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1. 发明授权

US08081473B2 Apparatus and method of direct water cooling several parallel circuit cards each containing several chip packages 失效
标题翻译：直接水冷几种并行电路卡的装置和方法，每个包含几个芯片封装
公开(公告)号：US08081473B2
公开(公告)日：2011-12-20
申请号：US12185520
申请日：2008-08-04
申请人： Thomas M. Cipolla , Evan George Colgan , Paul W. Coteus , Shawn Anthony Hall , Shurong Tian
发明人： Thomas M. Cipolla , Evan George Colgan , Paul W. Coteus , Shawn Anthony Hall , Shurong Tian
IPC分类号： H05K5/00 , H05K7/20 , G06F1/20 , F28D15/00 , H01L23/495
CPC分类号： H01L23/473 , F28D15/00 , F28D15/02 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A cooling apparatus, system and like method for an electronic device includes a plurality of heat producing electronic devices affixed to a wiring substrate. A plurality of heat transfer assemblies each include heat spreaders and thermally communicate with the heat producing electronic devices for transferring heat from the heat producing electronic devices to the heat transfer assemblies. The plurality of heat producing electronic devices and respective heat transfer assemblies are positioned on the wiring substrate having the regions overlapping. A heat conduit thermally communicates with the heat transfer assemblies. The heat conduit circulates thermally conductive fluid therethrough in a closed loop for transferring heat to the fluid from the heat transfer assemblies via the heat spreader. A thermally conductive support structure supports the heat conduit and thermally communicates with the heat transfer assemblies via the heat spreader transferring heat to the fluid of the heat conduit from the support structure.
摘要翻译：电子设备的冷却装置，系统等方法包括固定在布线基板上的多个发热电子器件。多个传热组件各自包括散热器，并与制热电子设备热连通，用于将热量从发热电子设备传递到传热组件。多个发热电子器件和各个传热组件位于具有重叠区域的布线基板上。热导管与传热组件热连通。热导管将导热流体循环通过其中的闭环，用于通过散热器将热量传递给来自传热组件的流体。导热支撑结构支撑热导管，并且通过散热器与传热组件热连通，散热器将热量从支撑结构传递到热导管的流体。

2. 发明申请

US20110173488A1 NON-VOLATILE MEMORY FOR CHECKPOINT STORAGE 失效
标题翻译：用于检查点存储的非易失性存储器
公开(公告)号：US20110173488A1
公开(公告)日：2011-07-14
申请号：US13004005
申请日：2011-01-10
申请人： Matthias A. Blumrich , Dong Chen , Thomas M. Cipolla , Paul W. Coteus , Alan Gara , Philip Heidelberger , Mark J. Jeanson , Gerard V. Kopcsay , Martin Ohmacht , Todd E. Takken
发明人： Matthias A. Blumrich , Dong Chen , Thomas M. Cipolla , Paul W. Coteus , Alan Gara , Philip Heidelberger , Mark J. Jeanson , Gerard V. Kopcsay , Martin Ohmacht , Todd E. Takken
IPC分类号： G06F11/00 , G06F11/14
CPC分类号： G06F11/1438 , G06F2201/82 , G06F2201/84
摘要： A system, method and computer program product for supporting system initiated checkpoints in high performance parallel computing systems and storing of checkpoint data to a non-volatile memory storage device. The system and method generates selective control signals to perform checkpointing of system related data in presence of messaging activity associated with a user application running at the node. The checkpointing is initiated by the system such that checkpoint data of a plurality of network nodes may be obtained even in the presence of user applications running on highly parallel computers that include ongoing user messaging activity. In one embodiment, the non-volatile memory is a pluggable flash memory card.
摘要翻译：一种用于在高性能并行计算系统中支持系统发起的检查点并将检查点数据存储到非易失性存储器存储设备的系统，方法和计算机程序产品。系统和方法产生选择性控制信号，以在存在与在节点处运行的用户应用相关联的消息传送活动的情况下执行系统相关数据的检查点。检查点由系统启动，使得即使在存在包括正在进行的用户消息活动的高度并行计算机上的用户应用的情况下，也可以获得多个网络节点的检查点数据。在一个实施例中，非易失性存储器是可插拔闪存卡。

