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    • 4. 发明授权
    • High numerical aperture optical focusing device for use in data storage systems
    • 用于数据存储系统的高数值孔径光学聚焦装置
    • US06185051B2
    • 2001-02-06
    • US09338785
    • 1999-06-23
    • Hong ChenChuan HeCharles C. K. ChengJoseph J. Miceli, Jr.
    • Hong ChenChuan HeCharles C. K. ChengJoseph J. Miceli, Jr.
    • G02B1318
    • B82Y10/00G11B7/122G11B7/1374G11B7/1387G11B11/10534G11B11/10543G11B11/10554G11B11/1058G11B2007/13725
    • A near-field optical or MO data storage system uses an optical focusing device for focusing an incident optical beam to a small size focal spot. The optical focusing device includes an optically transmissive body which is defined by a generally flat incident surface, a flat, bottom surface disposed opposite and parallel to the incident surface, and a reflective side coated with a reflective layer for reflecting the optical beam through the body toward the bottom surface. The bottom surface defines a focal plane on which the focal spot is formed, for generating a localized evanescent field. The focal spot is located along a central axis P, in very close proximity to the data storage disk, such that the localized evanescent field interacts with the disk, for enabling data to be transduced to and from the disk by effecting near field coupling. An electro-magnetic coil or coil assembly, can optionally be formed on the bottom surface, co-axially with the focal spot, for generating a desired write magnetic field. The reflective side of the optical focusing device preferably has a parabola shaped curvature, but other shapes can alternatively be selected. For example, the side curvature can have a tilted parabola shape.
    • 近场光学或MO数据存储系统使用光聚焦装置将入射光束聚焦到小尺寸焦点。 该光学聚焦装置包括光学透射体,其由大致平坦的入射表面,与入射表面相对并平行设置的平坦的底表面限定,反射面涂覆有反射层,用于将光束反射通过本体 朝向底面。 底表面限定焦平面,焦平面形成在其上,用于产生局部渐逝场。 焦点沿着中心轴P位于数据存储盘非常接近处,使得局部的消逝场与磁盘相互作用,以通过进行近场耦合使数据能够被传送到磁盘。 电磁线圈或线圈组件可以可选地形成在底表面上,与焦斑同轴地形成,以产生所需的写入磁场。 光学聚焦装置的反射侧优选地具有抛物线形曲率,但是也可以选择其它形状。 例如,侧曲率可以具有倾斜的抛物线形状。
    • 5. 发明授权
    • Near field magneto-optical head made using wafer processing techniques
    • 使用晶片处理技术制造的近场磁光头
    • US6130779A
    • 2000-10-10
    • US111098
    • 1998-07-06
    • Carl J. CarlsonJoseph Miceli, Jr.Hong ChenChuan HeCharles C-K ChengRoss W Stovall
    • Carl J. CarlsonJoseph Miceli, Jr.Hong ChenChuan HeCharles C-K ChengRoss W Stovall
    • G02B5/18G11B7/135G11B7/22G11B11/105G11B7/00G11B5/27
    • G11B11/10554B82Y10/00G02B5/1876G02B5/1885G11B11/10532G11B7/1353G11B11/1058G11B7/22
    • The method of making and self-aligning a magneto-optical head at a wafer level is as follows: A flat optical substrate is molded or heat pressed in batches as a wafer level to form the desired lens shapes. Coil cavities or depressions are simultaneously formed with the lens to accommodate the coil assembly. Conductive plugs are formed in proximity to the cutting lines, for wire bonding attachment to the coil. The plugs are filled with a conductive material such as copper. The plugs do not extend through the entire depth of the optical wafer, thus further facilitating the mass production of the integrated heads. The slider body wafer is formed from silicon or other appropriate material. The slider body wafer and the lens/coil wafer are bonded. Coils and pedestals are formed on the lens / coil plate using thin-film processing techniques. Reflective surfaces are deposited on the bottom surface of the substrate, opposite the lens. The mirror material around the pedestal areas and plugs is masked and removed. An alumina layer is then deposited to define the air bearing surface and the pedestal. Yokes are then formed by means of lithography and plating in the base and sides of the depressions to assume a desired shape. A series of alternating insulating layers and conductive coil layers is formed. A protective layer seals the coil assembly, and is lapped to correct the lens thickness and to provide proper focal plane.
    • 在晶片级别制造和自动对准磁光头的方法如下:平板光学基板被成型或成批地热压成晶片级以形成所需的透镜形状。 线圈腔或凹陷部分与透镜同时形成以容纳线圈组件。 导电插塞形成在切割线附近,用于与线圈的引线接合。 塞子填充有诸如铜的导电材料。 插头不延伸穿过光学晶片的整个深度,从而进一步促进了集成头的批量生产。 滑块体晶片由硅或其它合适的材料形成。 滑块体晶片和透镜/线圈晶片接合。 使用薄膜加工技术在透镜/线圈板上形成线圈和基座。 反射表面沉积在基底的与透镜相对的底表面上。 底座区域和插头周围的镜子材料被遮蔽并移除。 然后沉积氧化铝层以限定空气轴承表面和基座。 然后通过在凹部的基部和侧面中的光刻和电镀形成轭以呈现期望的形状。 形成一系列交替绝缘层和导电线圈层。 保护层密封线圈组件,并且被研磨以校正透镜厚度并提供适当的焦平面。