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1. 发明授权

US09744070B2 Snoring prevention device 有权
公开(公告)号：US09744070B2
公开(公告)日：2017-08-29
申请号：US14419232
申请日：2013-08-01
申请人： Ji-Young Chung
发明人： Ji-Young Chung , Yeong-Chul Choi , Hye-Young Joung
IPC分类号： A61F5/56
CPC分类号： A61F5/566
摘要： A snoring prevention device is provided to be mounted in the mouth to prevent snoring during sleep, to reduce a volume of the device, and to improve a wearing feeling. The snoring prevention device includes an upper jaw mounting frame having an upper tooth insertion groove into which the upper teeth are inserted, and configured to be mounted on the upper jaw, a lower jaw mounting frame having a lower tooth insertion groove into which the lower teeth are inserted, and configured to be mounted on the lower jaw, and a lower jaw advance unit including a push rod provided at the upper jaw mounting frame at a portion of a center of the upper jaw corresponding to the front tooth side such that the lower jaw is advanced by pushing the lower jaw mounting frame forward when the upper jaw and the lower jaw are closed.

2. 发明授权

US07956453B1 Semiconductor package with patterning layer and method of making same 有权
标题翻译：具有图案层的半导体封装及其制造方法
公开(公告)号：US07956453B1
公开(公告)日：2011-06-07
申请号：US12015428
申请日：2008-01-16
申请人： Do Hyeong Kim , Bong Chan Kim , Yoon Joo Kim , Ji Young Chung
发明人： Do Hyeong Kim , Bong Chan Kim , Yoon Joo Kim , Ji Young Chung
IPC分类号： H01L23/48 , H01L23/04
CPC分类号： H01L23/5389 , H01L23/3128 , H01L23/3135 , H01L23/481 , H01L23/49816 , H01L24/24 , H01L24/25 , H01L24/45 , H01L24/48 , H01L25/50 , H01L2224/05553 , H01L2224/24051 , H01L2224/24226 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73267 , H01L2224/92244 , H01L2225/0651 , H01L2225/06524 , H01L2225/06541 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10161 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： In accordance with the present invention, there is provided multiple embodiments of a semiconductor package including one or more semiconductor dies which are electrically connected to an underlying substrate through the use of a conductive pattern which is at least partially embedded in a patterning layer of the package. In a basic embodiment of the present invention, the semiconductor package comprises a substrate having a conductive pattern disposed thereon. Electrically connected to the conductive pattern of the substrate is at least one semiconductor die. The semiconductor die and the substrate are at least partially encapsulated by a patterning layer. Embedded in the patterning layer is a wiring pattern which electrically connects the semiconductor die to the conductive pattern. A portion of the wiring pattern is exposed in the patterning layer.
摘要翻译：根据本发明，提供了包括一个或多个半导体管芯的半导体封装的多个实施例，所述半导体管芯通过使用至少部分地嵌入在封装的图案化层中的导电图案电连接到下面的衬底。在本发明的基本实施例中，半导体封装包括其上布置有导电图案的衬底。电连接到衬底的导电图案是至少一个半导体管芯。半导体管芯和衬底被图案化层至少部分地封装。嵌入在图案化层中的是将半导体管芯与导电图案电连接的布线图案。布线图案的一部分在图案形成层中露出。

