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1. 发明申请

US20160293470A1 DEVICE FOR AT LEAST EMPTYING A TRANSPORT CONTAINER 有权
标题翻译：用于至少运送运输集装箱的装置
公开(公告)号：US20160293470A1
公开(公告)日：2016-10-06
申请号：US15036472
申请日：2014-11-17
申请人： MECHATRONIC SYSTEMTECHNIK GMBH
发明人： Alexander OREMUS , Arno GLANTSCHNIG
IPC分类号： H01L21/677 , G01B11/14 , B65G59/04 , B65G59/00 , H01L21/683 , H01L21/68
CPC分类号： H01L21/67778 , B65G59/005 , B65G59/04 , B65H3/0816 , B65H3/0883 , B65H3/48 , G01B11/14 , H01L21/67092 , H01L21/681 , H01L21/6838
摘要： A device for at least emptying a transport container having a stack of plate-shaped items, including semiconductor wafers and/or packaging material, includes at least one measuring device and a holder at least part of which can travel into the transport container, the holder having: a holding surface; a number of holding nozzles for at least holding an item in the stack; and, in the region of the holding surface, at least one recess for the measuring device for acquiring measurement data from the item in the stack. In order to permit the transport container to be emptied in a stable manner, the holder includes at least one separating nozzle arranged outside the holding surface and arranged on the holder such that the nozzle(s) can move between a rest position and a separating position, in such a way that when the separating nozzle is in the separating position, a gas stream directed towards the end face of the stack is formed, in order to release at least one item in the stack that is adhered to the item held by the holder.
摘要翻译：用于至少排空具有包括半导体晶片和/或包装材料的板状物品的堆叠的运输容器的装置包括至少一个测量装置和至少一部分能够进入运输容器的保持器，保持器具有：保持表面; 用于至少将物品保持在所述堆叠中的多个保持喷嘴; 并且在所述保持表面的区域中，至少一个用于所述测量装置的凹部用于从所述堆叠中的所述物品获取测量数据。为了允许运输容器以稳定的方式排空，保持器包括布置在保持表面外部并布置在保持器上的至少一个分离喷嘴，使得喷嘴能够在静止位置和分离位置之间移动以这样的方式使得当分离喷嘴处于分离位置时，形成指向堆叠端面的气流，以便释放堆叠中的至少一个物品，该物品粘附到由持有人

2. 发明授权

US09502277B2 Apparatus, in particular end effector 有权
标题翻译：装置，特别是末端执行器
公开(公告)号：US09502277B2
公开(公告)日：2016-11-22
申请号：US14914691
申请日：2014-08-28
申请人： Mechatronic Systemtechnik GmbH
发明人： Arno Glantschnig , Andreas Schett
IPC分类号： B25J15/06 , H01L21/683
CPC分类号： H01L21/6838 , B25J15/0616 , H01L21/68
摘要： An apparatus, in particular end effector, for receiving, transporting and/or positioning a wafer frame which is covered by a carrier film for carrying a wafer, has a holder which has vacuum nozzles for holding the wafer frame on the apparatus, and has a centering device which has at least one stop, which can engage in a cutout in the wafer frame, for centering the wafer frame. In order to precisely position the wafer frame, the holder has Bernoulli nozzles for holding and moving the wafer frame in the direction of the stop without contact, and the stop is mounted such that it can be adjusted against the movement direction generated by the Bernoulli nozzles from an initial position to a centering position, which differs from the initial position, for centering the wafer frame.
摘要翻译：一种用于接收，运输和/或定位由用于承载晶片的载体膜覆盖的晶片框架的装置，特别是端部执行器，具有用于将晶片框架保持在设备上的真空喷嘴的保持器，并且具有定心装置具有至少一个止挡件，其能够接合晶片框架中的切口，用于使晶片框架居中。为了精确地定位晶片框架，保持器具有用于在没有接触的情况下沿着止动件的方向保持和移动晶片框架的伯努利喷嘴，并且止动件被安装成使得能够相对于伯努利喷嘴产生的移动方向从初始位置到与初始位置不同的定心位置，用于使晶片框架居中。

