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1. 发明授权

US08267632B2 Semiconductor manufacturing process modules 有权
标题翻译：半导体制造工艺模块
公开(公告)号：US08267632B2
公开(公告)日：2012-09-18
申请号：US11876876
申请日：2007-10-23
申请人： Peter van der Meulen , Christopher C Kiley , Patrick D. Pannese
发明人： Peter van der Meulen , Christopher C Kiley , Patrick D. Pannese
IPC分类号： H01L21/677
CPC分类号： H01L21/67184 , H01L21/67161 , H01L21/6719
摘要： A system for processing semiconductor wafers including a plurality of robotic facilities serially joined to each other to form a substantially linear transport chamber through which wafers can be transferred from each facility, wherein the substantially linear transport chamber is sealed to hold a controlled atmosphere and each of the plurality of robotic facilities includes at least one scara robot having three arm links serially coupled to one another and having a substrate holder rotatably coupled at a distal end of the three arm links, the plurality of robot facilities being configured to effect the transfer of wafers through the substantially linear transport chamber via handoff a wafer between neighboring scara robots, and a multi-entry process module coupled to at least one of the plurality of robotic facilities, where each entry of the multi-entry process module is accessed by the at least one of the at least one scara robot.
摘要翻译：一种用于处理半导体晶片的系统，其包括彼此串联连接的多个机器人设备，以形成基本上线性的输送室，通过该输送室可以从每个设备转移晶片，其中基本上线性的输送室被密封以保持受控气氛，所述多个机器人设备包括至少一个scara机器人，其具有彼此串联连接的三个臂链节，并且具有可旋转地联接在所述三个臂链节的远端处的衬底保持架，所述多个机器人设备被配置为实现晶片的转移通过在相邻的scara机器人之间切换晶片并且耦合到多个机器人设施中的至少一个的多入口处理模块，其中多进入处理模块的每个条目至少被访问至少至少一个scara机器人之一。

2. 发明申请

US20080219810A1 SEMICONDUCTOR MANUFACTURING PROCESS MODULES 审中-公开
公开(公告)号：US20080219810A1
公开(公告)日：2008-09-11
申请号：US11876886
申请日：2007-10-23
申请人： Peter van der Meulen , Christopher C. Kiley , Patrick D. Pannese
发明人： Peter van der Meulen , Christopher C. Kiley , Patrick D. Pannese
IPC分类号： H01L21/677
CPC分类号： H01L21/67184 , H01L21/67161 , H01L21/6719
摘要： A variety of process modules are described for use in semiconductor manufacturing processes.

3. 发明申请

US20080187417A1 SEMICONDUCTOR WAFER HANDLING AND TRANSPORT 有权
公开(公告)号：US20080187417A1
公开(公告)日：2008-08-07
申请号：US12025477
申请日：2008-02-04
申请人： Peter van der Meulen , Christopher C Kiley , Patrick D. Pannese , Raymond S. Ritter , Thomas A. Schaefer
发明人： Peter van der Meulen , Christopher C Kiley , Patrick D. Pannese , Raymond S. Ritter , Thomas A. Schaefer
IPC分类号： H01L21/67
CPC分类号： B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68792 , Y10S414/139
摘要： Modular wafer transport and handling facilities are combined in a variety of ways deliver greater levels of flexibility, utility, efficiency, and functionality in a vacuum semiconductor processing system. Various processing and other modules may be interconnected with tunnel-and-cart transportation systems to extend the distance and versatility of the vacuum environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster processing cells, and the like are incorporated to expand functionality and improve processing efficiency.

4. 发明申请

US20080124196A1 SEMICONDUCTOR MANUFACTURING PROCESS MODULES 审中-公开
公开(公告)号：US20080124196A1
公开(公告)日：2008-05-29
申请号：US11876910
申请日：2007-10-23
申请人： Peter van der Meulen , Christopher C. Kiley , Patrick D. Pannese
发明人： Peter van der Meulen , Christopher C. Kiley , Patrick D. Pannese
IPC分类号： H01L21/677
CPC分类号： H01L21/67748 , B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/6719 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67772 , H01L21/68792
摘要： A variety of process modules are described for use in semiconductor manufacturing processes.

