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    • 6. 发明授权
    • Inspection system
    • 检验系统
    • US08759760B2
    • 2014-06-24
    • US13050035
    • 2011-03-17
    • Dirk ZeidlerUlrike Zeile
    • Dirk ZeidlerUlrike Zeile
    • G01N23/00
    • H01J37/28H01J37/09H01J37/228H01J2237/043H01J2237/06333H01J2237/206H01J2237/24585
    • A combined inspection system for inspecting an object disposable in an object plane 19, comprises a particle-optical system, which provides a particle-optical beam path 3, and a light-optical system, which provides a light-optical beam path 5; and a controller 60, wherein the light-optical system comprises at least one light-optical lens 30 arranged in the light-optical beam, which comprises a first lens surface facing the object plane which has two lens surfaces 34, 35 and a through hole 32, wherein the particle-optical system comprises a beam deflection device 23, in order to scan a primary particle beam 15 over a part of the sample plane 19, and wherein the controller is configured to control the beam deflection device 23 in such a manner that a deflected primary particle beam 15 intersects an optical axis 3 of the particle-optical beam path in a plane which is arranged inside the through hole.
    • 用于检查物体平面19中的一次性物品的组合检查系统包括提供粒子光束路径3的粒子光学系统和提供光束光路5的光学系统; 以及控制器60,其中所述光学系统包括布置在所述光 - 光束中的至少一个光 - 透镜30,所述至少一个光 - 透镜30包括面对所述物平面的第一透镜表面,所述第一透镜表面具有两个透镜表面34,35和通孔 32,其中所述粒子光学系统包括光束偏转装置23,以便在样本平面19的一部分上扫描初级粒子束15,并且其中控制器被配置为以这种方式控制束偏转装置23 偏转的一次粒子束15在布置在通孔内的平面中与粒子光束路径的光轴3相交。
    • 9. 发明授权
    • Methods of operating a nanoprober to electrically probe a device structure of an integrated circuit
    • 操作纳米光栅以电探测集成电路的器件结构的方法
    • US08536526B2
    • 2013-09-17
    • US12344651
    • 2008-12-29
    • Paul D. BellMark E. MastersDavid S. Patrick
    • Paul D. BellMark E. MastersDavid S. Patrick
    • G01N23/00
    • H01J37/268G01R31/307H01J37/265H01J2237/043H01J2237/24564H01J2237/24592
    • Methods for nanoprobing a device structure of an integrated circuit. The method may include scanning a primary charged particle beam across a first region of the device structure with at least one probe proximate to the first region and a second region of the device structure is masked from the primary charged particle beam. The method may further include collecting secondary electrons emitted from the first region of the device structure and the at least one probe to form a secondary electron image. The secondary electron image includes the first region and the at least one probe as imaged portions and the second region as a non-imaged portion. Alternatively, the second region may be scanned by the charged particle beam at a faster scan rate than the first region so that the second region is also an imaged portion of the secondary electron image.
    • 用于纳米结构的集成电路的器件结构的方法。 该方法可以包括利用靠近第一区域的至少一个探针扫描穿过器件结构的第一区域的初级带电粒子束,并且器件结构的第二区域被从初级带电粒子束掩蔽。 该方法还可以包括收集从器件结构的第一区域发射的二次电子和至少一个探针以形成二次电子图像。 二次电子图像包括作为成像部分的第一区域和至少一个探针,以及作为非成像部分的第二区域。 或者,第二区域可以以比第一区域更快的扫描速率被带电粒子束扫描,使得第二区域也是二次电子图像的成像部分。