3. 发明申请

US20100025010A1 APPARATUS AND METHOD OF DIRECT WATER COOLING SEVERAL PARALLEL CIRCUIT CARDS EACH CONTAINING SEVERAL CHIP PACKAGES 失效
标题翻译：直接水冷却装置和方法几个并行电路卡每个包含几个芯片包
公开(公告)号：US20100025010A1
公开(公告)日：2010-02-04
申请号：US12185520
申请日：2008-08-04
申请人： Thomas M. Cipolla , Evan George Colgan , Paul W. Coteus , Shawn Anthony Hall , Shurong Tian
发明人： Thomas M. Cipolla , Evan George Colgan , Paul W. Coteus , Shawn Anthony Hall , Shurong Tian
IPC分类号： F28D21/00 , F28D15/00
CPC分类号： H01L23/473 , F28D15/00 , F28D15/02 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A cooling apparatus, system and like method for an electronic device includes a plurality of heat producing electronic devices affixed to a wiring substrate. A plurality of heat transfer assemblies each include heat spreaders and thermally communicate with the heat producing electronic devices for transferring heat from the heat producing electronic devices to the heat transfer assemblies The plurality of heat producing electronic devices and respective heat transfer assemblies are positioned on the wiring substrate having the regions overlapping. A heat conduit thermally communicates with the heat transfer assemblies. The heat conduit circulates thermally conductive fluid therethrough in a closed loop for transferring heat to the fluid from the heat transfer assemblies via the heat spreader. A thermally conductive support structure supports the heat conduit and thermally communicates with the heat transfer assemblies via the heat spreader transferring heat to the fluid of the heat conduit from the support structure.
摘要翻译：电子设备的冷却装置，系统等方法包括固定在布线基板上的多个发热电子器件。多个传热组件各自包括散热器并与用于将热量从发热电子器件传递到传热组件的发热电子器件热连通。多个发热电子器件和相应的传热组件位于布线具有区域重叠的基板。热导管与传热组件热连通。热导管将导热流体循环通过其中的闭环，用于通过散热器将热量传递给来自传热组件的流体。导热支撑结构支撑热导管，并且通过散热器与传热组件热连通，散热器将热量从支撑结构传递到热导管的流体。

4. 发明申请

US20090303681A1 COINED-SHEET-METAL HEATSINKS FOR CLOSELY PACKAGED HEAT-PRODUCING DEVICES SUCH AS DUAL IN-LINE MEMORY MODULES (DIMMs) 有权
标题翻译：用于封闭式加热制造装置（例如双列直插式存储器模块）（DIMM）的封装金属热源
公开(公告)号：US20090303681A1
公开(公告)日：2009-12-10
申请号：US12133547
申请日：2008-06-05
申请人： Shurong Tian , Thomas M. Cipolla , Paul W. Coteus
发明人： Shurong Tian , Thomas M. Cipolla , Paul W. Coteus
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L23/367 , H01L2924/0002 , H01L2924/00
摘要： A heatsink structure and method for the cooling of closely spaced packaged heat-producing devices, such as dual-in-line memory modules (DIMMs). A folded sheet metal heatsink structure is provided which is constituted of a coined metallic material and which has a large plurality of waffle-shaped ridges extending therefrom constituting additional surface areas which are adapted to enable heat generated by hub chips to pass upwardly and then outwardly through waffle-like ridges and, thus, dissipated to the exterior, thereby imparting an improved degree of cooling to heat-producing components or devices.
摘要翻译：用于冷却紧密间隔的包装发热装置（例如双列直插存储器模块（DIMM））的散热器结构和方法。提供折叠的金属板式散热器结构，其由精制的金属材料构成，并且具有从其构成的多个楔形形状的隆起脊，构成另外的表面区域，其适于使毂芯片产生的热量向上通过，然后向外通过并且由此散发到外部，由此赋予发热部件或装置更好的冷却程度。

5. 发明授权

US07529085B2 Thermal docking fansink 有权
标题翻译：散热器散热器
公开(公告)号：US07529085B2
公开(公告)日：2009-05-05
申请号：US11480292
申请日：2006-06-30
申请人： Albert V. Makley , Thomas M. Cipolla , Thomas R. Hildner , Vinod Kamath , Fumitoshi Kiyooka , Lawrence S. Mok , Fusanobu Nakamura
发明人： Albert V. Makley , Thomas M. Cipolla , Thomas R. Hildner , Vinod Kamath , Fumitoshi Kiyooka , Lawrence S. Mok , Fusanobu Nakamura
IPC分类号： H05K7/20
CPC分类号： G06F1/203
摘要： A fansink arrangement for a laptop computer wherein two distinct patterns of air intake can be employed. Particularly, dual air intakes of the laptop can be managed and controlled depending upon an operating mode of the computer. Thus, when the computer is in a “stand alone” mode, only one air intake is employed while in a “docking” mode of the computer two air intakes are employed.
摘要翻译：一种用于膝上型计算机的风扇排列装置，其中可以采用两种截然不同的进气模式。特别地，可以根据计算机的操作模式来管理和控制膝上型计算机的双重进气口。因此，当计算机处于“独立”模式时，在计算机的“对接”模式中仅采用一个进气口，两个进气口被采用。

