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1. 发明申请

US20190221607A1 MICROFABRICATED DEVICE WITH PIEZOELECTRIC SUBSTRATE AND METHOD OF MANUFACTURE 审中-公开
公开(公告)号：US20190221607A1
公开(公告)日：2019-07-18
申请号：US16246506
申请日：2019-01-13
申请人： Innovative Micro Technology
发明人： Christopher S. GUDEMAN
IPC分类号： H01L27/20 , H03H9/02 , H03H9/145 , H03H9/05 , H03H9/64 , H01L41/047 , H01L41/187 , H01L41/313 , H01L41/338 , H03H3/08 , H01H59/00
CPC分类号： H01L27/20 , H01H59/0009 , H01H2239/01 , H01L41/0477 , H01L41/1873 , H01L41/1876 , H01L41/313 , H01L41/338 , H03H3/08 , H03H9/02559 , H03H9/0542 , H03H9/145 , H03H9/64
摘要： Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second piezoelectric substrate, and coupling the two substrates using a hermetic seal. The deformable plate may have at least one shunt bar located at a nodal line of a vibrational mode of the deformable plate, so that the shunt bar remains relatively stationary when the plate is vibrating in that vibrational mode. The second piezoelectric substrate may include lithium tantalate (LiTaO3) or lithium niobate (LiNiO3) or lead zirconate titanate (Pb[Zr(x)Ti(1−x)]O3), or integrated circuits formed thereon.

2. 发明申请

US20190172672A1 Switch Cell Having A Semiconductor Switch Element And Micro-Electromechanical Switch Element 审中-公开
公开(公告)号：US20190172672A1
公开(公告)日：2019-06-06
申请号：US16324445
申请日：2017-07-18
申请人： Siemens Aktiengesellschaft
发明人： Anne Bauer , Werner Hartmann , Holger Schönherr
IPC分类号： H01H59/00 , H03K17/687 , H01H89/00
CPC分类号： H01H59/0009 , H01H9/542 , H01H89/00 , H01H2071/008 , H03K17/687
摘要： Various embodiments include a switch cell comprising: a semiconductor switch element; a micro-electromechanical switch element; and an electronic actuation circuit. The semiconductor switch element and the micro-electromechanical switch element are connected in parallel. In a switch-off process for the switch cell, the semiconductor switch element is switched off after the micro-electromechanical switch element is switched off.

3. 发明申请

US20180315572A1 CURRENT HANDLING IN LEGS AND ANCHORS OF RF-SWITCH 审中-公开
公开(公告)号：US20180315572A1
公开(公告)日：2018-11-01
申请号：US15771038
申请日：2016-11-14
申请人： CAVENDISH KINETICS, INC.
发明人： Robertus Petrus VAN KAMPEN , Richard L. KNIPE
IPC分类号： H01H59/00 , B81B7/00 , B81C1/00
CPC分类号： H01H59/0009 , B81B7/0006 , B81B2201/01 , B81B2203/0307 , B81B2203/04 , B81B2207/07 , B81C1/00166 , H01G5/16 , H01G5/38 , H01H2001/0084 , H01H2203/026
摘要： The present invention generally relates to a mechanism for making the anchor of the MEMS switch more robust for current handling.

4. 发明授权

US10081540B2 Planar cavity MEMS and related structures, methods of manufacture and design structures 有权
公开(公告)号：US10081540B2
公开(公告)日：2018-09-25
申请号：US15807715
申请日：2017-11-09
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Anthony K. Stamper , John G. Twombly
IPC分类号： H01H1/10 , B81C1/00 , H01L41/113 , H01H59/00 , G06F17/50 , B81B3/00 , H01H1/00 , H01H57/00
CPC分类号： B81B3/0072 , B81B3/0021 , B81B2201/01 , B81B2201/014 , B81B2203/0118 , B81B2203/0315 , B81B2203/04 , B81C1/0015 , B81C1/00365 , B81C1/00476 , B81C1/00619 , B81C1/00626 , B81C1/00666 , B81C2201/0109 , B81C2201/013 , B81C2201/0167 , B81C2201/017 , B81C2203/0136 , B81C2203/0172 , G06F17/5068 , G06F17/5072 , H01H1/0036 , H01H57/00 , H01H59/0009 , H01H2057/006 , H01L41/1136 , H01L2924/0002 , Y10S438/937 , Y10T29/42 , Y10T29/435 , Y10T29/49002 , Y10T29/49105 , Y10T29/49121 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/5313 , H01L2924/00
摘要： A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes patterning a wiring layer to form at least one fixed plate and forming a sacrificial material on the wiring layer. The method further includes forming an insulator layer of one or more films over the at least one fixed plate and exposed portions of an underlying substrate to prevent formation of a reaction product between the wiring layer and a sacrificial material. The method further includes forming at least one MEMS beam that is moveable over the at least one fixed plate. The method further includes venting or stripping of the sacrificial material to form at least a first cavity.