5. 发明授权

US5954472A Batch loader arm 失效
标题翻译：批量装载机臂
公开(公告)号：US5954472A
公开(公告)日：1999-09-21
申请号：US679845
申请日：1996-07-15
申请人： Christopher A. Hofmeister , Christopher C. Kiley
发明人： Christopher A. Hofmeister , Christopher C. Kiley
IPC分类号： B25J9/06 , B25J9/10 , H01L21/677 , B66C23/00
CPC分类号： H01L21/67766 , B25J9/106 , H01L21/67781 , Y10S414/137 , Y10T74/20323
摘要： The invention resides in an improved transport mechanism which utilizes a linkage having a plurality of end effectors disposed at one end thereof. Movement of a drive linkage in a first rotational direction causes opposite rotation at the end effectors so that the center of the articles carried by the end effectors are moved in a straight line path as between first and second locations.
摘要翻译：本发明在于一种改进的运输机构，其使用具有设置在其一端的多个端部执行器的连杆。驱动联动装置在第一旋转方向上的移动在末端执行器处引起相反的旋转，使得由末端执行器承载的物品的中心在第一和第二位置之间沿直线路径移动。

6. 发明授权

US08602716B2 Semiconductor manufacturing process modules 有权
标题翻译：半导体制造工艺模块
公开(公告)号：US08602716B2
公开(公告)日：2013-12-10
申请号：US11876896
申请日：2007-10-23
申请人： Peter van der Meulen , Christopher C Kiley , Patrick D. Pannese
发明人： Peter van der Meulen , Christopher C Kiley , Patrick D. Pannese
IPC分类号： B65G1/00
CPC分类号： H01L21/67184 , H01L21/67161 , H01L21/6719
摘要： A method is provided where the method includes configuring a plurality of robots so that a wafer can be handed off between neighboring robots, and disposing a plurality of sensors so that a robotic arm-relative position of a wafer that is transported by a robot is determined from sensor outputs by moving the wafer through a retract, rotate, and extend path.
摘要翻译：提供了一种方法，其中所述方法包括配置多个机器人，使得可以在相邻机器人之间切换晶片，并且设置多个传感器，使得确定由机器人传送的晶片的机器人臂相对位置从传感器输出通过移动晶片通过缩回，旋转和延伸路径。

7. 发明授权

US08253948B2 Wafer center finding with charge-coupled devices 有权
公开(公告)号：US08253948B2
公开(公告)日：2012-08-28
申请号：US13406252
申请日：2012-02-27
申请人： Christopher C. Kiley , Peter van der Meulen , Forrest T. Buzan , Paul E. Fogel
发明人： Christopher C. Kiley , Peter van der Meulen , Forrest T. Buzan , Paul E. Fogel
IPC分类号： G01B11/14
CPC分类号： B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68792 , Y10S414/139
摘要： A device for handling a substantially circular wafer is provided. The device includes an interior accessible through a plurality of entrances, and a plurality of sensors consisting of two sensors for each one of the plurality of entrances, each sensor capable of detecting a presence of the substantially circular wafer, at a predetermined location within the interior, wherein the plurality of sensors are arranged so that at least two of the plurality of sensors detect the wafer for any position of the wafer entirely within the interior, wherein a first one of the two sensors is positioned to detect the wafer when the wafer has passed entirely into the interior through one of the plurality of entrances, and a second one of the two sensors is positioned immediately outside a diameter of the wafer when the wafer has passed entirely into the interior through one of the plurality of entrances.

