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1. 发明申请

US20160284637A1 GLASS CORE SUBSTRATE FOR INTEGRATED CIRCUIT DEVICES AND METHODS OF MAKING THE SAME 审中-公开
标题翻译：用于集成电路装置的玻璃核心基板及其制造方法
公开(公告)号：US20160284637A1
公开(公告)日：2016-09-29
申请号：US15172029
申请日：2016-06-02
申请人： Qing Ma , Quan A. Tran , Robert L. Sankman , Johanna M. Swan , Valluri R. Rao
发明人： Qing Ma , Quan A. Tran , Robert L. Sankman , Johanna M. Swan , Valluri R. Rao
IPC分类号： H01L23/498 , H01L21/48 , H01L23/367 , H01L23/15
CPC分类号： H05K1/112 , H01L21/4803 , H01L21/486 , H01L23/15 , H01L23/3675 , H01L23/49822 , H01L23/49827 , H01L2224/16225 , H01L2224/16227 , H01L2224/32245 , H01L2224/73253 , H01L2924/00014 , H01L2924/10253 , H05K3/0014 , H05K3/4605 , H05K3/4644 , H05K2201/096 , H05K2201/09827 , H05K2201/10287 , H05K2201/10371 , H05K2201/10674 , H05K2203/0108 , H05K2203/0228 , H05K2203/025 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , H01L2924/00 , H01L2224/0401
摘要： Disclosed are embodiments of a glass core substrate for an integrated circuit (IC) device. The glass core substrate includes a glass core and build-up structures on opposing sides of the glass core. Electrically conductive terminals may be formed on both sides of the glass core substrate. An IC die may be coupled with the terminals on one side of the substrate, whereas the terminals on the opposing side may be coupled with a next-level component, such as a circuit board. The glass core may comprise a single piece of glass in which conductors have been formed, or the glass core may comprise two or more glass sections that have been joined together, each section having conductors. The conductors extend through the glass core, and one or more of the conductors may be electrically coupled with the build-up structures disposed over the glass core. Other embodiments are described and claimed.
摘要翻译：公开了用于集成电路（IC）装置的玻璃芯基板的实施例。玻璃芯基板包括在玻璃芯的相对侧上的玻璃芯和堆积结构。导电端子可以形成在玻璃芯基板的两侧。 IC芯片可以与衬底的一侧上的端子耦合，而相对侧上的端子可以与诸如电路板的下一级组件耦合。玻璃芯可以包括其中已经形成导体的单片玻璃，或者玻璃芯可以包括已经连接在一起的两个或更多个玻璃部分，每个部分具有导体。导体延伸穿过玻璃芯，并且一个或多个导体可以与设置在玻璃芯上的积聚结构电耦合。描述和要求保护其他实施例。

2. 发明授权

US09445496B2 Glass clad microelectronic substrate 有权
标题翻译：玻璃微电子衬底
公开(公告)号：US09445496B2
公开(公告)日：2016-09-13
申请号：US13993340
申请日：2012-03-07
申请人： Qing Ma , Johanna M Swan
发明人： Qing Ma , Johanna M Swan
IPC分类号： H05K5/00 , H05K1/00 , H05K1/11 , H05K1/03 , H01L23/498 , H05K3/40 , H01L23/00
CPC分类号： H01L23/49827 , H01L21/4853 , H01L21/4857 , H01L21/486 , H01L23/49816 , H01L23/49822 , H01L23/49838 , H01L23/49894 , H01L24/16 , H01L2224/131 , H01L2224/13111 , H01L2224/16238 , H01L2224/81192 , H01L2924/00013 , H01L2924/12042 , H05K1/0306 , H05K1/181 , H05K3/40 , H05K2201/10378 , Y10T29/49147 , H01L2924/00014 , H01L2224/13099 , H01L2224/05099 , H01L2224/05599 , H01L2924/014 , H01L2924/00
摘要： Embodiments of the present description relate to the field of fabricating microelectronic substrates. The microelectronic substrate may include a trace routing structure disposed between opposing glass layers. The trace routing structure may comprise one or more dielectric layers having conductive traces formed thereon and therethrough. Also disclosed are embodiments of a microelectronic package including a microelectronic device disposed proximate one glass layer of the microelectronic substrate and coupled with the microelectronic substrate by a plurality of interconnects.
摘要翻译：本说明书的实施例涉及制造微电子基板的领域。微电子衬底可以包括布置在相对的玻璃层之间的迹线路由结构。迹线布线结构可以包括一个或多个具有形成在其上并具有导电迹线的电介质层。还公开了微电子封装的实施例，其包括微电子器件，微电子器件设置在微电子衬底的一个玻璃层附近，并通过多个互连与微电子衬底耦合。