5. 发明授权

US10074491B2 Rapid micro electro mechanical system switching apparatus 有权
公开(公告)号：US10074491B2
公开(公告)日：2018-09-11
申请号：US15512285
申请日：2015-07-10
申请人： Sony Corporation
发明人： Shinya Morita
IPC分类号： H01H1/00
CPC分类号： H01H1/0036 , B81B2201/033 , B81B2203/0136 , B81B2203/051 , H01H59/0009 , H01H2001/0042 , H01H2001/0063 , H01H2001/0078
摘要： [Object] To be capable of promptly performing a switching operation of a switch.[Solving Means] In a switching apparatus according to an embodiment of the present technology, a movable electrode includes a first movable electrode piece, a second movable electrode piece, and a movable contact point. A first fixed electrode includes first and second fixed electrode pieces, the first and second fixed electrode pieces facing each other with the first movable electrode piece disposed between the first and second fixed electrode pieces, the first fixed electrode piece facing the first movable electrode piece with a gap narrower than a gap between the second fixed electrode piece and the first movable electrode piece. A second fixed electrode includes third and fourth fixed electrode pieces, the third and fourth fixed electrode pieces facing each other with the second movable electrode piece disposed between the third and fourth fixed electrode pieces, the third fixed electrode piece facing the second movable electrode piece with a gap narrower than a gap between the fourth fixed electrode piece and the second movable electrode piece. A first fixed contact point is in contact with the movable contact point, the movable contact point moving in a first direction by an electrostatic attractive force between the movable electrode and the first fixed electrode. A second fixed contact point is in contact with the movable contact point, the movable contact point moving in a second direction opposite to the first direction by an electrostatic attractive force between the movable electrode and the second fixed electrode.

6. 发明授权

US10011480B2 Planar cavity MEMS and related structures, methods of manufacture and design structures 有权
公开(公告)号：US10011480B2
公开(公告)日：2018-07-03
申请号：US15403424
申请日：2017-01-11
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Christopher V. Jahnes , Anthony K. Stamper
IPC分类号： H01P1/10 , B81B3/00 , B81C1/00 , H01L41/113 , H01H57/00 , G06F17/50 , H01H1/00 , H01H59/00
CPC分类号： B81B3/0072 , B81B3/0021 , B81B2201/01 , B81B2201/014 , B81B2203/0118 , B81B2203/0315 , B81B2203/04 , B81C1/0015 , B81C1/00365 , B81C1/00476 , B81C1/00619 , B81C1/00626 , B81C1/00666 , B81C2201/0109 , B81C2201/013 , B81C2201/0167 , B81C2201/017 , B81C2203/0136 , B81C2203/0172 , G06F17/5068 , G06F17/5072 , H01H1/0036 , H01H57/00 , H01H59/0009 , H01H2057/006 , H01L41/1136 , H01L2924/0002 , Y10S438/937 , Y10T29/42 , Y10T29/435 , Y10T29/49002 , Y10T29/49105 , Y10T29/49121 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/5313 , H01L2924/00
摘要： A method of forming a Micro-Electro-Mechanical System (MEMS) includes forming a lower electrode on a first insulator layer within a cavity of the MEMS. The method further includes forming an upper electrode over another insulator material on top of the lower electrode which is at least partially in contact with the lower electrode. The forming of the lower electrode and the upper electrode includes adjusting a metal volume of the lower electrode and the upper electrode to modify beam bending.

7. 发明授权

US10005661B2 Planar cavity MEMS and related structures, methods of manufacture and design structures 有权
公开(公告)号：US10005661B2
公开(公告)日：2018-06-26
申请号：US15215182
申请日：2016-07-20
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Anthony K. Stamper , John G. Twombly
IPC分类号： H01H1/10 , B81C1/00 , H01L41/113 , H01H57/00 , B81B3/00 , G06F17/50 , H01H1/00 , H01H59/00
CPC分类号： B81B3/0072 , B81B3/0021 , B81B2201/01 , B81B2201/014 , B81B2203/0118 , B81B2203/0315 , B81B2203/04 , B81C1/0015 , B81C1/00365 , B81C1/00476 , B81C1/00619 , B81C1/00626 , B81C1/00666 , B81C2201/0109 , B81C2201/013 , B81C2201/0167 , B81C2201/017 , B81C2203/0136 , B81C2203/0172 , G06F17/5068 , G06F17/5072 , H01H1/0036 , H01H57/00 , H01H59/0009 , H01H2057/006 , H01L41/1136 , H01L2924/0002 , Y10S438/937 , Y10T29/42 , Y10T29/435 , Y10T29/49002 , Y10T29/49105 , Y10T29/49121 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/5313 , H01L2924/00
摘要： A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes patterning a wiring layer to form at least one fixed plate and forming a sacrificial material on the wiring layer. The method further includes forming an insulator layer of one or more films over the at least one fixed plate and exposed portions of an underlying substrate to prevent formation of a reaction product between the wiring layer and a sacrificial material. The method further includes forming at least one MEMS beam that is moveable over the at least one fixed plate. The method further includes venting or stripping of the sacrificial material to form at least a first cavity.

