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    • 4. 发明授权
    • Method of isolation for acoustic resonator device
    • 声谐振器装置的隔离方法
    • US07296329B1
    • 2007-11-20
    • US09497993
    • 2000-02-04
    • Bradley Paul BarberLinus Albert FetterMichael George Zierdt
    • Bradley Paul BarberLinus Albert FetterMichael George Zierdt
    • H04R17/00B05D5/12B44C1/22
    • H03H3/02H03H9/02118H03H9/172
    • A method of isolating piezoelectric thin film acoustic resonator devices to prevent laterally propagating waves generated by the device from leaving the device and/or interfering with adjacent devices or systems. Specifically, this isolation technique involves the manipulation or isolation of the piezoelectric material layer between the acoustic resonator devices, in an effort to limit the amount of acoustic energy which propagates in a lateral direction away from the device. In one aspect, at least a portion of the piezoelectric material not involved in signal transmission by transduction between RF and acoustic energy is removed from the device. In another aspect, the growth a piezoelectric material is limited to certain regions during fabrication of the device. In a further aspect, the crystal orientation of the piezoelectric material is disrupted or altered during device fabrication so as to form regions having excellent piezoelectric properties and regions exhibiting poor piezoelectric characteristics.
    • 隔离压电薄膜声谐振器装置以防止由装置产生的横向传播波离开装置和/或干扰相邻装置或系统的方法。 具体地说,这种隔离技术涉及在声谐振器件之间的压电材料层的操纵或隔离,以便限制在横向上远离器件传播的声能的量。 在一个方面,通过RF和声能之间的转换不涉及信号传输的压电材料的至少一部分被从器件中去除。 在另一方面,压电材料的生长在装置的制造期间被限制到某些区域。 在另一方面,在器件制造期间压电材料的晶体取向被破坏或改变,以便形成具有优异的压电性能的区域和表现出差的压电特性的区域。
    • 5. 发明授权
    • Method of isolation for acoustic resonator device
    • 声谐振器装置的隔离方法
    • US08631547B2
    • 2014-01-21
    • US11906196
    • 2007-10-01
    • Bradley Paul BarberLinus Albert FetterMichael George Zierdt
    • Bradley Paul BarberLinus Albert FetterMichael George Zierdt
    • H03H3/06H04R17/10
    • H03H3/02H03H9/02118H03H9/172
    • A method of isolating piezoelectric thin film acoustic resonator devices to prevent laterally propagating waves generated by the device from leaving the device and/or interfering with adjacent devices or systems. Specifically, this isolation technique involves the manipulation or isolation of the piezoelectric material layer between the acoustic resonator devices, in an effort to limit the amount of acoustic energy which propagates in a lateral direction away from the device. In one aspect, at least a portion of the piezoelectric material not involved in signal transmission by transduction between RF and acoustic energy is removed from the device. In another aspect, the growth a piezoelectric material is limited to certain regions during fabrication of the device. In a further aspect, the crystal orientation of the piezoelectric material is disrupted or altered during device fabrication so as to form regions having excellent piezoelectric properties and regions exhibiting poor piezoelectric characteristics.
    • 隔离压电薄膜声谐振器装置以防止由装置产生的横向传播波离开装置和/或干扰相邻装置或系统的方法。 具体地说,这种隔离技术涉及在声谐振器件之间的压电材料层的操纵或隔离,以便限制在横向上远离器件传播的声能的量。 在一个方面,通过RF和声能之间的转换不涉及信号传输的压电材料的至少一部分被从器件中去除。 在另一方面,压电材料的生长在装置的制造期间被限制到某些区域。 在另一方面,在器件制造期间压电材料的晶体取向被破坏或改变,以便形成具有优异的压电性能的区域和表现出差的压电特性的区域。
    • 7. 发明授权
    • Acoustic mirror materials for acoustic devices
    • 用于声学设备的声镜材料
    • US06603241B1
    • 2003-08-05
    • US09576807
    • 2000-05-23
    • Bradley Paul BarberHarold Alexis HugginsRonald Eugene MillerDonald Winslow MurphyYiu-Huen Wong
    • Bradley Paul BarberHarold Alexis HugginsRonald Eugene MillerDonald Winslow MurphyYiu-Huen Wong
    • H03H925
    • H03H9/175
    • A reflector stack or acoustic mirror arrangement for an acoustic device is described which may attain the highest possible impedance mismatch between alternating higher and lower impedance reflecting layers of the stack, so as to maximize bandwidth. The arrangement may also reduce manufacturing costs by requiring fewer layers for the device, as compared to conventional acoustic mirrors. The thinner reflecting stack is accordingly fabricated in reduced time to lower cost, by incorporating materials providing a larger acoustic impedance mismatch than those currently obtainable. The bandwidth of the resulting acoustic resonator device may be widened, particularly when a low density material such as aerogel, CVD SiO2 and/or sputter deposited SiO2 is applied as topmost layer in the reflector stack/acoustic mirror arrangement of the device.
    • 描述了用于声学装置的反射器叠层或声镜装置,其可以在堆叠的交替的较高和较低阻抗反射层之间达到最高可能的阻抗失配,从而最大化带宽。 与传统的声反射镜相比,该装置还可以通过要求较少的器件层来降低制造成本。 因此,通过结合提供比目前可获得的更大的声阻抗失配的材料,减少了较薄的反射叠层,从而降低了成本。 特别是当诸如气凝胶,CVD SiO 2和/或溅射沉积的SiO 2之类的低密度材料作为装置的反射器叠层/声镜装置中的最顶层被施加时,所得到的声共振器装置的带宽可能变宽。