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    • 9. 发明授权
    • Contact planarization using nanoporous silica materials
    • 使用纳米多孔二氧化硅材料的接触平面化
    • US06797607B2
    • 2004-09-28
    • US10146007
    • 2001-10-26
    • Denis H. EndischJames S. Drage
    • Denis H. EndischJames S. Drage
    • H01L214763
    • B82Y10/00B82Y40/00G03F7/0002H01L21/31051
    • A process for forming a substantially planarized nanoporous dielectric silica coating on a substrate suitable for preparing a semiconductor device, and semiconductor devices produced by the methods of the invention. The process includes the steps of applying a composition that includes at least one silicon-based dielectric precursor to a substrate, and then, (a) gelling or aging the applied coating, (b) contacting the coating with a planarization object with sufficient pressure to transfer a planar impression to the coating without substantially impairing formation of desired nanometer-scale pore structure, (c) separating the planarized coating from the planarization object, (d) curing said planarized coating; wherein steps (a)-(d) are conducted in any one of the following sequences: (a), (b), (c) and (d); (a), (d), (b) and (c); (b), (a), (d) and (c); and (b), (c), (a) and (d).
    • 在适于制备半导体器件的衬底上形成基本上平坦化的纳米多孔介电二氧化硅涂层的方法,以及通过本发明的方法制造的半导体器件。 该方法包括以下步骤:将包含至少一种硅基电介质前体的组合物施加到基底上,然后(a)使所涂覆的涂层凝胶化或老化,(b)使涂层与平坦化物体接触足够的压力, 将平面印模转移到涂层,而不会基本上损害所需的纳米尺度孔结构的形成,(c)将平坦化涂层与平坦化物体分离,(d)固化所述平坦化涂层;其中步骤(a) - (d) (a),(d),(b)和(c);(b),(a),(d) )和(c); 和(b),(c),(a)和(d)。
    • 10. 发明授权
    • Contact planarization using nanoporous silica materials
    • 使用纳米多孔二氧化硅材料的接触平面化
    • US06589889B2
    • 2003-07-08
    • US09392413
    • 1999-09-09
    • Denis H. EndischJames S. Drage
    • Denis H. EndischJames S. Drage
    • H01L2131
    • B82Y10/00B82Y40/00G03F7/0002H01L21/31051
    • A process for forming a substantially planarized nanoporous dielectric silica coating on a substrate suitable for preparing a semiconductor device, and semiconductor devices produced by the methods of the invention. The process includes the steps of applying a composition that includes at least one silicon-based dielectric precursor to a substrate, and then, (a) gelling or aging the applied coating, (b) contacting the coating with a planarization object with sufficient pressure to transfer a planar impression to the coating without substantially impairing formation of desired nanometer-scale pore structure, (c) separating the planarized coating from the planarization object, (d) curing said planarized coating; wherein steps (a)-(d) are conducted in any one of the following sequences: (a), (b), (c) and (d); (a), (d), (b) and (c); (b), (a), (d) and (c); and (b), (c), (a) and (d).
    • 在适于制备半导体器件的衬底上形成基本上平坦化的纳米多孔介电二氧化硅涂层的方法,以及通过本发明的方法制造的半导体器件。 该方法包括以下步骤:将包含至少一种硅基电介质前体的组合物施加到基底上,然后(a)使所涂覆的涂层凝胶化或老化,(b)使涂层与平坦化物体接触足够的压力, 将平面印模转移到涂层,而不会基本上损害所需的纳米尺度孔结构的形成,(c)将平面化涂层与平坦化物体分离,(d)固化所述平坦化涂层;其中步骤(a) - (d) (a),(d),(b)和(c);(b),(a),(d) )和(c); 和(b),(c),(a)和(d)。