3. 发明授权

US07723852B1 Stacked semiconductor package and method of making same 有权
标题翻译：堆叠式半导体封装及其制作方法
公开(公告)号：US07723852B1
公开(公告)日：2010-05-25
申请号：US12017266
申请日：2008-01-21
申请人： Yoon Joo Kim , In Tae Kim , Ji Young Chung , Bong Chan Kim , Do Hyung Kim , Sung Chul Ha , Sung Min Lee , Jae Kyu Song
发明人： Yoon Joo Kim , In Tae Kim , Ji Young Chung , Bong Chan Kim , Do Hyung Kim , Sung Chul Ha , Sung Min Lee , Jae Kyu Song
IPC分类号： H01L23/48
CPC分类号： H01L24/27 , H01L23/3128 , H01L23/3135 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/0652 , H01L25/0657 , H01L2224/29101 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/48465 , H01L2224/73215 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/838 , H01L2224/85447 , H01L2224/92 , H01L2224/92247 , H01L2225/0651 , H01L2225/06565 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： In accordance with the present invention, there is provided multiple embodiments of a semiconductor package including two or more semiconductor dies which are electrically connected to an underlying substrate through the use of conductive wires, some of which may be fully or partially encapsulated by an adhesive or insulating layer of the package. In a basic embodiment of the present invention, the semiconductor package comprises a substrate having a conductive pattern disposed thereon. Electrically connected to the conductive pattern of the substrate are first and second semiconductor dies. The first semiconductor die and a portion of the substrate are covered by an adhesive layer. The second semiconductor die, the adhesive layer and a portion of the substrate are in turn covered by a package body of the semiconductor package.
摘要翻译：根据本发明，提供了包括两个或更多个半导体管芯的半导体封装的多个实施例，所述半导体管芯通过使用导电线电连接到下面的衬底，其中一些可以被粘合剂完全或部分封装，绝缘层包装。在本发明的基本实施例中，半导体封装包括其上布置有导电图案的衬底。电连接到衬底的导电图案是第一和第二半导体管芯。第一半导体管芯和衬底的一部分被粘合剂层覆盖。第二半导体管芯，粘合剂层和衬底的一部分又由半导体封装的封装主体覆盖。

4. 发明授权

US07718523B1 Solder attach film and method of forming solder ball using the same 有权
标题翻译：焊接附着膜及使用其形成焊球的方法
公开(公告)号：US07718523B1
公开(公告)日：2010-05-18
申请号：US11875597
申请日：2007-10-19
申请人： Min Yoo , Tae Seong Kim , Ji Young Chung
发明人： Min Yoo , Tae Seong Kim , Ji Young Chung
IPC分类号： H01L21/44
CPC分类号： H05K3/3478 , H01L21/4853 , H01L23/49816 , H01L24/11 , H01L24/13 , H01L24/48 , H01L24/73 , H01L24/94 , H01L2224/03828 , H01L2224/04042 , H01L2224/05001 , H01L2224/05026 , H01L2224/111 , H01L2224/114 , H01L2224/116 , H01L2224/13099 , H01L2224/13111 , H01L2224/16 , H01L2224/274 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48105 , H01L2224/48227 , H01L2224/48465 , H01L2224/48471 , H01L2224/73265 , H01L2924/0001 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/15311 , H01L2924/181 , H01L2924/18165 , H05K2201/10734 , H05K2203/033 , H05K2203/043 , H05K2203/0485 , H01L2924/00012 , H01L2924/00 , H01L2924/01083 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A solder attach film includes a first cover film, a flux layer, a solder layer, and a second cover film, and it can be treated or kept in a roll shape. A solder ball forming method using the solder attach film includes preparing a semiconductor package or a semiconductor die, adhering the solder attach film, gridding, and reflowing. In the solder attach film adhering operation, the first cover film and the second cover film are removed, and the flux layer is adhered to electrically conductive pads of the semiconductor package or the semiconductor die. Subsequently, in the reflowing operation, the flux layer is volatilized and removed, and the solder layer is fused and fixed to the electrically conductive pads, so that solder balls are formed.
摘要翻译：焊接附着膜包括第一覆盖膜，焊剂层，焊料层和第二覆盖膜，并且其可以被处理或保持为辊状。使用焊料附着膜的焊球形成方法包括制备半导体封装或半导体管芯，粘附焊料附着膜，网格化和回流。在焊料附着膜附着操作中，去除第一覆盖膜和第二覆盖膜，并且将焊剂层粘附到半导体封装或半导体管芯的导电焊盘。随后，在回流操作中，磁通层被挥发除去，焊料层被熔融固定在导电焊盘上，从而形成焊球。

