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1. 发明授权

US06191934B1 High dielectric constant embedded capacitors 有权
标题翻译：高介电常数埋入式电容器
公开(公告)号：US06191934B1
公开(公告)日：2001-02-20
申请号：US09211668
申请日：1998-12-14
申请人： Michael James Liberatore , Attiganal Narayanaswamy Sreeram , Ashok Narayan Prabhu , In-Tae Kim , Je-Do Mun , Sung-Dae Park , Yun-Hwi Park , Joo-Dong Yu , Ellen S. Tormey
发明人： Michael James Liberatore , Attiganal Narayanaswamy Sreeram , Ashok Narayan Prabhu , In-Tae Kim , Je-Do Mun , Sung-Dae Park , Yun-Hwi Park , Joo-Dong Yu , Ellen S. Tormey
IPC分类号： H01G406
CPC分类号： H01F41/046 , C04B35/265 , C04B35/497 , H01F1/0027 , H01F17/0006 , H01F41/042 , H01F41/043 , H01G4/1254 , H01G4/30 , H05K1/0306 , H05K1/165
摘要： High dielectric constant capacitors are made from a dielectric ink of lead-magnesium-niobate and lead oxide powders. Dielectric inks are made by mixing the dielectric powders with a suitable organic vehicle which can be used to coat one or more glass-based green tapes. Buried capacitors are made by coating an overlying and an underlying green tape with a conductor such as silver. Capacitors can also be made by adjusting the organic vehicle and forming a green tape from the dielectric powders. These dielectric green tapes each can be coated with a conductive layer and stacked, the conductive layers connected in parallel. The resultant multilayer capacitors have a very high dielectric constant, while eliminating the need for very large area capacitors, as compared to single layer capacitors.
摘要翻译：高介电常数电容器由铌酸铅镁矾土和氧化铅粉末的电介质油墨制成。电介质油墨通过将介电粉末与可用于涂覆一种或多种基于玻璃的生胶带的合适的有机载体混合来制备。埋入式电容器是通过用诸如银的导体涂覆上覆的和下面的生胶带制成的。电容器也可以通过调节有机载体并从电介质粉末形成绿色带制成。这些电介质绿带可以涂覆有导电层并堆叠，导电层并联连接。与单层电容器相比，所得的多层电容器具有非常高的介电常数，同时不需要非常大的面积电容器。

2. 发明授权

US07723852B1 Stacked semiconductor package and method of making same 有权
标题翻译：堆叠式半导体封装及其制作方法
公开(公告)号：US07723852B1
公开(公告)日：2010-05-25
申请号：US12017266
申请日：2008-01-21
申请人： Yoon Joo Kim , In Tae Kim , Ji Young Chung , Bong Chan Kim , Do Hyung Kim , Sung Chul Ha , Sung Min Lee , Jae Kyu Song
发明人： Yoon Joo Kim , In Tae Kim , Ji Young Chung , Bong Chan Kim , Do Hyung Kim , Sung Chul Ha , Sung Min Lee , Jae Kyu Song
IPC分类号： H01L23/48
CPC分类号： H01L24/27 , H01L23/3128 , H01L23/3135 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/0652 , H01L25/0657 , H01L2224/29101 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/48465 , H01L2224/73215 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/838 , H01L2224/85447 , H01L2224/92 , H01L2224/92247 , H01L2225/0651 , H01L2225/06565 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： In accordance with the present invention, there is provided multiple embodiments of a semiconductor package including two or more semiconductor dies which are electrically connected to an underlying substrate through the use of conductive wires, some of which may be fully or partially encapsulated by an adhesive or insulating layer of the package. In a basic embodiment of the present invention, the semiconductor package comprises a substrate having a conductive pattern disposed thereon. Electrically connected to the conductive pattern of the substrate are first and second semiconductor dies. The first semiconductor die and a portion of the substrate are covered by an adhesive layer. The second semiconductor die, the adhesive layer and a portion of the substrate are in turn covered by a package body of the semiconductor package.
摘要翻译：根据本发明，提供了包括两个或更多个半导体管芯的半导体封装的多个实施例，所述半导体管芯通过使用导电线电连接到下面的衬底，其中一些可以被粘合剂完全或部分封装，绝缘层包装。在本发明的基本实施例中，半导体封装包括其上布置有导电图案的衬底。电连接到衬底的导电图案是第一和第二半导体管芯。第一半导体管芯和衬底的一部分被粘合剂层覆盖。第二半导体管芯，粘合剂层和衬底的一部分又由半导体封装的封装主体覆盖。

