专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06930366B2 Method for forming a cavity structure on SOI substrate and cavity structure formed on SOI substrate 有权
标题翻译：在SOI衬底上形成腔结构的方法和在SOI衬底上形成的腔结构
公开(公告)号：US06930366B2
公开(公告)日：2005-08-16
申请号：US10491193
申请日：2002-09-27
申请人： Jyrki Kiihamäki
发明人： Jyrki Kiihamäki
IPC分类号： B81C1/00 , H01L21/762 , H01L29/84
CPC分类号： B81C1/00047 , B81C1/00412 , B81C2201/0115 , B81C2203/0145 , H01L21/76286
摘要： The present publication discloses a method for forming cavities in prefabricated silicon wafers comprising a first silicon layer (1), a second monocrystalline silicon layer, or a so-called structural layer (3), oriented substantially parallel with said first silicon layer (1) and an insulating layer (2) situated between said first and second layers (1, 3). According to the method, in at least one of the conducting silicon layers (1, 3) are fabricated windows (4) extending through the thickness of the layer, and cavities are etched in the insulating layer (2) by means of etchants passed to the layer via said fabricated windows (4). According to the invention, subsequent to the fabrication step of the windows (4) and prior to the etching step, a thin porous layer (5) is formed on the surface to be processed such that the etchants can be passed through said porous layer into said cavities (6) being etched and, after the cavities (6) are etched ready, at least one supplementary layer (7) is deposited in order to render to the material of said porous layer impermeable to gases.
摘要翻译：本公开公开了一种用于在预制硅晶片中形成空腔的方法，其包括基本上平行于所述第一硅层（1）取向的第一硅层（1），第二单晶硅层或所谓的结构层（3）和位于所述第一和第二层（1,3）之间的绝缘层（2）。根据该方法，至少一个导电硅层（1,3）是延伸穿过该层的厚度的制造窗（4），并且通过传递给绝缘层（2）的蚀刻剂在绝缘层（2）中蚀刻空腔所述层经由所述制造的窗口（4）。根据本发明，在窗口（4）的制造步骤之后并且在蚀刻步骤之前，在待加工的表面上形成薄的多孔层（5），使得蚀刻剂可以通过所述多孔层进入所述腔（6）被蚀刻，并且在空腔（6）被蚀刻就绪之后，沉积至少一个辅助层（7），以使所述多孔层的材料不能透过气体。

2. 发明授权

US08786166B2 Micromechanical resonator array and method for manufacturing thereof 有权
标题翻译：微机械谐振器阵列及其制造方法
公开(公告)号：US08786166B2
公开(公告)日：2014-07-22
申请号：US13209099
申请日：2011-08-12
申请人： Antti Jaakkola , Tuomas Pensala , Jyrki Kiihamäki
发明人： Antti Jaakkola , Tuomas Pensala , Jyrki Kiihamäki
IPC分类号： H01L41/09
CPC分类号： H03H3/0072 , H03H3/0076 , H03H9/02448 , H03H9/2463 , H03H9/505 , H03H2009/02385 , H03H2009/02503 , H03H2009/2442
摘要： The invention relates to a microelectromechanical resonators and a method of manufacturing thereof. The resonator comprises at least two resonator elements made from semiconductor material, the resonator elements being arranged laterally with respect to each other as an array, at least one transducer element coupled to said resonator elements and capable of exciting a resonance mode to the resonator elements. According to the invention, said at least one transducer element is a piezoelectric transducer element arranged laterally with respect to the at least two resonator elements between the at least two resonator elements and adapted to excite to the resonator elements as said resonance mode a resonance mode whose resonance frequency is dependent essentially only on the c44 elastic parameter of the elastic modulus of the material of the resonator elements. By means of the invention, electrostatic actuation and problems associated therewith can be avoided and accurate resonators can be manufactured.
摘要翻译：本发明涉及一种微机电谐振器及其制造方法。谐振器包括由半导体材料制成的至少两个谐振器元件，谐振器元件相对于彼此横向地布置为阵列，耦合到所述谐振器元件并能够激励谐振元件的谐振模式的至少一个换能器元件。根据本发明，所述至少一个换能器元件是在所述至少两个谐振元件之间相对于所述至少两个谐振器元件横向布置的压电换能器元件，并且适于作为所述谐振模式激励谐振元件，谐振频率基本上仅取决于谐振器元件的材料的弹性模量的c44弹性参数。通过本发明，可以避免静电致动和与之相关的问题，并且可以制造精确的谐振器。