3. 发明申请

US20160211164A1 APPARATUS, IN PARTICULAR END EFFECTOR 有权
标题翻译：装置，特别是最终影响
公开(公告)号：US20160211164A1
公开(公告)日：2016-07-21
申请号：US14914691
申请日：2014-08-28
申请人： MECHATRONIC SYSTEMTECHNIK GMBH
发明人： Arno GLANTSCHNIG , Andreas SCHETT
IPC分类号： H01L21/683 , B25J15/06
CPC分类号： H01L21/6838 , B25J15/0616 , H01L21/68
摘要： An apparatus, in particular end effector, for receiving, transporting and/or positioning a wafer frame which is covered by a carrier film for carrying a wafer, has a holder which has vacuum nozzles for holding the wafer frame on the apparatus, and has a centering device which has at least one stop, which can engage in a cutout in the wafer frame, for centering the wafer frame. In order to precisely position the wafer frame, the holder has Bernoulli nozzles for holding and moving the wafer frame in the direction of the stop without contact, and the stop is mounted such that it can be adjusted against the movement direction generated by the Bernoulli nozzles from an initial position to a centering position, which differs from the initial position, for centering the wafer frame.
摘要翻译：一种用于接收，运输和/或定位由用于承载晶片的载体膜覆盖的晶片框架的装置，特别是端部执行器，具有用于将晶片框架保持在设备上的真空喷嘴的保持器，并且具有定心装置具有至少一个止挡件，其能够接合晶片框架中的切口，用于使晶片框架居中。为了精确地定位晶片框架，保持器具有用于在没有接触的情况下沿着止动件的方向保持和移动晶片框架的伯努利喷嘴，并且止动件被安装成使得能够相对于伯努利喷嘴产生的移动方向从初始位置到与初始位置不同的定心位置，用于使晶片框架居中。

4. 发明授权

US09978624B2 Device for at least emptying a transport container 有权
公开(公告)号：US09978624B2
公开(公告)日：2018-05-22
申请号：US15036472
申请日：2014-11-17
申请人： Mechatronic Systemtechnik GmbH
发明人： Alexander Oremus , Arno Glantschnig
IPC分类号： B65H3/48 , H01L21/677 , H01L21/67 , H01L21/68 , H01L21/683 , B65G59/00 , B65G59/04 , G01B11/14 , B65H3/08
CPC分类号： H01L21/67778 , B65G59/005 , B65G59/04 , B65H3/0816 , B65H3/0883 , B65H3/48 , G01B11/14 , H01L21/67092 , H01L21/681 , H01L21/6838
摘要： A device for at least emptying a transport container having a stack of plate-shaped items, including semiconductor wafers and/or packaging material, includes at least one measuring device and a holder at least part of which can travel into the transport container. The holder has a holding surface, a number of holding nozzles for at least holding an item in the stack, and, in the region of the holding surface, at least one recess for the measuring device for acquiring measurement data from the item in the stack. At least one separating nozzle is arranged on the holder outside the holding surface such that the nozzle(s) can move between rest and separating positions. In the separating position, a gas stream directed towards the end face of the stack is formed, to release at least one item in the stack that is adhered to the item held by the holder.

5. 发明授权

US09905445B2 Apparatus for removing a ring-shaped reinforcement edge from a ground semiconductor wafer 有权
公开(公告)号：US09905445B2
公开(公告)日：2018-02-27
申请号：US14903741
申请日：2014-07-10
申请人： MECHATRONIC SYSTEMTECHNIK GMBH
发明人： Walter Schober
IPC分类号： B32B38/10 , H01L21/67 , H01L21/683 , B32B43/00
CPC分类号： H01L21/67132 , B32B38/10 , B32B43/006 , H01L21/67092 , H01L21/67115 , H01L21/6836 , H01L2221/68381 , Y10T156/1132 , Y10T156/1158 , Y10T156/1184 , Y10T156/1917 , Y10T156/1944 , Y10T156/1967
摘要： An apparatus for removing a ring-shaped reinforcement, edge from a ground semiconductor wafer, which is cohesively connected to an elastic carrier film and is fixed to a circumferential wafer frame via the carrier film, includes a holding device, which has a support having suction openings for holding the semiconductor wafer on the support surface of the support, and a separating device, which includes a device for integrally detaching the reinforcement edge from the carrier film. In order to be able to detach the reinforcement edge from the carrier film without damage, the holder device has a clamping device encompassing the support and serving for clamping the wafer frame and/or the carrier film, wherein the clamping device interacts with the support to stretch the carrier film, and the separating device has a tool guide with a dividing tool for moving the dividing tool between carrier film and reinforcement edge in order to detach the reinforcement edge in one piece from the carrier film stretched by interaction of clamping device and support.