6. 发明申请

US20080026628A1 Pin Grid Array Zero Insertion Force Connectors Configurable for Supporting Large Pin Counts 有权
标题翻译：针脚阵列零插入力连接器可配置为支持大引脚数
公开(公告)号：US20080026628A1
公开(公告)日：2008-01-31
申请号：US11763499
申请日：2007-06-15
申请人： Gareth Geoffrey Hougham , William Louis Brodsky , Thomas M. Cipolla , Paul William Coteus , Ronald Malfatt
发明人： Gareth Geoffrey Hougham , William Louis Brodsky , Thomas M. Cipolla , Paul William Coteus , Ronald Malfatt
IPC分类号： H01R13/625
CPC分类号： H01R13/193 , H05K7/1007
摘要： A PGA socket including a plurality of sub-socket components, which when used in combination forms a larger effective socket, includes multiple apertures configured to receive corresponding pins of an IC. The PGA socket further includes multiple contact members, each of the contact members corresponding to a respective one of the apertures. The contact members are configured to movably engage corresponding pins of the IC upon respective movement of the apertures so as to provide electrical and mechanical contact thereto. Each of the sub-socket components is configured to mechanically engage at least one of the other sub-socket components such that the contact members in each of the sub-socket components are capable of electrically connecting to corresponding pins of the IC substantially simultaneously.
摘要翻译：包括多个子插座部件的PGA插座，当组合使用时形成较大的有效插座，包括配置成接收IC的相应引脚的多个孔。 PGA插座还包括多个接触构件，每个接触构件对应于相应的一个孔。接触构件被构造成在孔的相应移动时可移动地接合IC的相应销，以便提供与其的电和机械接触。每个子插座部件被构造成机械地接合其他子插座部件中的至少一个，使得每个子插座部件中的接触部件能够基本上同时电连接到IC的相应引脚。

7. 发明授权

US5268815A High density, high performance memory circuit package 失效
标题翻译：高密度，高性能存储电路封装
公开(公告)号：US5268815A
公开(公告)日：1993-12-07
申请号：US922257
申请日：1992-07-30
申请人： Thomas M. Cipolla , Paul W. Coteus , Brian C. Derdall , Christina M. Knoedler , Alphonso P. Lanzetta , John J. Liutkus , Linda C. Matthew , Lawrence S. Mok , Irene A. Sterian
发明人： Thomas M. Cipolla , Paul W. Coteus , Brian C. Derdall , Christina M. Knoedler , Alphonso P. Lanzetta , John J. Liutkus , Linda C. Matthew , Lawrence S. Mok , Irene A. Sterian
IPC分类号： H01L25/10 , H05K3/30 , H05K7/02 , H05K7/20
CPC分类号： H05K7/023 , H01L25/105 , H05K3/301 , H01L2225/1023 , H01L2225/107 , H01L2225/1094 , H01L2924/0002 , Y10T29/53265
摘要： A high density circuit package includes a pair of planar packages, the planar packages exhibiting front and back surfaces and positioned back-to-back in the high density circuit package. Each planar package includes a flexible circuit carrier having a plurality of circuit chips mounted thereon. Front and back planar metallic heat sinks sandwich the circuit carriers, at least one of the heat sinks contacting a surface of the chips mounted on the sandwiched circuit carriers. Each heat sink is provided with air flow apertures formed in its planar surface and adjacent to each circuit chip. A circuit card interconnects with the circuit carriers in an interconnection region and is pluggable into a female connector. The planar metallic heat sinks and circuit carriers are mechanically packaged so as to provide a planar arrangement which aligns the apertures in both the front and rear heat sinks. A pair of planar packages are mechanically connected in a back-to-back arrangement so that the apertures therebetween are aligned. The associated circuit cards are also back-to-back oriented so as to enable their joint interconnection into the female connector.
摘要翻译：高密度电路封装包括一对平面封装，平面封装呈现前后表面并且背对背设置在高密度电路封装中。每个平面封装包括具有安装在其上的多个电路芯片的柔性电路载体。前后平面金属散热器夹着电路载体，至少一个散热片接触安装在夹层电路载体上的芯片表面。每个散热器设置有形成在其平面表面中并与每个电路芯片相邻的气流孔。电路卡与互连区域中的电路载体互连，并且可插入到母连接器中。平面金属散热器和电路载体被机械地封装，以便提供一个平面布置，其对准前后散热片中的孔。一对平面封装以背对背布置机械连接，使得它们之间的孔对准。相关联的电路卡也是背靠背定向的，以便使它们的连接互连到母连接器中。

