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    • 7. 发明申请
    • METHOD AND SYSTEM FOR DETERMINING POSITION AND ORIENTATION OF AN OBJECT
    • 用于确定对象的位置和方向的方法和系统
    • US20090231582A1
    • 2009-09-17
    • US11908792
    • 2006-03-03
    • Beat AebischerBernhard BrauneckerPeter Kipfer
    • Beat AebischerBernhard BrauneckerPeter Kipfer
    • G01S17/42G01B11/26G01J4/00
    • G01S17/42G01C15/002
    • The invention relates to a positioning method for determining the position and orientation of a mobile unit having a receiver (3′, whereby the receiver (3) is detected by a scanner (2), said scanner (2′ determining at least the distance and a direction in relation to the receiver (3). The radiation emitted by the sensor is detected by the receiver (3′ and the direction of incidence of radiation and the direction of incidence of radiation in relation to an axis of reception are derived while an offset of the incident radiation in relation to the axis of reception (EA) is determined. Position and orientation of the unit are derived from at least the distance, the direction in relation to the receiver (3′), the offset and the direction of incidence as the position information and the unit is optionally controlled via the optical connection (OV).
    • 本发明涉及一种用于确定具有接收器(3')的移动单元的位置和方位的定位方法,由此由扫描器(2)检测接收器(3),所述扫描器(2'至少确定距离和 由传感器发射的辐射由接收器(3'和辐射入射方向)检测,辐射相对于接收轴的入射方向得到,而 确定入射辐射相对于接收轴(EA)的偏移。单元的位置和取向至少从距离,相对于接收器(3')的方向,偏移和方向 作为位置信息的入射和可选地通过光学连接(OV)控制该单元。
    • 8. 发明申请
    • Method for high-precision fixing of a miniaturized component on a support plate
    • 用于在支撑板上高精度地固定小型化部件的方法
    • US20070033781A1
    • 2007-02-15
    • US11460206
    • 2006-07-26
    • Laurent StaufferPeter KipferHeinz Bernhard
    • Laurent StaufferPeter KipferHeinz Bernhard
    • B21D33/00
    • G02B7/02B23K1/0056G02B7/00H05K3/202H05K3/341H05K3/3494H05K2201/062H05K2201/0969H05K2203/0195H05K2203/107Y02P70/613Y10T29/31
    • The invention relates to a method for high-precision fixing of a miniaturized component (1), in particular having a microoptical element (2), on a predetermined fixing section (3) of a support plate (4) by a solder joint. The support plate is formed throughout from a metallic material and has a cut-out region (10) which encloses the fixing section (3), is bridged by at least one connecting web (9) of the support plate (4), keeps the heat transfer from the fixing section (3) to the remaining support plate low and compensates lateral thermal expansions of the fixing section (3). Solder material (8) is applied on the top of the fixing section (3). The method comprises in particular the steps: arrangement of the component (1) above the fixing section (3), the solder material (8) and the base (7) of the component (1) being present in opposite positions without contact and forming a space. Supply of electromagnetic radiation (12) to the bottom (6) of the fixing section (3) for melting the solder material (8′) so that, as a result of drop formation and optionally as a result of lowering of the component (1) the space fills with molten solder material (8′) for mutual fixing. Waiting for the mutual fixing by resolidification of the molten solder material (8′).
    • 本发明涉及一种用于通过焊接接头在支撑板(4)的预定固定部分(3)上高精度固定小型化部件(1)的方法,特别是具有微光学元件(2)。 支撑板由金属材料形成,并且具有包围固定部分(3)的切口区域(10),由支撑板(4)的至少一个连接腹板(9)桥接,保持 从固定部(3)向剩余的支撑板的热传递较低,并补偿固定部(3)的横向热膨胀。 将焊料(8)施加在固定部(3)的顶部。 该方法特别包括以下步骤:在固定部分(3)上方的部件(1)的布置,部件(1)的焊料材料(8)和基部(7)以相对的位置存在而不接触和形成 一个空间 向固定部分(3)的底部(6)提供电磁辐射(12),以熔化焊料(8'),使得由于液滴形成和任选地由于部件(1)的降低 ),空间填充有熔融焊料(8')以进行相互固定。 通过重新熔化焊料材料(8')等待相互固定。
    • 9. 发明授权
    • Method for high-precision fixing of a miniaturized component on a support plate
    • 用于在支撑板上高精度地固定小型化部件的方法
    • US07759604B2
    • 2010-07-20
    • US11460206
    • 2006-07-26
    • Laurent StaufferPeter KipferHeinz Bernhard
    • Laurent StaufferPeter KipferHeinz Bernhard
    • B23K26/20B23K1/005
    • G02B7/02B23K1/0056G02B7/00H05K3/202H05K3/341H05K3/3494H05K2201/062H05K2201/0969H05K2203/0195H05K2203/107Y02P70/613Y10T29/31
    • The invention relates to a method for high-precision fixing of a miniaturized component (1), in particular having a microoptical element (2), on a predetermined fixing section (3) of a support plate (4) by a solder joint. The support plate is formed throughout from a metallic material and has a cut-out region (10) which encloses the fixing section (3), is bridged by at least one connecting web (9) of the support plate (4), keeps the heat transfer from the fixing section (3) to the remaining support plate low and compensates lateral thermal expansions of the fixing section (3). Solder material (8) is applied on the top of the fixing section (3). The method comprises in particular the steps: arrangement of the component (1) above the fixing section (3), the solder material (8) and the base (7) of the component (1) being present in opposite positions without contact and forming a space. Supply of electromagnetic radiation (12) to the bottom (6) of the fixing section (3) for melting the solder material (8′) so that, as a result of drop formation and optionally as a result of lowering of the component (1) the space fills with molten solder material (8′) for mutual fixing. Waiting for the mutual fixing by resolidification of the molten solder material (8′).
    • 本发明涉及一种用于通过焊接接头在支撑板(4)的预定固定部分(3)上高精度固定小型化部件(1)的方法,特别是具有微光学元件(2)。 支撑板由金属材料形成,并且具有包围固定部分(3)的切口区域(10),由支撑板(4)的至少一个连接腹板(9)桥接,保持 从固定部(3)向剩余的支撑板的热传递较低,并补偿固定部(3)的横向热膨胀。 将焊料(8)施加在固定部(3)的顶部。 该方法特别包括以下步骤:在固定部分(3)上方的部件(1)的布置,部件(1)的焊料材料(8)和基部(7)以相对的位置存在而不接触和形成 一个空间 向固定部分(3)的底部(6)提供电磁辐射(12),以熔化焊料(8'),使得由于液滴形成和任选地由于部件(1)的降低 ),空间填充有熔融焊料(8')以进行相互固定。 通过重新熔化焊料材料(8')等待相互固定。