3. 发明授权

US08940697B2 Compositions and methods for the treatment of myocardial ischemia/reperfusion injury with Annexin A1 short peptide 有权
标题翻译：用Annexin A1短肽治疗心肌缺血/再灌注损伤的组合物和方法
公开(公告)号：US08940697B2
公开(公告)日：2015-01-27
申请号：US13502219
申请日：2010-10-15
申请人： Mihai V. Podgoreanu , Zhiquan Zhang , Qing Ma
发明人： Mihai V. Podgoreanu , Zhiquan Zhang , Qing Ma
IPC分类号： A61K38/06 , C07K5/08 , A61P9/10 , A61K38/17
CPC分类号： A61K38/1709
摘要： The present invention provides a method of treating, ameliorating or preventing myocardial ischemia/reperfusion injury in a subject in need thereof, by administering to the subject a therapeutically effective amount of an annexin A1 short peptide (ANXA1sp).
摘要翻译：本发明提供了通过向受试者施用治疗有效量的膜联蛋白A1短肽（ANXA1sp）来治疗，改善或预防有需要的受试者的心肌缺血/再灌注损伤的方法。

4. 发明申请

US20140182377A1 METHOD, APPARATUS AND SYSTEM FOR PROVIDING METERING OF ACCELERATION 有权
标题翻译：方法，提供加速度计的装置和系统
公开(公告)号：US20140182377A1
公开(公告)日：2014-07-03
申请号：US13730634
申请日：2012-12-28
申请人： Kevin L. Lin , Faras Eid , Qing Ma
发明人： Kevin L. Lin , Faras Eid , Qing Ma
IPC分类号： G01P15/10 , B81C1/00 , B81B3/00
CPC分类号： G01P15/105 , G01P15/08
摘要： Techniques and mechanisms to provide for metering acceleration. In an embodiment, a microelectromechanical accelerometer includes a magnet, a mass, and a first support beam portion and second support beam portion for suspension of the mass. Resonance frequency characteristics of the first support beam portion and second support beam portion, based on the magnet and a current conducted by the first support beam portion and second support beam portion, are indicative of acceleration of the mass. In another embodiment, the accelerometer further includes a first wire portion and a second wire portion which are each coupled to the mass and further coupled to a respective anchor for exchanging a signal with the first wire portion and the second wire portion. The first wire portion and the second wire portion provide for biasing of the mass.
摘要翻译：提供计量加速度的技术和机制。在一个实施例中，微机电加速度计包括用于悬挂质量的磁体，质量块和第一支撑梁部分和第二支撑梁部分。基于磁体的第一支撑梁部分和第二支撑梁部分的共振频率特性以及由第一支撑梁部分和第二支撑梁部分传导的电流表示质量的加速度。在另一个实施例中，加速度计还包括第一线部分和第二线部分，每个第一线部分和第二线部分均耦合到质量块，并且还耦合到相应的锚，用于与第一线部分和第二线部分交换信号。第一线部分和第二线部分提供质量的偏压。

5. 发明申请

US20140002178A1 SEMICONDUCTOR PACKAGE WITH MECHANICAL FUSE 有权
标题翻译：具有机械保险丝的半导体封装
公开(公告)号：US20140002178A1
公开(公告)日：2014-01-02
申请号：US13537573
申请日：2012-06-29
申请人： Weng Hong Teh , Kevin L. Lin , Feras Eid , Qing Ma
发明人： Weng Hong Teh , Kevin L. Lin , Feras Eid , Qing Ma
IPC分类号： H01L29/84 , H01H85/48
CPC分类号： H01L24/19 , H01H1/0036 , H01H59/0009 , H01L23/5382 , H01L23/5389 , H01L2224/04105 , H01L2224/73267 , H01L2924/12042 , H01L2924/1461 , H01L2924/00
摘要： A semiconductor package having a mechanical fuse therein and methods to form a semiconductor package having a mechanical fuse therein are described. For example, a semiconductor structure includes a semiconductor package. A semiconductor die is housed in the semiconductor package. A microelectromechanical system (MEMS) device is housed in the semiconductor package. The MEMS device has a suspended portion. A mechanical fuse is housed in the semiconductor package and either coupled to, or decoupled from, the suspended portion of the MEMS device.
摘要翻译：描述了具有机械熔断器的半导体封装以及形成其中具有机械熔丝的半导体封装的方法。例如，半导体结构包括半导体封装。半导体管芯被容纳在半导体封装中。微机电系统（MEMS）装置容纳在半导体封装中。 MEMS器件具有悬挂部分。机械保险丝容纳在半导体封装中，并且耦合到MEMS器件的悬置部分或从MEMS器件的悬挂部分解耦。

