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    • 7. 发明申请
    • High Performance RF Rx Module
    • 高性能射频接收模块
    • US20100289599A1
    • 2010-11-18
    • US12778304
    • 2010-05-12
    • Thomas KnechtGlen ReeserReddy Vangala
    • Thomas KnechtGlen ReeserReddy Vangala
    • H03H7/48
    • H04B1/40H01L23/66H01L2924/0002H01L2924/00
    • An RF module for use in an RF signal transceiver system. In one embodiment, the RF module comprises a substrate having at least a duplexer filter, first and second bandpass filters and first and second low noise amplifiers mounted thereon. The substrate includes respective edges having respective RF signal input/output and supply voltage terminals defined therein. The overall dimensions of the substrate and/or the location of the respective terminals have been predetermined in a manner which allows the same size substrate with the same terminal locations to be used for several different air interfaces such as, for example, EGSM, GSM 850, DCS, and PCS applications, irrespective of a specific air interface need for differently sized and/or additional filters.
    • 用于RF信号收发系统的RF模块。 在一个实施例中,RF模块包括至少具有双工器滤波器,第一和第二带通滤波器以及安装在其上的第一和第二低噪声放大器的衬底。 衬底包括具有各自的RF信号输入/输出和限定在其中的电源电压端子的边缘。 衬底的总体尺寸和/或各个端子的位置已经以允许具有相同端子位置的相同尺寸的衬底用于几个不同的空气界面的方式被预先确定,例如EGSM,GSM 850 ,DCS和PCS应用程序,而不考虑不同尺寸和/或附加过滤器的特定空中接口需求。
    • 8. 发明申请
    • Low frequency ball grid array resonator
    • 低频球栅阵列谐振器
    • US20090236134A1
    • 2009-09-24
    • US12381692
    • 2009-03-16
    • Thomas A. KnechtGlen Reeser
    • Thomas A. KnechtGlen Reeser
    • H05K1/16
    • H05K1/0243H01P7/082H01P7/084H05K3/3436H05K2201/10068
    • A ball grid array resonator for use as, for example, a high “Q” inductive element in the tank circuit of a voltage controlled oscillator. The resonator comprises a ceramic substrate including opposed top and bottom surfaces, each having a continuous strip of conductive material formed thereon and, in one embodiment, at least two conductive vias which extend through the substrate and electrically interconnect the respective strips of conductive material to define a continuous and elongate path or transmission line for an RF signal. The respective strips of conductive material may be spiral-shaped, hook-shaped, serpentine-shaped, or otherwise suitably shaped depending upon the desired application. Conductive balls/spheres on the bottom surface define RF signal input/output pads and ground pads adapted for electrical connection to the printed circuit board or substrate of, for example, a voltage controlled oscillator.
    • 一种球栅阵列谐振器,用作例如压控振荡器的电路中的高“Q”电感元件。 谐振器包括陶瓷衬底,其包括相对的顶表面和底表面,每个陶瓷衬底具有在其上形成的导电材料的连续条带,并且在一个实施例中,至少两个导电通孔延伸穿过衬底并电连接导电材料的各条带以限定 用于RF信号的连续且细长的路径或传输线。 相应的导电材料条可以是螺旋形的,钩形的,蛇形的,或者根据所需的应用适当地成形。 底表面上的导电球/球体限定RF信号输入/输出焊盘和适于与例如压控振荡器的印刷电路板或基板电连接的接地焊盘。
    • 10. 发明申请
    • Ball grid array filter
    • 球栅阵列滤波器
    • US20070109076A1
    • 2007-05-17
    • US11598320
    • 2006-11-13
    • Thomas KnechtGlen ReeserReddy VangalaDamon Niswonger
    • Thomas KnechtGlen ReeserReddy VangalaDamon Niswonger
    • H01P1/203
    • H01P1/20345H01P1/20336H05K1/0243H05K3/3436
    • A ball grid array ceramic filter including a substrate having a ground layer of conductive material disposed over one of the surfaces thereof and a plurality of strips of conductive material on the other of the substrate surfaces defining resonators adapted to receive and pass RF signals. A plurality of vias extend through the substrate and define opposed ends terminating in the respective substrate surfaces. In one embodiment, a plurality of conductive spheres defining respective ground and RF signal input/output pads are disposed on the substrate surface with the ground layer thereon. Certain of the vias couple the resonators to the ground layer while others of the vias couple the resonators to respective spheres adapted for coupling to the respective RF signal input/output contacts on the top surface of a printed circuit board to which the filter is adapted to be direct surface mounted.
    • 一种球栅阵列陶瓷滤波器,包括具有布置在其一个表面上的导电材料的接地层的衬底和在另一个衬底表面上的多个导电材料条,其限定适于接收和传递RF信号的谐振器。 多个通孔延伸穿过基板并且限定相对的端部终止于相应的基板表面。 在一个实施例中,限定各自的接地和RF信号输入/输出焊盘的多个导电球设置在其上的接地层的衬底表面上。 通孔中的某些通孔将谐振器耦合到接地层,而其他通孔将谐振器耦合到适于耦合到印刷电路板的顶部表面上的相应RF信号输入/输出触点的相应球体,滤波器适用于 直接表面安装。