5. 发明申请

US20090032947A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20090032947A1
公开(公告)日：2009-02-05
申请号：US11832571
申请日：2007-08-01
申请人： Seok Ho Na , Jae Yun Kim , Yoon Joo Kim , Ji Young Chung
发明人： Seok Ho Na , Jae Yun Kim , Yoon Joo Kim , Ji Young Chung
IPC分类号： H01L23/48 , H01L21/00
CPC分类号： H01L24/85 , H01L23/3128 , H01L23/49838 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/78 , H01L24/83 , H01L2224/0401 , H01L2224/04042 , H01L2224/05624 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/4809 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/48465 , H01L2224/48471 , H01L2224/48475 , H01L2224/4848 , H01L2224/48482 , H01L2224/48483 , H01L2224/48487 , H01L2224/48499 , H01L2224/48624 , H01L2224/48824 , H01L2224/73265 , H01L2224/78301 , H01L2224/83 , H01L2224/85051 , H01L2224/85181 , H01L2224/859 , H01L2224/85986 , H01L2224/92247 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01058 , H01L2924/01079 , H01L2924/01082 , H01L2924/01202 , H01L2924/01203 , H01L2924/01327 , H01L2924/014 , H01L2924/15311 , H01L2924/15313 , H01L2924/181 , H01L2924/00014 , H01L2924/01039 , H01L2924/01004 , H01L2924/00 , H01L2924/00012 , H01L2924/3512
摘要： A semiconductor device has a semiconductor die having at least one bond pad formed on a first surface thereof. A substrate has at least one bond finger formed on a first surface thereof. A second surface of the semiconductor die is attached to the first surface of the substrate. A conductive wire connects the bond pad of the semiconductor die and the bond finger of the substrate wherein at least one end of the conductive wire has a stack bump. An encapsulant is provided to encapsulate the semiconductor die and the conductive wire.
摘要翻译：半导体器件具有在其第一表面上形成有至少一个接合焊盘的半导体管芯。衬底在其第一表面上形成有至少一个键合指状物。半导体管芯的第二表面附接到基板的第一表面。导电线将半导体管芯的接合焊盘和衬底的接合指状物连接，其中导线的至少一端具有堆叠凸起。提供密封剂以封装半导体管芯和导线。

6. 发明授权

US07859107B1 Solder attach film and assembly 有权
标题翻译：焊接附着膜和组装
公开(公告)号：US07859107B1
公开(公告)日：2010-12-28
申请号：US12798412
申请日：2010-04-02
申请人： Min Yoo , Tae Seong Kim , Ji Young Chung
发明人： Min Yoo , Tae Seong Kim , Ji Young Chung
IPC分类号： H01L23/12
CPC分类号： H05K3/3478 , H01L21/4853 , H01L23/49816 , H01L24/11 , H01L24/13 , H01L24/48 , H01L24/73 , H01L24/94 , H01L2224/03828 , H01L2224/04042 , H01L2224/05001 , H01L2224/05026 , H01L2224/111 , H01L2224/114 , H01L2224/116 , H01L2224/13099 , H01L2224/13111 , H01L2224/16 , H01L2224/274 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48105 , H01L2224/48227 , H01L2224/48465 , H01L2224/48471 , H01L2224/73265 , H01L2924/0001 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/15311 , H01L2924/181 , H01L2924/18165 , H05K2201/10734 , H05K2203/033 , H05K2203/043 , H05K2203/0485 , H01L2924/00012 , H01L2924/00 , H01L2924/01083 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A solder attach film includes a first cover film, a flux layer, a solder layer, and a second cover film, and it can be treated or kept in a roll shape. A solder ball forming method using the solder attach film includes preparing a semiconductor package or a semiconductor die, adhering the solder attach film, gridding, and reflowing. In the solder attach film adhering operation, the first cover film and the second cover film are removed, and the flux layer is adhered to electrically conductive pads of the semiconductor package or the semiconductor die. Subsequently, in the reflowing operation, the flux layer is volatilized and removed, and the solder layer is fused and fixed to the electrically conductive pads, so that solder balls are formed.
摘要翻译：焊接附着膜包括第一覆盖膜，焊剂层，焊料层和第二覆盖膜，并且其可以被处理或保持为辊状。使用焊料附着膜的焊球形成方法包括制备半导体封装或半导体管芯，粘附焊料附着膜，网格化和回流。在焊料附着膜附着操作中，去除第一覆盖膜和第二覆盖膜，并且将焊剂层粘附到半导体封装或半导体管芯的导电焊盘。随后，在回流操作中，磁通层被挥发除去，焊料层被熔融固定在导电焊盘上，从而形成焊球。