8. 发明申请

US20180167310A1 DATA FLOW CONFIGURATION IN HYBRID SYSTEM OF SILICON AND MICRO-ELECTRO-MECHANICAL-SWITCH (MEMS) ELEMENTS 审中-公开
公开(公告)号：US20180167310A1
公开(公告)日：2018-06-14
申请号：US15378792
申请日：2016-12-14
申请人： International Business Machines Corporation
发明人： Keshav G. KAMBLE
IPC分类号： H04L12/729 , H04L12/707 , H04L12/751 , H04L12/715 , H04L12/931 , H04L12/721
CPC分类号： H04L45/125 , H01H59/0009 , H04L45/02 , H04L45/22 , H04L45/24 , H04L45/306 , H04L45/38 , H04L45/42 , H04L45/64 , H04L45/66 , H04L49/70
摘要： Certain embodiments of the present disclosure provide a method for communicating data flows. The method generally includes receiving control flow information corresponding to a data flow for communication from a first device to a second device, and determining one or more characteristics of the data flow based on the control flow information. For example, the one or more characteristics may include whether the data flow is a mice flow or an elephant flow. In certain aspects, the method further includes communicating the data flow based on the determined characteristics.

9. 发明申请

US20180122605A1 ELECTROMECHANICAL POWER SWITCH INTEGRATED CIRCUITS AND DEVICES AND METHODS THEREOF 审中-公开
公开(公告)号：US20180122605A1
公开(公告)日：2018-05-03
申请号：US15785120
申请日：2017-10-16
申请人： INOSO, LLC
发明人： Kiyoshi Mori , Ziep Tran , Giang Trung Dao , Michael Edward Ramon
IPC分类号： H01H59/00 , H01H49/00 , B81B3/00 , H01H1/00
CPC分类号： H01H59/0009 , B81B3/0086 , H01H1/0094 , H01H49/00
摘要： An electromechanical power switch device and methods thereof. At least some of the illustrative embodiments are devices including a semiconductor substrate, at least one integrated circuit device on a front surface of the semiconductor substrate, an insulating layer on the at least one integrated circuit device, and an electromechanical power switch on the insulating layer. By way of example, the electromechanical power switch may include a source and a drain, a body region disposed between the source and the drain, and a gate including a switching metal layer. In some embodiments, the body region includes a first body portion and a second body portion spaced a distance from the first body portion and defining a body discontinuity therebetween. Additionally, in various examples, the switching metal layer may be disposed over the body discontinuity.

10. 发明申请

US20180112971A1 OPTICAL SENSOR HAVING VARIABLE MEASURING CHANNELS 审中-公开
公开(公告)号：US20180112971A1
公开(公告)日：2018-04-26
申请号：US15497152
申请日：2017-04-25
申请人： TESA SA
发明人： Thomas JENSEN , Patrick ILG , Julien CHARDONNENS , Lorenz LEIMGRUBER , Alessandro NARDULLI
IPC分类号： G01B11/02 , G01B11/00
CPC分类号： G01B11/026 , G01B5/008 , G01B11/005 , G01B11/007 , G01B21/047 , G01B2210/58 , G01D5/268 , H01H59/0009
摘要： Optical sensors are adapted for distance measurement by emission and capture of measuring radiation reflected from an object to be measured. The optical sensors can be used with measuring devices, including coordinate measuring machines. The optical sensors have an optomechanical coupling unit, configured for automated coupling of the optical sensor to the measuring device and for bidirectional measuring radiation transmission between measuring device and optical sensor. The optical sensors have a first optical measuring channel, by which bidirectional measuring radiation transmission is provided between the measuring device and a first exit window of the optical sensor. The optical sensors have a second optical measuring channel, by which bidirectional measuring radiation transmission is provided between the measuring device and a second exit window of the optical sensor, and a switch for controlled variation of the measuring radiation transmission between at least the first or the second optical measuring channel.

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