3. 发明申请

US20120058506A1 MICRONEEDLE 有权
公开(公告)号：US20120058506A1
公开(公告)日：2012-03-08
申请号：US13265290
申请日：2010-04-20
申请人： Feng Gao , Jyrki Kiihamäki , Ari Hokkanen , Päivi Heimala
发明人： Feng Gao , Jyrki Kiihamäki , Ari Hokkanen , Päivi Heimala
IPC分类号： C12Q1/02 , C23F1/02 , C12M1/00
CPC分类号： A61B5/1411 , A61B5/14514 , A61B5/150022 , A61B5/150282 , A61B5/150419 , A61B5/150435 , A61B5/150511 , A61B5/15142 , A61B2562/0295 , A61M37/0015 , A61M2037/003 , A61M2037/0053 , A61M2037/0061
摘要： The application relates to microfluidic needles and their manufacturing methods. The microfluidic needle comprises an interface portion containing at least one fluid communication channel, an elongated needle portion (40) projecting away from the interface portion (44), the needle portion having a tip and sidewalls connecting the tip to the interface portion, and at least two microfluidic channels (43 A-B) within the needle portion in fluidic connection with the at least one communication channel, the microfluidic channels being at least partly oriented parallel to the elongated needle portion. According to the application, the microfluidic channels exit the needle portion at the sidewalls of the needle portion. The needle may be fabricated by ALD-assisted silicon micromachining. The needle can be used for injection and/or sampling fluids to/from tissue or individual cells.
摘要翻译：本申请涉及微流体针及其制造方法。所述微流体针包括含有至少一个流体连通通道的界面部分，远离所述界面部分（44）突出的细长针部分（40），所述针部分具有将尖端连接到界面部分的尖端和侧壁，在所述针部分内与所述至少一个连通通道流体连接的至少两个微流体通道（43AB），所述微流体通道至少部分地定向为平行于所述细长针部分。根据应用，微流体通道在针部分的侧壁处离开针部分。针可以通过ALD辅助硅微加工制造。针可以用于向/从组织或单个细胞注射和/或取样流体。

4. 发明申请

US20120038431A1 MICROMECHANICAL RESONATOR ARRAY AND METHOD FOR MANUFACTURING THEREOF 有权
标题翻译：微机电谐振器阵列及其制造方法
公开(公告)号：US20120038431A1
公开(公告)日：2012-02-16
申请号：US13209099
申请日：2011-08-12
申请人： Antti JAAKKOLA , Tuomas PENSALA , Jyrki KIIHAMÄKI
发明人： Antti JAAKKOLA , Tuomas PENSALA , Jyrki KIIHAMÄKI
IPC分类号： H03B5/30 , H01L21/77
CPC分类号： H03H3/0072 , H03H3/0076 , H03H9/02448 , H03H9/2463 , H03H9/505 , H03H2009/02385 , H03H2009/02503 , H03H2009/2442
摘要： The invention relates to a microelectromechanical resonators and a method of manufacturing thereof. The resonator comprises at least two resonator elements made from semiconductor material, the resonator elements being arranged laterally with respect to each other as an array, at least one transducer element coupled to said resonator elements and capable of exciting a resonance mode to the resonator elements. According to the invention, said at least one transducer element is a piezoelectric transducer element arranged laterally with respect to the at least two resonator elements between the at least two resonator elements and adapted to excite to the resonator elements as said resonance mode a resonance mode whose resonance frequency is dependent essentially only on the c44 elastic parameter of the elastic modulus of the material of the resonator elements. By means of the invention, electrostatic actuation and problems associated therewith can be avoided and accurate resonators can be manufactured.
摘要翻译：本发明涉及一种微机电谐振器及其制造方法。谐振器包括由半导体材料制成的至少两个谐振器元件，谐振器元件相对于彼此横向地布置为阵列，耦合到所述谐振器元件并能够激励谐振元件的谐振模式的至少一个换能器元件。根据本发明，所述至少一个换能器元件是在所述至少两个谐振元件之间相对于所述至少两个谐振器元件横向布置的压电换能器元件，并且适于作为所述谐振模式激励谐振元件，谐振频率基本上仅取决于谐振器元件的材料的弹性模量的c44弹性参数。通过本发明，可以避免静电致动和与之相关的问题，并且可以制造精确的谐振器。