7. 发明授权

US07170183B1 Wafer level stacked package 有权
标题翻译：晶圆级堆叠封装
公开(公告)号：US07170183B1
公开(公告)日：2007-01-30
申请号：US11128633
申请日：2005-05-13
申请人： Bong Chan Kim , Yoon Joo Kim , Ji Young Chung
发明人： Bong Chan Kim , Yoon Joo Kim , Ji Young Chung
IPC分类号： H01L23/48 , H01L23/31 , H05K3/34 , H05K1/14 , H01I23/13
CPC分类号： H01L25/0657 , H01L23/49575 , H01L2224/05567 , H01L2224/05573 , H01L2224/16 , H01L2225/06517 , H01L2225/06551 , H01L2225/06555 , H01L2225/06572 , H01L2225/06582 , H01L2924/00014 , H01L2924/01046 , H01L2924/01079 , H01L2224/05599
摘要： Disclosed are a wafer level stacked package and its manufacturing method. As one example, in such a wafer level stacked package, a first semiconductor die is electrically connected to an upper surface of a substrate and a second semiconductor die is electrically connected to a lower surface of the substrate. That is, with respect to one substrate, semiconductor dies can be stacked on upper and lower surfaces of the substrate. Also, underfill is formed between the respective semiconductor dies and the substrate, thereby enhancing bonding forces between the respective semiconductor dies and the substrate. In addition to stacking the semiconductor dies, packages can be stacked with each other. That is, it is possible to stack a plurality of completed wafer level packages with each other in an up-and-down direction.
摘要翻译：公开了一种晶片级堆叠封装及其制造方法。作为一个示例，在这种晶片级堆叠封装中，第一半导体管芯电连接到衬底的上表面，并且第二半导体管芯电连接到衬底的下表面。也就是说，相对于一个衬底，半导体管芯可以堆叠在衬底的上表面和下表面上。此外，在各个半导体管芯和衬底之间形成底部填料，从而增强了各个半导体管芯和衬底之间的结合力。除了堆叠半导体管芯之外，封装可以彼此堆叠。也就是说，可以在上下方向上堆叠多个完成的晶片级封装。

8. 发明申请

US20150216715A1 SNORING PREVENTION DEVICE 有权
标题翻译：防蛀装置
公开(公告)号：US20150216715A1
公开(公告)日：2015-08-06
申请号：US14419232
申请日：2013-08-01
申请人： Ji-Young CHUNG
发明人： Ji-Young Chung , Yeong-Chul Choi , Hye-Young Joung
IPC分类号： A61F5/56
CPC分类号： A61F5/566
摘要： Provided is a snoring prevention device provided to be mounted in the mouth to prevent snoring during sleep and provided to reduce a volume of the device and improve a wearing feeling.The snoring prevention device includes an upper jaw mounting frame having an upper tooth insertion groove into which the upper teeth are inserted, and configured to be mounted on the upper jaw, a lower jaw mounting frame having a lower tooth insertion groove into which the lower teeth are inserted, and configured to be mounted on the lower jaw, and a lower jaw advance unit including a push rod provided at the upper jaw mounting frame at a portion of a center of the upper jaw corresponding to the front tooth side such that the lower jaw is advanced by pushing the lower jaw mounting frame forward when the upper jaw and the lower jaw are closed.
摘要翻译：提供了一种打鼾防止装置，其被安装在口中以防止在睡眠期间打鼾并提供以减少装置的体积并改善佩戴感。打鼾防止装置包括具有上牙插入槽的上牙插入槽的上颌安装框架，上齿插入该上颌插入槽中，并构造成安装在上钳口上，下颌安装框架具有下齿插入槽，下齿并且构造成安装在下颚上，以及下夹爪前进单元，其包括设置在上钳口安装框架上的推杆，所述推杆在与所述前齿侧相对应的所述上钳口的中心部分处，使得所述下钳当上颚和下颚关闭时，通过向下推下颌骨安装架来提前颚。