3. 发明申请

US20090139444A1 CZOCHRALSKI APPARATUS FOR GROWING CRYSTALS AND PURIFICATION METHOD OF WASTE SALTS USING THE SAME 有权
标题翻译：用于生长晶体的方法和使用其的废物的纯化方法
公开(公告)号：US20090139444A1
公开(公告)日：2009-06-04
申请号：US12062463
申请日：2008-04-03
申请人： Jong-Hyeon Lee , Han-Soo Lee , In-Tae Kim , Yoon-Sang Lee , Eung-Ho Kim
发明人： Jong-Hyeon Lee , Han-Soo Lee , In-Tae Kim , Yoon-Sang Lee , Eung-Ho Kim
IPC分类号： C30B15/08
CPC分类号： C30B29/12 , C30B15/00 , Y10T117/10 , Y10T117/1072
摘要： Disclosed are a czochralski apparatus for growing crystals and a purification method of waste salts using the same. More particularly, the present invention provides a czochralski apparatus for growing crystals comprising screw thread for fixing salt crystals mounted on a pulling bar of the apparatus in order to prevent desorption of crystals caused by load thereof during a crystal growing process without requiring alternative seed crystals and, in addition, a method for purification of waste salts, which can isolate impurities from molten waste salts using a czochralski crystal growing process without alternative adsorption medium, does not generate secondary wastes and may continuously purify the waste salts.
摘要翻译：公开了用于生长晶体的切克萨斯基装置和使用其的废盐的净化方法。更具体地说，本发明提供了一种用于生长晶体的切克拉斯基装置，其包括用于固定安装在装置的拉杆上的盐晶的螺纹，以防止在晶体生长过程中由其负载引起的晶体的解吸，而不需要另外的晶种，此外，使用不含替代吸附介质的切克萨斯基晶体生长方法可以从熔融废盐中分离杂质的废盐的净化方法不会产生二次废物，并且可以连续净化废盐。

4. 发明授权

US6160469A Large value buried inductors in low temperature co-fired ceramic circuit boards 有权
标题翻译：低温共烧陶瓷电路板大值埋电感器
公开(公告)号：US6160469A
公开(公告)日：2000-12-12
申请号：US218862
申请日：1998-12-23
申请人： Michael James Liberatore , Leszek Hozer , Je-Do Mun , In-Tae Kim , Yun-Hwi Park , Hyun-Gyu Kang , Sung-Dae Park
发明人： Michael James Liberatore , Leszek Hozer , Je-Do Mun , In-Tae Kim , Yun-Hwi Park , Hyun-Gyu Kang , Sung-Dae Park
IPC分类号： H01F5/00 , C04B35/26 , C04B35/497 , C08K3/22 , C08L101/00 , H01F1/00 , H01F17/00 , H01F41/04 , H01G4/12 , H01G4/30 , H05K1/03 , H05K1/16 , H05K3/46 , H01F27/28
CPC分类号： H01F41/046 , C04B35/265 , C04B35/497 , H01F1/0027 , H01F17/0006 , H01F41/042 , H01F41/043 , H01G4/1254 , H01G4/30 , H05K1/0306 , H05K1/165
摘要： Large value embedded inductors are made by screen printing an inductor coil onto one or more ferrite tapes, and covering the ferrite tapes with one or more ferrite tape layer or layers. Low firing temperature green tapes surround the ferrite layer or layers. These green tapes can be expansion matched to gallium arsenide.
摘要翻译：通过将电感线圈丝网印刷到一个或多个铁氧体磁带上并用一个或多个铁氧体磁带层或层覆盖铁氧体磁带，制成大值嵌入式电感器。低烧结温度绿带围绕铁氧体层或层。这些绿色磁带可以与砷化镓扩展匹配。

5. 发明授权

US08876022B2 Droplet discharge head and droplet discharge apparatus 有权
标题翻译：滴液排放头和液滴排放装置
公开(公告)号：US08876022B2
公开(公告)日：2014-11-04
申请号：US12361633
申请日：2009-01-29
申请人： In-Tae Kim , Geunbae Lim , Seong-Wan Kim
发明人： In-Tae Kim , Geunbae Lim , Seong-Wan Kim
IPC分类号： B05B7/06 , B05B7/08 , B05B1/02
CPC分类号： B05B7/0884 , B05B1/02 , B05B7/066 , B05B7/0861
摘要： The present invention relates to a droplet discharge apparatus that includes a nozzle for discharging a droplet from a tip thereof, and a discharge unit for injecting a gas toward the tip of the nozzle.
摘要翻译：液滴喷出装置技术领域本发明涉及一种液滴喷射装置，其特征在于，包括：喷嘴，用于从其顶端排出液滴;喷出单元，其用于向喷嘴的前端喷射气体。

