会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明授权
    • Method of etching MTJ using CO process chemistries
    • 使用CO工艺化学品蚀刻MTJ的方法
    • US09105569B2
    • 2015-08-11
    • US13214107
    • 2011-08-19
    • Krishnakumar ManiBenjamin Chen
    • Krishnakumar ManiBenjamin Chen
    • H01L43/12H01L27/22
    • H01L27/222H01L22/26H01L43/02H01L43/08H01L43/12
    • A method for fabricating a magnetic film structure is provided. The method comprises forming a magnetic structure on a bottom electrode layer, the magnetic structure comprising at least one pinned bottom magnetic film layer having a fixed magnetic orientation; at least one top magnetic film layer whose magnetic orientation can be manipulated by a current; and a tunneling layer between the bottom magnetic film layer and the top magnetic film layer; forming a metallic hard mask atop the magnetic structure; patterning and etching the metallic hard mask to define exposed areas of the magnetic structure; selectively etching the exposed areas of the magnetic structure by a chemical etch process based on a CO etch chemistry to form discrete magnetic bits.
    • 提供一种制造磁性膜结构的方法。 该方法包括在底部电极层上形成磁性结构,所述磁性结构包括至少一个具有固定磁性取向的固定底部磁性薄膜层; 至少一个磁性取向可由电流操纵的顶部磁性膜层; 以及在底部磁性膜层和顶部磁性膜层之间的隧道层; 在磁性结构上形成金属硬掩模; 图案化和蚀刻金属硬掩模以限定磁结构的暴露区域; 通过基于CO蚀刻化学的化学蚀刻工艺来选择性地蚀刻磁性结构的暴露区域以形成离散磁性位。
    • 5. 发明申请
    • SEMICONDUCTOR INTEGRATED CIRCUIT FOR LOW AND HIGH VOLTAGE OPERATIONS
    • 用于低电压和高电压运行的半导体集成电路
    • US20120087180A1
    • 2012-04-12
    • US12901845
    • 2010-10-11
    • Krishnakumar Mani
    • Krishnakumar Mani
    • G11C11/00
    • G11C11/165G11C5/06G11C11/161G11C11/1659
    • A semiconductor integrated circuit comprising a first circuit area for a low voltage operation and a second circuit area for a high voltage operation. The circuit areas comprise two vertically stacked backend patterned metal layers that are separated by an inter-metallic dielectric (IMD). The two metal layers and the IMD form a combination that is operable at the low voltage. The first circuit area uses a first portion of the combination for operating at the low voltage and the second circuit area uses a second portion of the combination for routing at the high voltage, the two metal layers in the second portion being interconnected through the IMD by via hole, for withstanding the high voltage. The first portion may comprise an array of magnetic random access memory (MRAM) devices and the second circuit area may comprise a display drive circuit.
    • 一种半导体集成电路,包括用于低电压操作的第一电路区域和用于高电压操作的第二电路区域。 电路区域包括由金属间电介质(IMD)隔开的两个垂直堆叠的后端图案化金属层。 两个金属层和IMD形成在低电压下可操作的组合。 第一电路区域使用组合的第一部分在低电压下操作,并且第二电路区域使用组合的第二部分以高电压路由,第二部分中的两个金属层通过IMD互连通过IMD互连 通孔,用于承受高电压。 第一部分可以包括磁性随机存取存储器(MRAM)装置的阵列,并且第二电路区域可以包括显示驱动电路。
    • 7. 发明授权
    • Memory cell with Schottky diode
    • 具有肖特基二极管的存储单元
    • US08879314B2
    • 2014-11-04
    • US13153473
    • 2011-06-06
    • Krishnakumar Mani
    • Krishnakumar Mani
    • G11C11/14
    • G11C11/1673G11C11/14G11C11/161G11C11/1657G11C11/1659G11C11/1675G11C11/36H01L27/222H01L27/224H01L27/228H01L29/872H01L43/02H01L43/08H01L43/10H01L43/12
    • Memory cell comprising two conductors, with a serially connected magnetic storage element and a Schottky diode between the two conductors. The Schottky diode provides a unidirectional conductive path between the two conductors and through the element. The Schottky diode is formed between a metal layer in one of the two conductors and a processed junction layer. Methods for process and for operation of the memory cell are also disclosed. The memory cell using the Schottky diode can be designed for high speed operation and with high density of integration. Advantageously, the junction layer can also be used as a hard mask for defining the individual magnetic storage element in the memory cell. The memory cell is particularly useful for magnetic random access memory (MRAM) circuits.
    • 存储单元包括两个导体,在两个导体之间具有串联连接的磁存储元件和肖特基二极管。 肖特基二极管在两个导体之间提供一个单向的导电路径,并通过该元件。 肖特基二极管形成在两个导体中的一个中的金属层和经处理的接合层之间。 还公开了用于存储器单元的处理和操作的方法。 使用肖特基二极管的存储单元可以设计用于高速运行和高密度集成。 有利地,结层也可以用作硬掩模,用于限定存储单元中的各个磁存储元件。 存储单元对磁性随机存取存储器(MRAM)电路特别有用。