9. 发明授权

US06888242B2 Color contacts for a semiconductor package 有权
标题翻译：半导体封装的彩色触点
公开(公告)号：US06888242B2
公开(公告)日：2005-05-03
申请号：US10437749
申请日：2003-05-14
申请人： Sang Hyun Ryu , Chan Yeok Park , Ji Young Chung
发明人： Sang Hyun Ryu , Chan Yeok Park , Ji Young Chung
IPC分类号： H01L21/60 , B23K3/06 , H01L21/48 , H01L21/607 , H01L23/485 , H01L23/488 , H01L23/49 , H01L23/498 , H01L23/544 , H05K1/02 , H05K3/34 , H05K7/10 , H01L23/04
CPC分类号： H05K1/0269 , B23K3/0623 , B23K2101/40 , H01L21/4853 , H01L23/49816 , H01L23/544 , H01L24/10 , H01L24/11 , H01L24/12 , H01L24/13 , H01L24/45 , H01L24/48 , H01L24/81 , H01L24/85 , H01L2223/5442 , H01L2223/54473 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/45693 , H01L2224/48 , H01L2224/8121 , H01L2224/81815 , H01L2224/85002 , H01L2224/85205 , H01L2224/85909 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12044 , H05K3/3436 , H05K7/1061 , H05K2201/10734 , H05K2203/041 , H05K2203/161 , H01L2924/00014 , H01L2924/00 , H01L2924/00015
摘要： The surface of a solder ball and a conductive wire for a semiconductor package are coated with a predetermined colorant. Various colorants may be used according to the diameter and metal composition of the solder ball and the conductive wire. The colorant is formed by mixing organic compound and dye of a predetermined color. Examples of organic compounds excellent in physicochemical bonding with metal include benzotriazole, alkylimidazole and benzimidazole. The solder ball is fabricated by coating an organic compound of a predetermined color on the surface of a typical solder ball. The conductive wire is fabricated by coating an organic compound of a predetermined color on a general conductive wire between heat process and winding. Moreover, the solder ball is evaporated in a reflowing step after bumped via flux and the conductive wire is evaporated in a wire bonding step so that the solder ball and the conductive wire return to their unique colors.
摘要翻译：用预定的着色剂涂覆焊球的表面和用于半导体封装的导线。可以根据焊球和导线的直径和金属组成使用各种着色剂。通过混合有机化合物和预定颜色的染料形成着色剂。具有与金属物理化学键合性优异的有机化合物的实例包括苯并三唑，烷基咪唑和苯并咪唑。焊球通过在典型的焊球的表面上涂覆预定颜色的有机化合物来制造。导线通过在热处理和绕组之间的一般导线上涂覆预定颜色的有机化合物来制造。此外，焊料球在通过焊剂撞击之后以回流步骤蒸发，并且导线在引线接合步骤中蒸发，使得焊球和导线恢复到其独特的颜色。

10. 外观设计

USD932627S1 Mandibular advancement device for anti snoring 有权
公开(公告)号：USD932627S1
公开(公告)日：2021-10-05
申请号：US29707803
申请日：2019-10-01
申请人： Ji-Young Chung
设计人： Ji-Young Chung

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