6. 发明授权

US08674162B2 Method for preparing ceramic waste form containing radioactive rare-earth and transuranic oxide, and ceramic waste form with enhanced density, heat-stability, and leach resistance prepared by the same 有权
标题翻译：制备含有放射性稀土和超铀氧化物的陶瓷废物形式的方法，以及由其制备的具有增强的密度，热稳定性和耐浸性的陶瓷废物形式
公开(公告)号：US08674162B2
公开(公告)日：2014-03-18
申请号：US12813827
申请日：2010-06-11
申请人： Byung-Gil Ahn , Hwan-Seo Park , Hwan-young Kim , In-Tae Kim , Hansoo Lee
发明人： Byung-Gil Ahn , Hwan-Seo Park , Hwan-young Kim , In-Tae Kim , Hansoo Lee
IPC分类号： G21F9/00
CPC分类号： G21F9/16 , G21F9/305 , G21F9/34
摘要： Disclosed herein is a method for preparing a ceramic waste form containing radioactive rare-earth and transuranic oxide, and the ceramic waste form with enhanced density, heat-stability, and leach resistance prepared by the same.
摘要翻译：本文公开了一种制备含有放射性稀土和超铀氧化物的陶瓷废物形式的方法，以及由其制备的具有增强的密度，热稳定性和耐浸性的陶瓷废物形式。

7. 发明申请

US20100071408A1 METHOD OF RECYCLING LiCl SALT WASTES BY USING LAYER CRYSTALLIZATION AND APPARATUS FOR THE SAME 审中-公开
标题翻译：利用层状结晶回收LiCl盐类废物的方法及其设备
公开(公告)号：US20100071408A1
公开(公告)日：2010-03-25
申请号：US12500869
申请日：2009-07-10
申请人： Yung-Zun Cho , In-Tae Kim , Han-Soo Lee
发明人： Yung-Zun Cho , In-Tae Kim , Han-Soo Lee
IPC分类号： B01D9/04 , C02F1/22 , F25D23/00
CPC分类号： B01D9/0013 , B01D9/005
摘要： Disclosed herein are a method of recycling LiCl salt wastes comprising radionuclides and an apparatus using the same. The method includes a) solidifying a LiCl salt contained in the LiCl salt wastes and contacting the outer wall of a housing, by charging a crystallizer comprising the housing having an internal accommodating space and an air cooler in the internal accommodating space into a crystallizing furnace accommodating the LiCl salt wastes comprising the radionuclides, and by cooling the housing to a temperature of two-phase region where the liquid state and the solid state of the LiCl salt waste coexist, b) separating the crystallizer where the LiCl salt is solidified from the crystallizing furnace, c) recycling the LiCl salt by heating the separated crystallizer to melt the solidified LiCl salt.
摘要翻译：本文公开了一种回收包含放射性核素的LiCl盐废物的方法和使用其的装置。该方法包括：将包含在LiCl盐废物中的LiCl盐固化并与壳体的外壁接触，通过将包含具有内部容纳空间的壳体和在内部容纳空间中的空气冷却器的结晶器装入容纳的结晶炉中包括放射性核素的LiCl盐废物，并且通过将壳体冷却至液体状态和LiCl盐废物的固体状态共存的两相区域的温度，b）将LiCl盐固化的结晶器从结晶炉，c）通过加热分离的结晶器来熔化固化的LiCl盐来回收LiCl盐。

8. 发明申请

US20090256002A1 DROPLET DISCHARGE HEAD AND DROPLET DISCHARGE APPARATUS 有权
标题翻译： DROPLET卸载头和卸料装置
公开(公告)号：US20090256002A1
公开(公告)日：2009-10-15
申请号：US12361633
申请日：2009-01-29
申请人： In-Tae Kim , Geunbae Lim , Seong-Wan Kim
发明人： In-Tae Kim , Geunbae Lim , Seong-Wan Kim
IPC分类号： B05B15/02
CPC分类号： B05B7/0884 , B05B1/02 , B05B7/066 , B05B7/0861
摘要： The present invention relates to a droplet discharge apparatus that includes a nozzle for discharging a droplet from a tip thereof, and a discharge unit for injecting a gas toward the tip of the nozzle.
摘要翻译：液滴喷出装置技术领域本发明涉及一种液滴喷射装置，其特征在于，包括：喷嘴，用于从其顶端排出液滴;喷出单元，其用于向喷嘴的前端喷射气体。