6. 发明申请

US20130249109A1 INTERPOSER FOR HERMETIC SEALING OF SENSOR CHIPS AND FOR THEIR INTEGRATION WITH INTEGRATED CIRCUIT CHIPS 有权
标题翻译：传感器盖的密封和用于集成电路卡的集成的间隔器
公开(公告)号：US20130249109A1
公开(公告)日：2013-09-26
申请号：US13631744
申请日：2012-09-28
申请人： Qing MA , Johanna M. SWAN , Min TAO , Charles A. GEALER , Edward A. ZARBOCK
发明人： Qing MA , Johanna M. SWAN , Min TAO , Charles A. GEALER , Edward A. ZARBOCK
IPC分类号： H01L23/48 , H01L23/00
CPC分类号： B81C1/00301 , B81B7/007 , B81C1/00238 , B81C2203/0145 , G01P15/0802 , H01L23/481 , H01L23/49816 , H01L23/5384 , H01L24/03 , H01L25/0652 , H01L2224/0401 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2924/01327 , H01L2924/07811 , H01L2924/12042 , H01L2924/1461 , H01L2924/00 , H01L2924/014
摘要： Integration of sensor chips with integrated circuit (IC) chips. At least a first sensor chip including a first sensor is affixed to a first side of an interposer to hermitically seal the first sensor within a first cavity. An IC chip is affixed to a second side of the interposer opposite the first sensor, the IC chip is electrically coupled to the first sensor by a through via in the interposer. In embodiments, the first sensor includes a MEMS device and the IC chip comprises a circuit to amplify a signal from the MEMS device. The interposer may be made of glass, with the first sensor chip and the IC chip flip-chip bonded to the interposer by compression or solder. Lateral interconnect traces provide I/O between the devices on the interposer and/or a PCB upon which the interpose is affixed.
摘要翻译：传感器芯片与集成电路（IC）芯片的集成。至少包括第一传感器的第一传感器芯片固定到插入件的第一侧，以将第一传感器密封在第一腔内。 IC芯片被固定到与第一传感器相对的插入件的第二侧，IC芯片通过插入器中的通孔电耦合到第一传感器。在实施例中，第一传感器包括MEMS器件，并且IC芯片包括放大来自MEMS器件的信号的电路。插入器可以由玻璃制成，其中第一传感器芯片和IC芯片倒装芯片通过压缩或焊接接合到插入器。横向互连迹线在插入件上的器件和/或其上插入插入物的PCB之间提供I / O。

7. 发明申请

US20130188395A1 ELECTROMAGNETIC INDUCTION ANTENNA PLATE, BACK-LIGHT AND DISPLAY DEVICE 有权
标题翻译：电磁感应天线板，背光和显示设备
公开(公告)号：US20130188395A1
公开(公告)日：2013-07-25
申请号：US13699218
申请日：2012-07-20
申请人： Hao Zhou , Qing Ma
发明人： Hao Zhou , Qing Ma
IPC分类号： F21V8/00
CPC分类号： G02B6/0011 , G06F3/0412 , G06F3/046
摘要： Embodiments of the invention provides an electromagnetic induction antenna plate, a back-light and a display device, and the electromagnetic induction antenna plate comprises a wiring layer and a fixing structure for attaching the wiring layer to a back plate of a back-light, wherein the wiring layer comprises a first surface facing the back plate and a second surface coated with a reflective material and facing a light guide plate of the back-light when amounted to the back-light.
摘要翻译：本发明的实施例提供一种电磁感应天线板，背光灯和显示装置，电磁感应天线板包括布线层和用于将布线层附着到背光板的背板的固定结构，其中布线层包括面向背板的第一表面和涂覆有反射材料的第二表面，并且当与背光相对时面向背光的导光板。

