所述第四表面之间。

2. 发明授权

US08750704B2 Implementing reduced signal degradation for fiber optic modules 失效
标题翻译：实现光纤模块降低的信号劣化
公开(公告)号：US08750704B2
公开(公告)日：2014-06-10
申请号：US12691845
申请日：2010-01-22
申请人： Joseph Kuczynski , Arvind Kumar Sinha
发明人： Joseph Kuczynski , Arvind Kumar Sinha
IPC分类号： H04B10/08 , G02B1/06 , G02B27/64
CPC分类号： G02B6/4206 , G02B3/14 , G02B6/4225 , G02B26/005
摘要： A method and circuit are provided for implementing reduced signal degradation for fiber optic modules, and a design structure on which the subject circuit resides. Responsive to a detected signal input, an optical misalignment calculation is performed. A voltage potential for a lens shape control is selected responsive to the optical misalignment calculation. An optical signal loss calculation and threshold compare are performed. Responsive to the optical signal loss calculation less than the threshold, the lens shape and voltage potential are fixed. A fluidic lens provides variable lens shape responsive to the selected voltage potential being applied to the fluidic lens.
摘要翻译：提供了一种用于实现光纤模块的降低的信号劣化的方法和电路，以及被摄体电路所在的设计结构。响应于检测信号输入，执行光学偏移计算。响应于光学偏移计算选择透镜形状控制的电压电位。执行光信号丢失计算和阈值比较。响应于光信号损耗计算小于阈值，透镜形状和电压电位是固定的。流体透镜提供响应于施加到流体透镜的选定电压电位的可变透镜形状。

3. 发明授权

US08431048B2 Method and system for alignment of graphite nanofibers for enhanced thermal interface material performance 有权
标题翻译：用于石墨纳米纤维对准的方法和系统，用于增强热界面材料性能
公开(公告)号：US08431048B2
公开(公告)日：2013-04-30
申请号：US12842200
申请日：2010-07-23
申请人： Joseph Kuczynski , Arvind Kumar Sinha , Kevin Albert Splittstoesser , Timothy Jerome Tofil
发明人： Joseph Kuczynski , Arvind Kumar Sinha , Kevin Albert Splittstoesser , Timothy Jerome Tofil
IPC分类号： H05K7/20
CPC分类号： B82Y40/00 , B82Y30/00 , C01B32/15 , C01B32/20 , H01L23/373 , H01L23/3733 , H01L2924/0002 , H01L2924/00
摘要： The exemplary embodiments of the present invention provide a method and system for aligning graphite nanofibers in a thermal interface material to enhance the thermal interface material performance. The method includes preparing the graphite nanofibers in a herringbone configuration, and dispersing the graphite nanofibers in the herringbone configuration into the thermal interface material. The method further includes applying a magnetic field of sufficient intensity to align the graphite nanofibers in the thermal interface material. The system includes the graphite nanofibers configured in a herringbone configuration and a means for dispersing the graphite nanofibers in the herringbone configuration into the thermal interface material. The system further includes a means for applying a magnetic field of sufficient intensity to align the graphite nanofibers in the thermal interface material.
摘要翻译：本发明的示例性实施例提供了一种用于在石墨纳米纤维中对准热界面材料以提高热界面材料性能的方法和系统。该方法包括以人字形配置制备石墨纳米纤维，并将石英纳米纤维以人字形构型分散到热界面材料中。该方法还包括施加足够强度的磁场以使石墨纳米纤维在热界面材料中对准。该系统包括以人字形配置的石墨纳米纤维和用于将人字形配置中的石墨纳米纤维分散到热界面材料中的装置。该系统还包括用于施加足够强度的磁场以对准热界面材料中的石墨纳米纤维的装置。