6. 发明申请

US20170345700A1 VACUUM CLAMPING DEVICE FOR GRIPPING WORKPIECES 审中-公开
公开(公告)号：US20170345700A1
公开(公告)日：2017-11-30
申请号：US15537065
申请日：2015-12-17
申请人： mechatronic systemtechnik GmbH
发明人： Alexander Oremus
IPC分类号： H01L21/683 , H01L21/67
CPC分类号： H01L21/6838 , H01L21/67288
摘要： The present invention among other things relates to a vacuum clamping device for clamping of workpieces, in particular for clamping of flat substrates, with a vacuum clamping plate (10), which has a number of suction openings (16) which are distributed over its surface and which are formed in a suction surface (14) of the vacuum clamping plate (10) or which are in connection to a number of suction grooves (15 ) which are formed in the suction surface (14) of the vacuum clamping plate (10), wherein the vacuum clamping plate (10) has two or more vacuum zones (11,12) which are separate from each other and are individually switchable, wherein each vacuum zone (11,12) has corresponding suction openings (16) and/or suction grooves (15) with suction openings (16). In order to further develop the vacuum clamping device in such a way, that with it large holding forces can be generated in a targeted manner, wherein simultaneously damaging of the workpiece to be clamped has to be avoided, it is provided, that the vacuum clamping device has two or more separate vacuum circuits which are independent from each other, that each vacuum zone (11, 12) is assigned to one of the vacuum circuits or is part of one of the vacuum circuits and that each vacuum circuit is designed for generating a self-contained vacuum.

7. 发明申请

US20160163571A1 APPARATUS FOR REMOVING A RING-SHAPED REINFORCEMENT EDGE FROM A GROUND SEMICONDUCTOR WAFER 有权
标题翻译：从地面半导体波形去除环形加固边缘的装置
公开(公告)号：US20160163571A1
公开(公告)日：2016-06-09
申请号：US14903741
申请日：2014-07-10
申请人： MECHATRONIC SYSTEMTECHNIK GMBH
发明人： Walter SCHOBER
IPC分类号： H01L21/67 , H01L21/683
CPC分类号： H01L21/67132 , B32B38/10 , B32B43/006 , H01L21/67092 , H01L21/67115 , H01L21/6836 , H01L2221/68381 , Y10T156/1132 , Y10T156/1158 , Y10T156/1184 , Y10T156/1917 , Y10T156/1944 , Y10T156/1967
摘要： An apparatus for removing a ring-shaped reinforcement, edge from a ground semiconductor wafer, which is cohesively connected to an elastic carrier film and is fixed to a circumferential wafer frame via the carrier film, includes a holding device, which has a support having suction openings for holding the semiconductor wafer on the support surface of the support, and a separating device, which includes a device for integrally detaching the reinforcement edge from the carrier film. In order to be able to detach the reinforcement edge from the carrier film without damage, the holder device has a clamping device encompassing the support and serving for clamping the wafer frame and/or the carrier film, wherein the clamping device interacts with the support to stretch the carrier film, and the separating device has a tool guide with a dividing tool for moving the dividing tool between carrier film and reinforcement edge in order to detach the reinforcement edge in one piece from the carrier film stretched by interaction of clamping device and support.
摘要翻译：一种从与地面半导体晶片相接合的环形加强件的边缘与粘合地连接到弹性载体膜并经由载体膜固定到圆周晶片框架的装置包括一个保持装置，用于将半导体晶片保持在支撑体的支撑表面上的开口，以及分离装置，其包括用于将加强边缘与载体膜一体地分离的装置。为了能够将加强边缘与载体膜分离而不损坏，保持器装置具有包围支撑件并用于夹紧晶片框架和/或载体膜的夹紧装置，其中夹紧装置与支撑件相互作用拉伸承载膜，并且分离装置具有工具引导件，该工具引导件具有用于在分隔工具在载体膜和加强件边缘之间移动的分割工具，以便将加强边缘与通过夹持装置和支撑件的相互作用拉伸的载体膜分离成一体。

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