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    • 8. 发明授权
    • Wafer processing system with dual wafer robots capable of asynchronous motion
    • 具有双晶片机器人的晶圆处理系统能够进行异步运动
    • US08137048B2
    • 2012-03-20
    • US11863166
    • 2007-09-27
    • Mahendran ChidambaramQuoc TruongJerry SchockN. William Parker
    • Mahendran ChidambaramQuoc TruongJerry SchockN. William Parker
    • B25J18/02
    • H01L21/6719B25J9/107B25J18/025H01L21/67184H01L21/67196H01L21/67742Y10T74/20305
    • A robot assembly for transferring substrates includes a central tube assembly oriented along a central axis, perpendicular to a substrate transfer plane, and having an inner surface that forms part of a first enclosure at a first pressure, and an outer surface that forms part of a second enclosure at a second, different pressure. The robot assembly further includes a transfer robot which itself includes multiple rotor assemblies, each configured to rotate parallel to the substrate transfer plane. The various rotor assemblies are organized in pairs, each pair having one rotor fitted with a telescoping support arm/end effector arrangement to support substrates thereon, and the other rotor fitted with inner and outer actuator arms that cooperate to effect radial movement of the corresponding end effector of the paired rotor assembly. Each rotor is controlled to effect the transfer of substrates within a wafer processing system asynchronously and at differing heights.
    • 用于传送基板的机器人组件包括:中心管组件,其沿着中心轴线定向,垂直于基板传送平面,并且具有形成第一外壳的第一压力的一部分的内表面,以及形成 第二个外壳处于第二个不同的压力。 机器人组件还包括传送机器人,其自身包括多个转子组件,每个转子组件被构造成平行于基板传送平面旋转。 各对转子组件成对组合,每对具有一个转子,该转子装配有可伸缩的支撑臂/端部执行器装置,以支撑其上的基板,另一个转子装配有内部和外部致动器臂,其配合以实现相应端部的径向移动 成对的转子组件的效应器。 控制每个转子以在晶片处理系统内以不同的高度实现衬底的转移。
    • 9. 发明授权
    • Detector optics for charged particle beam inspection system
    • 用于带电粒子束检测系统的检测器光学器件
    • US07122795B2
    • 2006-10-17
    • US10833949
    • 2004-04-27
    • N. William Parker
    • N. William Parker
    • G01N23/00
    • H01J37/28H01J37/244
    • A charged particle beam column for substrate inspection includes detector optics with high secondary electron detection efficiency combined with minimal distortion of the charged particle beam. One embodiment of the detector optics includes a symmetrizing electrode configured with a secondary electron detector to produce a generally cylindrically symmetric electric field about the optical axis of the column. Control electrodes may be used for screening the charged particle beam from the secondary electron detector and for controlling the electric field at the surface of the substrate. In some embodiments, the control electrodes are cylindrically symmetric about the optical axis; whereas in other embodiments, the cylindrical symmetry of one or more control electrodes is broken in order to improve the secondary electron detection efficiency.
    • 用于基板检查的带电粒子束柱包括具有高二次电子检测效率的结合最小带电粒子束失真的检测器光学器件。 检测器光学器件的一个实施例包括配置有二次电子检测器的对称电极,以围绕色谱柱的光轴产生大致圆柱形的对称电场。 控制电极可用于筛选来自二次电子检测器的带电粒子束并用于控制衬底表面处的电场。 在一些实施例中,控制电极围绕光轴圆柱对称; 而在其他实施例中,为了提高二次电子检测效率,一个或多个控制电极的圆柱对称性被破坏。
    • 10. 发明授权
    • Image processing system for multi-beam inspection
    • 多光束检测图像处理系统
    • US06738506B2
    • 2004-05-18
    • US10125054
    • 2002-04-17
    • S. Daniel MillerN. William ParkerSteven B. Hobmann
    • S. Daniel MillerN. William ParkerSteven B. Hobmann
    • G06K900
    • G06T7/001G06T2207/30148
    • An image processing system for use in semiconductor wafer inspection comprises a multiplicity of self-contained image processors for independently performing image cross-correlation and defect detection. The system may also comprise an image normalization engine for performing image brightness and contrast normalization. The self-contained image processors and image normalization engine access image data from a memory array; the array is fed data from a multiplicity of imaging modules operating in parallel. The memory array is configured to allow simultaneous access for data input, normalization, and cross-correlation and defect detection. Multiple image processing systems can be configured in parallel as a single image processing computer, all sending defect data to a common display module.
    • 用于半导体晶片检查的图像处理系统包括用于独立执行图像互相关和缺陷检测的多个自包含图像处理器。 该系统还可以包括用于执行图像亮度和对比度归一化的图像归一化引擎。 独立的图像处理器和图像归一化引擎从存储器阵列访问图像数据; 该阵列从并行操作的多个成像模块馈送数据。 存储器阵列被配置为允许同时访问数据输入,归一化和互相关和缺陷检测。 多个图像处理系统可以并行配置为单个图像处理计算机,全部将缺陷数据发送到公共显示模块。