4. 发明授权

US07632127B2 Socket and method for compensating for differing coefficients of thermal expansion 失效
标题翻译：用于补偿不同热膨胀系数的插座和方法
公开(公告)号：US07632127B2
公开(公告)日：2009-12-15
申请号：US12100480
申请日：2008-04-10
申请人： Brian Samuel Beaman , Joseph Kuczynski , Theron Lee Lewis , Amanda Elisa Ennis Mikhail , Arvind Kumar Sinha
发明人： Brian Samuel Beaman , Joseph Kuczynski , Theron Lee Lewis , Amanda Elisa Ennis Mikhail , Arvind Kumar Sinha
IPC分类号： H01R13/62
CPC分类号： H01R12/7052 , H01R12/714 , Y10T29/49144 , Y10T29/49149 , Y10T29/49208 , Y10T29/53174 , Y10T29/53265
摘要： The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for differing coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises at least two members that are coupled together and disposed to form an aperture in between the at least two members, wherein the surface mounted contacts extend from the aperture, and wherein at least one dimension of the at least two members is selected to compensate for a difference between the coefficients of thermal expansion between the socket and a printed circuit board.
摘要翻译：说明性实施例提供插座，用于制造插座的方法，装置和用于补偿插座和印刷电路板之间的不同热膨胀系数的方法。插座包括表面安装的触点和细长的外壳。所述细长壳体包括至少两个联接在一起并设置成在所述至少两个构件之间形成孔的构件，其中所述表面安装的触点从所述孔延伸，并且其中所述至少两个构件的至少一个尺寸被选择以补偿插座和印刷电路板之间的热膨胀系数之间的差异。

5. 发明申请

US20080182443A1 Socket and Method for Compensating for Differing Coefficients of Thermal Expansion 失效
标题翻译：用于补偿不同热膨胀系数的插座和方法
公开(公告)号：US20080182443A1
公开(公告)日：2008-07-31
申请号：US12100480
申请日：2008-04-10
申请人： Brian Samuel Beaman , Joseph Kuczynski , Theron Lee Lewis , Amanda Elisa Ennis Mikhail , Arvind Kumar Sinha
发明人： Brian Samuel Beaman , Joseph Kuczynski , Theron Lee Lewis , Amanda Elisa Ennis Mikhail , Arvind Kumar Sinha
IPC分类号： H01R13/15
CPC分类号： H01R12/7052 , H01R12/714 , Y10T29/49144 , Y10T29/49149 , Y10T29/49208 , Y10T29/53174 , Y10T29/53265
摘要： The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for differing coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises at least two members that are coupled together and disposed to form an aperture in between the at least two members, wherein the surface mounted contacts extend from the aperture, and wherein at least one dimension of the at least two members is selected to compensate for a difference between the coefficients of thermal expansion between the socket and a printed circuit board.
摘要翻译：说明性实施例提供插座，用于制造插座的方法，装置和用于补偿插座和印刷电路板之间的不同热膨胀系数的方法。插座包括表面安装的触点和细长的外壳。所述细长壳体包括至少两个联接在一起并设置成在所述至少两个构件之间形成孔的构件，其中所述表面安装的触点从所述孔延伸，并且其中所述至少两个构件的至少一个尺寸被选择以补偿插座和印刷电路板之间的热膨胀系数之间的差异。

6. 发明授权

US07303443B1 Socket and method for compensating for differing coefficients of thermal expansion 有权
标题翻译：用于补偿不同热膨胀系数的插座和方法
公开(公告)号：US07303443B1
公开(公告)日：2007-12-04
申请号：US11548789
申请日：2006-10-12
申请人： Brian Samuel Beaman , Joseph Kuczynski , Theron Lee Lewis , Amanda Elisa Ennis Mikhail , Arvind Kumar Sinha
发明人： Brian Samuel Beaman , Joseph Kuczynski , Theron Lee Lewis , Amanda Elisa Ennis Mikhail , Arvind Kumar Sinha
IPC分类号： H01R24/00
CPC分类号： H01R13/533 , H01R12/716 , Y10T29/49222
摘要： The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for a difference in the coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises an aperture, wherein the surface mounted contacts extend from the aperture. At least one plate connects to the elongated housing, wherein the at least one plate has a coefficient of thermal expansion selected to compensate for a difference in coefficients of thermal expansion between the socket and a printed circuit board.
摘要翻译：说明性实施例提供插座，用于制造插座的方法，装置和用于补偿插座和印刷电路板之间的热膨胀系数的差异的方法。插座包括表面安装的触点和细长的外壳。细长壳体包括孔，其中表面安装的接触件从孔径延伸。至少一个板连接到细长壳体，其中至少一个板具有选择的热膨胀系数以补偿插座和印刷电路板之间的热膨胀系数差。

