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    • 1. 发明授权
    • Memory module and method having improved signal routing topology
    • 具有改进的信号路由拓扑的存储器模块和方法
    • US07557601B2
    • 2009-07-07
    • US11973684
    • 2007-10-09
    • George E. PaxRoy E. Greeff
    • George E. PaxRoy E. Greeff
    • H03K19/003
    • G11C5/04G11C5/025G11C5/063G11C11/409H05K1/025H05K1/181H05K2201/09254Y02P70/611
    • A registered memory module includes several memory devices coupled to a register through a plurality of transmission lines forming a symmetrical tree topology. The tree includes several branches each of which includes two transmission lines coupled only at its ends to either another transmission line or one of the memory devices. The branches are arranged in several layers of hierarchy, with the transmission lines in branches having the same hierarchy having the same length. Each transmission line preferably has a characteristic impedance that is half the characteristic impedance of any pair of downstream transmission lines to which it is coupled to provide impedance matching. A dedicated transmission line is used to couple an additional memory device, which may or may not be an error checking memory device, to the register.
    • 注册的存储器模块包括通过形成对称树形拓扑的多条传输线耦合到寄存器的多个存储器件。 树包括几个分支,每个分支包括仅在其端部耦合到另一个传输线或一个存储器件的两个传输线。 分支被布置成几层次,分支中的传输线具有相同长度的相同层级。 每个传输线优选地具有特性阻抗,其是与其耦合的任何一对下游传输线的特性阻抗的一半以提供阻抗匹配。 专用传输线用于将附加的存储器件(其可能是或可能不是错误检查存储器件)耦合到寄存器。
    • 2. 发明授权
    • Memory modules and methods for manufacturing memory modules
    • 用于制造内存模块的内存模块和方法
    • US07547213B2
    • 2009-06-16
    • US10927607
    • 2004-08-26
    • George E. Pax
    • George E. Pax
    • H01R13/60
    • H05K1/117H05K2201/09145H05K2201/094H05K2201/097
    • Memory modules and methods for manufacturing memory modules are disclosed herein. In one embodiment, a memory module includes a substrate, a microelectronic device carried by the substrate, and a plurality of external contact pads operably coupled to the microelectronic device. The substrate includes a first major surface with a first longitudinal edge and a second longitudinal edge. The external contact pads are disposed on the first major surface proximate to the second longitudinal edge. The contact pads include a first contact pad with a first end proximate to the second longitudinal edge and a second contact pad with a second end proximate to the second longitudinal edge. The first end is spaced apart from the first longitudinal edge by a first distance, and the second end is spaced apart from the first longitudinal edge by a second distance different than the first distance.
    • 本文公开了用于制造存储器模块的存储器模块和方法。 在一个实施例中,存储器模块包括衬底,由衬底承载的微电子器件以及可操作地耦合到微电子器件的多个外部接触焊盘。 衬底包括具有第一纵向边缘和第二纵向边缘的第一主表面。 外部接触垫设置在靠近第二纵向边缘的第一主表面上。 接触焊盘包括第一接触垫,其具有靠近第二纵向边缘的第一端和第二接触垫,第二接触垫具有靠近第二纵向边缘的第二端。 第一端部与第一纵向边缘间隔开第一距离,并且第二端部与第一纵向边缘间隔开与第一距离不同的第二距离。