8. 发明申请

US20130148329A1 DIRECT-TYPE BACKLIGHT DEVICE AND DISPLAY DEVICE 审中-公开
标题翻译：直接型背光装置和显示装置
公开(公告)号：US20130148329A1
公开(公告)日：2013-06-13
申请号：US13703104
申请日：2012-09-05
申请人： Hao Zhou , Qing Ma , Daekeun Yoon , Fei Shang
发明人： Hao Zhou , Qing Ma , Daekeun Yoon , Fei Shang
IPC分类号： G09F13/04
CPC分类号： G09F13/04 , G02F1/133603 , G02F1/133608 , G02F2001/133607
摘要： A direct-type backlight device and a display device having the direct-type backlight device are disclosed. The direct-type backlight device comprises: a backplane, a plurality of light-emitting units arranged on the backplane, and a diffusion plate over the light-emitting units, wherein at least one of the light-emitting units is provided at an upper end thereof with a transparent supporter for supporting the diffusion plate.
摘要翻译：公开了具有直型背光装置的直型背光装置和显示装置。直接型背光装置包括：背板，布置在背板上的多个发光单元和在发光单元上方的扩散板，其中至少一个发光单元设置在上端具有用于支撑扩散板的透明支撑件。

9. 发明授权

US08388171B2 Waterproof LED lamp tube and casing of same 有权
标题翻译：防水LED灯管及套管相同
公开(公告)号：US08388171B2
公开(公告)日：2013-03-05
申请号：US13275942
申请日：2011-10-18
申请人： Chienchen Tung , Qing Ma , Kegang Yue , Deliang Xiao , Xianhua Zhao
发明人： Chienchen Tung , Qing Ma , Kegang Yue , Deliang Xiao , Xianhua Zhao
IPC分类号： F21V21/00
CPC分类号： F21V19/0045 , F21V15/015 , F21V31/00
摘要： An LED lamp tube with improved sealing and cooling performance includes a plastic tube shell, an LED lamp strip, a metal casing and two end caps. The plastic tube shell is elongate and includes a light condensing structure and a light reflection structure integrally formed by extrusion and an installation chamber formed between the light condensing structure and the light reflection structure. The LED lamp strip is held in the installation chamber and at one side of the light reflection structure. The metal casing is coupled on the outer side of the light reflection structure. Each of the end caps is coupled on each of two ends of the plastic tube shell, thus can achieve IP67 waterproof and dustproof level, and also can resolve cooling problem of the lamp tube.
摘要翻译：具有改进的密封和冷却性能的LED灯管包括塑料管壳，LED灯条，金属外壳和两个端盖。塑料管壳是细长的，并且包括聚光结构和通过挤压一体形成的光反射结构和形成在聚光结构和光反射结构之间的安装室。 LED灯条被保持在安装室和光反射结构的一侧。金属外壳耦合在光反射结构的外侧。每个端盖都耦合在塑料管壳的两端，从而可以实现IP67防水防尘等级，也可以解决灯管的冷却问题。

10. 发明申请

US20120263626A1 Miniature Chemical Analysis System 审中-公开
标题翻译：微型化学分析系统
公开(公告)号：US20120263626A1
公开(公告)日：2012-10-18
申请号：US13464847
申请日：2012-05-04
申请人： Li-Peng Wang , Qing Ma
发明人： Li-Peng Wang , Qing Ma
IPC分类号： G01N27/00 , B23P15/00 , C30B33/08
CPC分类号： G01N30/6095 , B82Y15/00 , B82Y30/00 , G01N29/022 , G01N29/036 , G01N2030/025 , G01N2291/0224 , G01N2291/0255 , G01N2291/0256 , G01N2291/0423 , G01N2291/0426 , Y10T29/49117
摘要： An apparatus, according to one aspect, may include a chromatograph and a bulk acoustic resonator. The chromatograph may include a channel that is defined at least partially in a monolithic substrate. The channel may have an inlet to receive a sample and an outlet. A chromatography material may be included in the channel. The bulk acoustic resonator may have a first electrode and a second electrode that has a chemically functionalized surface. The chemically functionalized surface may be included in a chamber that is defined at least partially in the monolithic substrate and that is coupled with the outlet of the channel. Methods of making and using such apparatus, and systems including such apparatus, are also disclosed.
摘要翻译：根据一个方面的装置可以包括色谱仪和体声波谐振器。色谱仪可以包括至少部分地限定在整体式衬底中的通道。通道可以具有用于接收样品和出口的入口。色谱材料可以包括在通道中。体声波谐振器可以具有第一电极和具有化学官能化表面的第二电极。化学官能化的表面可以包括在至少部分地限定在整体式衬底中并且与通道的出口耦合的室中。还公开了制造和使用这种装置的方法，以及包括这种装置的系统。

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