7. 发明授权

US07317514B2 System and method for optimizing heat management 有权
标题翻译：优化热管理系统和方法
公开(公告)号：US07317514B2
公开(公告)日：2008-01-08
申请号：US11050053
申请日：2005-02-03
申请人： Joseph Kuczynski , Arvind Kumar Sinha , Kevin Albert Splittstoesser , Timothy Jerome Tofil , Paul Alan Vermilyea
发明人： Joseph Kuczynski , Arvind Kumar Sinha , Kevin Albert Splittstoesser , Timothy Jerome Tofil , Paul Alan Vermilyea
IPC分类号： G01B11/16
CPC分类号： G01K5/52 , G01K5/72 , G01K11/32 , G05D23/1917 , G05D23/27
摘要： Disclosed are heat management method, and system, and computer program product that include at least one optical strain gauge that is mounted on a printed board in proximity to an object being monitored for temperature changes. Power for controlling heat to the object is modified in response to changes in the optical reference signal of the gauge, whereby such changes are correlated to the rate of strain change in the object as measured relative to predefined temperature changes of the object being monitored.
摘要翻译：公开了热管理方法，系统和计算机程序产品，其包括安装在印刷板上的至少一个光学应变计，所述光学应变计附近被监测用于温度变化的物体。响应于计量器的光学参考信号的变化来修改对对象的热控制的功率，由此这种变化与被测物体相对于被监视物体的预定温度变化测量的物体中的应变变化速率相关。

8. 发明授权

US07298623B1 Organic substrate with integral thermal dissipation channels, and method for producing same 失效
标题翻译：具有整体散热通道的有机基板及其制造方法
公开(公告)号：US07298623B1
公开(公告)日：2007-11-20
申请号：US11427382
申请日：2006-06-29
申请人： Joseph Kuczynski , Arvind Kumar Sinha
发明人： Joseph Kuczynski , Arvind Kumar Sinha
IPC分类号： H05K7/20 , H05K1/00
CPC分类号： H05K1/0203 , H01L23/473 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/09701 , H01L2924/15311 , H05K1/0272 , H05K1/0366 , H05K3/3452 , H05K3/429 , H05K2201/064 , H05K2203/1394 , Y10T29/49126 , Y10T29/49128 , Y10T29/49156 , Y10T29/4935 , H01L2924/00
摘要： A chip module heat transfer apparatus includes one or more chips electronically connected to a module substrate by controlled collapse chip connection (C4) solder joints. The module substrate, which is preferably an FR-4 laminate or other organic substrate, has cut-out channels formed thereon. A permanent solder mask is laminated over the cut-out channels to form thermal dissipation channels, which are in fluid communication with input and output ports. The C4 solder joints include solder balls that electronically connect terminals on the chips to corresponding attach pads on the substrate that are exposed through the mask. The thermal dissipation channels extend along rows of attach pads. A cooling fluid, such as inert perfluorocarbon fluid, flows through the thermal dissipation channels to remove heat and to mitigate strain on the solder balls due to coefficient of thermal expansion (CTE) mismatch between the chips and the substrate.
摘要翻译：芯片模块传热装置包括一个或多个芯片，通过控制的崩溃芯片连接（C4）焊接点电连接到模块基板。优选为FR-4层叠体或其他有机基板的模块基板在其上形成有切口通道。永久性焊接掩模层叠在切口通道上以形成与输入和输出端口流体连通的散热通道。 C4焊点包括将芯片上的端子电连接到通过掩模暴露的衬底上相应的附接焊盘的焊球。散热通道沿连续焊盘排。诸如惰性全氟化碳流体之类的冷却流体由于散热通道而流过，以便由于芯片和衬底之间的热膨胀系数（CTE）不匹配而消除热量并减轻焊球上的应变。