5. 发明授权

US09462969B2 Microneedle 有权
标题翻译：微针
公开(公告)号：US09462969B2
公开(公告)日：2016-10-11
申请号：US13265290
申请日：2010-04-20
申请人： Feng Gao , Jyrki Kiihamäki , Ari Hokkanen , Päivi Heimala
发明人： Feng Gao , Jyrki Kiihamäki , Ari Hokkanen , Päivi Heimala
IPC分类号： A61M5/32 , A61B5/15 , A61B5/151 , A61M37/00 , A61B5/145
CPC分类号： A61B5/1411 , A61B5/14514 , A61B5/150022 , A61B5/150282 , A61B5/150419 , A61B5/150435 , A61B5/150511 , A61B5/15142 , A61B2562/0295 , A61M37/0015 , A61M2037/003 , A61M2037/0053 , A61M2037/0061
摘要： The application relates to microfluidic needles and their manufacturing methods. The microfluidic needle comprises an interface portion containing at least one fluid communication channel, an elongated needle portion (40) projecting away from the interface portion (44), the needle portion having a tip and sidewalls connecting the tip to the interface portion, and at least two microfluidic channels (43 A-B) within the needle portion in fluidic connection with the at least one communication channel, the microfluidic channels being at least partly oriented parallel to the elongated needle portion. According to the application, the microfluidic channels exit the needle portion at the sidewalls of the needle portion. The needle may be fabricated by ALD-assisted silicon micromachining. The needle can be used for injection and/or sampling fluids to/from tissue or individual cells.
摘要翻译：本申请涉及微流体针及其制造方法。所述微流体针包括含有至少一个流体连通通道的界面部分，远离所述界面部分（44）突出的细长针部分（40），所述针部分具有将尖端连接到界面部分的尖端和侧壁，在所述针部分内与所述至少一个连通通道流体连接的至少两个微流体通道（43AB），所述微流体通道至少部分地定向为平行于所述细长针部分。根据应用，微流体通道在针部分的侧壁处离开针部分。针可以通过ALD辅助硅微加工制造。针可以用于向/从组织或单个细胞注射和/或取样流体。

6. 发明授权

US08236694B2 Method for manufacturing micromechanical components 有权
标题翻译：微机械部件制造方法
公开(公告)号：US08236694B2
公开(公告)日：2012-08-07
申请号：US12884823
申请日：2010-09-17
申请人： Jyrki Kiihamäki , Hannu Kattelus
发明人： Jyrki Kiihamäki , Hannu Kattelus
IPC分类号： H01L21/302
CPC分类号： B81C1/00611 , B81C2201/0125
摘要： The present invention relates to a method for manufacturing an acceleration sensor. In the method, thin SOI-wafer structures are used, in which grooves are etched, the walls of which are oxidized. A thick layer of electrode material, covering all other material, is grown on top of the structures, after which the surface is ground and polished chemo-mechanically, thin release holes are etched in the structure, structural patterns are formed, and finally etching using a hydrofluoric acid solution is performed to release the structures intended to move and to open a capacitive gap.
摘要翻译：本发明涉及加速度传感器的制造方法。在该方法中，使用薄SOI晶片结构，其中蚀刻凹槽，其壁被氧化。覆盖所有其他材料的厚电极材料层生长在结构的顶部，然后将表面研磨并化学机械地抛光，在结构中蚀刻薄的释放孔，形成结构图案，最后使用执行氢氟酸溶液以释放旨在移动并打开电容间隙的结构。

7. 发明授权

US07882741B2 Method for manufacturing micromechanical components 有权
标题翻译：微机械部件制造方法
公开(公告)号：US07882741B2
公开(公告)日：2011-02-08
申请号：US11920687
申请日：2006-06-02
申请人： Jyrki Kiihamäki , Hannu Kattelus
发明人： Jyrki Kiihamäki , Hannu Kattelus
IPC分类号： G01P15/125
CPC分类号： B81C1/00611 , B81C2201/0125
摘要： The present invention relates to a method for manufacturing an acceleration sensor. In the method, thin SOI-wafer structures are used, in which grooves are etched, the walls of which are oxidized. A thick layer of electrode material, covering all other material, is grown on top of the structures, after which the surface is ground and polished chemo-mechanically, thin release holes are etched in the structure, structural patterns are formed, and finally etching using a hydrofluoric acid solution is performed to release the structures intended to move and to open a capacitive gap.
摘要翻译：本发明涉及加速度传感器的制造方法。在该方法中，使用薄SOI晶片结构，其中蚀刻凹槽，其壁被氧化。覆盖所有其他材料的厚电极材料层生长在结构的顶部，然后将表面研磨并化学机械地抛光，在结构中蚀刻薄的释放孔，形成结构图案，最后使用执行氢氟酸溶液以释放旨在移动并打开电容间隙的结构。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式