8. 发明授权

US08197177B2 Semiconductor wafer handling and transport 有权
标题翻译：半导体晶圆处理和运输
公开(公告)号：US08197177B2
公开(公告)日：2012-06-12
申请号：US12025541
申请日：2008-02-04
申请人： Peter van der Meulen , Christopher C Kiley , Patrick D. Pannese , Raymond S. Ritter , Thomas A. Schaefer
发明人： Peter van der Meulen , Christopher C Kiley , Patrick D. Pannese , Raymond S. Ritter , Thomas A. Schaefer
IPC分类号： H01L21/306
CPC分类号： B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68792 , Y10S414/139
摘要： Modular wafer transport and handling facilities are combined in a variety of ways deliver greater levels of flexibility, utility, efficiency, and functionality in a vacuum semiconductor processing system. Various processing and other modules may be interconnected with tunnel-and-cart transportation systems to extend the distance and versatility of the vacuum environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster processing cells, and the like are incorporated to expand functionality and improve processing efficiency.
摘要翻译：模块化晶片输送和处理设备以各种方式组合，在真空半导体处理系统中提供更高水平的灵活性，效用，效率和功能。各种加工和其他模块可以与隧道和车辆运输系统相互连接，以延长真空环境的距离和通用性。引入诸如旁路热调节器，缓冲对准器，批处理，多功能模块，低粒子通风口，集束处理单元等的其它改进以扩展功能并提高处理效率。

9. 发明授权

US08125652B2 Wafer center finding with charge-coupled devices 有权
标题翻译：晶圆中心寻找与电荷耦合器件
公开(公告)号：US08125652B2
公开(公告)日：2012-02-28
申请号：US12977514
申请日：2010-12-23
申请人： Paul E. Fogel , Peter van der Meulen , Forrest T. Buzan , Christopher C. Kiley
发明人： Paul E. Fogel , Peter van der Meulen , Forrest T. Buzan , Christopher C. Kiley
IPC分类号： G01B11/14
CPC分类号： H01L21/67265 , B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68792 , Y10S414/129 , Y10S414/136
摘要： A device for handling a substantially circular wafer is provided. The device includes an interior accessible through a plurality of entrances, and a plurality of sensors consisting of two sensors for each one of the plurality of entrances, each sensor capable of detecting a presence of the substantially circular wafer, at a predetermined location within the interior, wherein the plurality of sensors are arranged so that at least two of the plurality of sensors detect the wafer for any position of the wafer entirely within the interior, wherein a first one of the two sensors is positioned to detect the wafer when the wafer has passed entirely into the interior through one of the plurality of entrances, and a second one of the two sensors is positioned immediately outside a diameter of the wafer when the wafer has passed entirely into the interior through one of the plurality of entrances.
摘要翻译：提供了一种用于处理基本圆形晶片的装置。该装置包括可通过多个入口访问的内部，以及由多个入口中的每一个入口的两个传感器组成的多个传感器，每个传感器能够在内部的预定位置处检测基本圆形的晶片的存在，其中所述多个传感器被布置成使得所述多个传感器中的至少两个传感器在所述内部中完全检测所述晶片的任何位置的晶片，其中所述两个传感器中的第一传感器定位成当所述晶片具有通过多个入口中的一个完全通过内部，并且当晶片已经通过多个入口之一完全通过内部时，两个传感器中的第二个位于晶片直径的正上方。

10. 发明申请

US20100324732A1 WAFER CENTER FINDING WITH A KALMAN FILTER 有权
标题翻译：用KALMAN过滤器发现WAFER CENTER
公开(公告)号：US20100324732A1
公开(公告)日：2010-12-23
申请号：US12875462
申请日：2010-09-03
申请人： Christopher C. Kiley , Peter van der Meulen , Forrest T. Buzan , Paul E. Fogel
发明人： Christopher C. Kiley , Peter van der Meulen , Forrest T. Buzan , Paul E. Fogel
IPC分类号： H01L21/68 , G06F19/00
CPC分类号： H01L21/67265 , B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68792 , Y10S414/129 , Y10S414/136
摘要： A device is provided having a robotic arm for handling a wafer, the robotic arm including one or more encoders that provide encoder data identifying a position of one or more components of the robotic arm. The device also having a processor adapted to apply an extended Kalman Filter to the encoder data to estimate a position of the wafer.
摘要翻译：提供一种具有用于处理晶片的机器人手臂的装置，所述机器人臂包括一个或多个编码器，所述编码器提供识别所述机器人臂的一个或多个部件的位置的编码器数据。该装置还具有适于将扩展卡尔曼滤波器应用于编码器数据以估计晶片的位置的处理器。

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