9. 发明授权

US09087618B2 Solidification method of radioactive waste accompanying chloride recycling or radioactive iodide removing and the device thereof 有权
标题翻译：伴随氯化物回收或放射性碘去除的放射性废物的固化方法及其装置
公开(公告)号：US09087618B2
公开(公告)日：2015-07-21
申请号：US13334941
申请日：2011-12-22
申请人： Hwan Seo Park , Byung-Gil Ahn , Hwan-Young Kim , In-Tae Kim , Yung-Zun Cho , Hansoo Lee
发明人： Hwan Seo Park , Byung-Gil Ahn , Hwan-Young Kim , In-Tae Kim , Yung-Zun Cho , Hansoo Lee
IPC分类号： G21F9/30 , C02F1/76
CPC分类号： G21F9/30 , C02F1/76 , G21F9/305
摘要： The present invention relates to a method and apparatus for solidifying radioactive waste accompanying chlorine recycling or radioactive iodine removal. The present invention provide a method and apparatus for treating radioactive waste composed of volatile metal halide with high corrosiveness at a high temperature through a solidifying system including crushing, mixing/dehalogenating and sintering. In the inventive method and apparatus for solidifying radioactive waste, a dechlorination process by using a dehalogenation material is performed on highly corrosive metal salt under an oxidizing atmosphere by using a method of controlling a temperature on the surface of a reactor, and solidification is carried out by removing radioactive iodine while reusing chlorine contained in an exhaust gas. Accordingly, the generated amount of total waste can be reduced, and therefore the inventive method and apparatus can be usefully used in preparing a solidified body with high durability.
摘要翻译：本发明涉及一种用于固化伴随氯再循环或放射性碘去除的放射性废物的方法和装置。本发明提供了一种用于通过包括破碎，混合/脱卤和烧结在内的固化系统在高温下高挥发性金属卤化物处理放射性废物的方法和装置。在本发明的放射性废物固化方法和装置中，通过使用控制反应器表面的温度的方法，在氧化性气氛下对高腐蚀性金属盐进行脱卤材料的脱氯工序，进行固化通过除去放射性碘，同时重复使用废气中所含的氯。因此，可以减少所产生的总废物量，因此本发明的方法和装置可有效地用于制备具有高耐久性的凝固体。

10. 发明授权

US07906855B1 Stacked semiconductor package and method of making same 有权
标题翻译：堆叠式半导体封装及其制作方法
公开(公告)号：US07906855B1
公开(公告)日：2011-03-15
申请号：US12758583
申请日：2010-04-12
申请人： Yoon Joo Kim , In Tae Kim , Ji Young Chung , Bong Chan Kim , Do Hyung Kim , Sung Chul Ha , Sung Min Lee , Jae Kyu Song
发明人： Yoon Joo Kim , In Tae Kim , Ji Young Chung , Bong Chan Kim , Do Hyung Kim , Sung Chul Ha , Sung Min Lee , Jae Kyu Song
IPC分类号： H01L23/48
CPC分类号： H01L24/27 , H01L23/3128 , H01L23/3135 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/0652 , H01L25/0657 , H01L2224/29101 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/48465 , H01L2224/73215 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/838 , H01L2224/85447 , H01L2224/92 , H01L2224/92247 , H01L2225/0651 , H01L2225/06565 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： In accordance with the present invention, there is provided multiple embodiments of a semiconductor package including two or more semiconductor dies which are electrically connected to an underlying substrate through the use of conductive wires, some of which may be fully or partially encapsulated by an adhesive or insulating layer of the package. In a basic embodiment of the present invention, the semiconductor package comprises a substrate having a conductive pattern disposed thereon. Electrically connected to the conductive pattern of the substrate are first and second semiconductor dies. The first semiconductor die and a portion of the substrate are covered by an adhesive layer. The second semiconductor die, the adhesive layer and a portion of the substrate are in turn covered by a package body of the semiconductor package.
摘要翻译：根据本发明，提供了包括两个或更多个半导体管芯的半导体封装的多个实施例，所述半导体管芯通过使用导电线电连接到下面的衬底，其中一些可以被粘合剂完全或部分封装，绝缘层包装。在本发明的基本实施例中，半导体封装包括其上布置有导电图案的衬底。电连接到衬底的导电图案是第一和第二半导体管芯。第一半导体管芯和衬底的一部分被粘合剂层覆盖。第二半导体管芯，粘合剂层和衬底的一部分又由半导体封装的封装主体覆盖。

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