9. 发明申请

US20110239790A1 PIEZOELECTRIC CHROMIC IMPACT SENSOR 有权
标题翻译：压电感光度传感器
公开(公告)号：US20110239790A1
公开(公告)日：2011-10-06
申请号：US12754851
申请日：2010-04-06
申请人： Joseph Kuczynski , Arvind Kumar Sinha , Kevin Albert Splittstoesser , Timothy Jerome Tofil
发明人： Joseph Kuczynski , Arvind Kumar Sinha , Kevin Albert Splittstoesser , Timothy Jerome Tofil
IPC分类号： G01L1/16 , G01L1/24
CPC分类号： G01L5/0052 , G01L1/16 , G01L1/24
摘要： An impact sensor includes a piezoelectric transducer operatively connected to a chromic device. The chromic device includes a chromic material that changes from a first color state to a second color state in response to electric power generated by the piezoelectric transducer when exposed to a given level of impact force. The chromic material is bistable so that the chromic material remains in the second color state for a significant amount of time. An impact force to which the sensor has been subjected may be quantified by observing the chromic device. In one embodiment, the chromic material is an electrochromic material, such as a viologen, that changes through a color gradient of light transmission states from the first color state to the second color state. A printed color gradient may be used to aid in quantifying the impact force. In another embodiment, the chromic device includes a thermochromic material.
摘要翻译：冲击传感器包括可操作地连接到铬装置的压电传感器。铬装置包括当暴露于给定水平的冲击力时响应于由压电换能器产生的电力而从第一颜色状态改变到第二颜色状态的铬材料。铬材料是双稳态的，使得铬材料在相当长的时间内保持在第二颜色状态。传感器已经受到的冲击力可以通过观察铬装置来量化。在一个实施例中，铬材料是电致变色材料，例如紫精，其通过从第一颜色状态到第二颜色状态的光透射状态的颜色梯度变化。可以使用印刷的色彩梯度来帮助量化冲击力。在另一个实施方案中，铬装置包括热变色材料。

10. 发明授权

US07832096B2 Method for producing an organic substrate with integral thermal dissipation channels 失效
标题翻译：具有集成散热通道的有机基板的制造方法
公开(公告)号：US07832096B2
公开(公告)日：2010-11-16
申请号：US11774723
申请日：2007-07-09
申请人： Joseph Kuczynski , Arvind Kumar Sinha
发明人： Joseph Kuczynski , Arvind Kumar Sinha
IPC分类号： H05K3/02
CPC分类号： H05K1/0203 , H01L23/473 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/09701 , H01L2924/15311 , H05K1/0272 , H05K1/0366 , H05K3/3452 , H05K3/429 , H05K2201/064 , H05K2203/1394 , Y10T29/49126 , Y10T29/49128 , Y10T29/49156 , Y10T29/4935 , H01L2924/00
摘要： A chip module heat transfer apparatus includes one or more chips electronically connected to a module substrate by controlled collapse chip connection (C4) solder joints. The module substrate, which is preferably an FR-4 laminate or other organic substrate, has cut-out channels formed thereon. A permanent solder mask is laminated over the cut-out channels to form thermal dissipation channels, which are in fluid communication with input and output ports. The C4 solder joints include solder balls that electronically connect terminals on the chips to corresponding attach pads on the substrate that are exposed through the mask. The thermal dissipation channels extend along rows of attach pads. A cooling fluid, such as inert perfluorocarbon fluid, flows through the thermal dissipation channels to remove heat and to mitigate strain on the solder balls due to coefficient of thermal expansion (CTE) mismatch between the chips and the substrate.
摘要翻译：芯片模块传热装置包括一个或多个芯片，通过控制的崩溃芯片连接（C4）焊接点电连接到模块基板。优选为FR-4层叠体或其他有机基板的模块基板在其上形成有切口通道。永久性焊接掩模层叠在切口通道上以形成与输入和输出端口流体连通的散热通道。 C4焊点包括将芯片上的端子电连接到通过掩模暴露的衬底上相应的附接焊盘的焊球。散热通道沿连续焊盘排。诸如惰性全氟化碳流体之类的冷却流体由于散热通道而流过，以便由于芯片和衬底之间的热膨胀系数（CTE）不匹配而消除热量并减轻焊球上的应变。

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