8. 发明授权

US5208729A Multi-chip module 失效
标题翻译：多芯片模块
公开(公告)号：US5208729A
公开(公告)日：1993-05-04
申请号：US836672
申请日：1992-02-14
申请人： Thomas M. Cipolla , Paul W. Coteus , Glen W. Johnson , Lawrence S. Mok
发明人： Thomas M. Cipolla , Paul W. Coteus , Glen W. Johnson , Lawrence S. Mok
IPC分类号： H05K5/00 , H01L23/467 , H01L25/10 , H05K7/14 , H05K7/20
CPC分类号： H05K7/1429 , H01L23/467 , H01L25/105 , H01L2225/1005 , H01L2924/0002
摘要： A high density package for a plurality of integrated circuit chips is described, the package including a number of planar subunits. A subunit includes first and second planar metal plates and a spacer metal plate sandwiched therebetween. Each spacer metal plate is provided with a plurality of circuit-receiving apertures. A planar circuit carrier is provided for each aperture in the spacer metal plate. One face of each circuit carrier includes a plurality of bonded chips. Each circuit carrier is positioned in a circuit-receiving aperture so that rear aspects of the bonded chips bear upon the second planar metal plate. Each circuit carrier has a connector region which extends out from between the first planar metal plate and the metal spacer plate at one extremity of each circuit-receiving aperture. A circuit card is positioned at that extremity and has a plurality of interconnection areas, one for each extended connector region. The circuit card has its major surface oriented parallel to the metal plates so that the entire package presents an overall planar configuration.

9. 发明授权

US4572564A Adaptive gripping device 失效
标题翻译：自适应夹紧装置
公开(公告)号：US4572564A
公开(公告)日：1986-02-25
申请号：US630152
申请日：1984-07-12
申请人： Thomas M. Cipolla
发明人： Thomas M. Cipolla
IPC分类号： B25J15/10 , B25J15/00
CPC分类号： B25B1/2421 , B25J15/106 , Y10S294/902
摘要： A versatile robotic gripper is easily and quickly adjusted to grip objects of different geometrical shapes without changing parts and under complete machine control. Opposing jaws have a matrix of axially movable pins each of which is mechanically locked in any axial position. Actuation of an operating mechanism to move the jaws together to grasp an object depresses the pins and they collectively conform to the shape of the object; the jaws retain this shape upon release of the object. A plate is raised to unlock the pins which are returned by springs to a fixed coplanar position.
摘要翻译：多功能的机器人夹具可以方便快捷地调整，以便抓住不同几何形状的物体，而无需更换零件和完全控制机器。相对的钳口具有可轴向移动的销的矩阵，每个销被机械地锁定在任何轴向位置。操作机构的动作，将夹爪一起移动以抓住物体压下销，并且它们共同地符合物体的形状; 当释放物体时，夹爪保持这种形状。升高板以解锁由弹簧返回到固定的共面位置的销。

10. 发明授权

US4131192A Lamp parts feeding device having rotating reference frame 失效
标题翻译：具有旋转参考系的灯具部件供给装置
公开(公告)号：US4131192A
公开(公告)日：1978-12-26
申请号：US832395
申请日：1977-09-12
申请人： Thomas M. Cipolla
发明人： Thomas M. Cipolla
IPC分类号： B65G29/00 , B65G47/00
CPC分类号： B65G29/00
摘要： A parts feeder is disclosed in which randomly grouped parts are stored, oriented and discharged at a uniform rate from a rotating or indexing spacer wheel fed by stepwise movable supply apparatus having the rotating spacer wheel as its frame of reference.
摘要翻译：公开了一种零件进料器，其中随机分组的部件以具有作为其参考系的旋转间隔轮的逐步可动供给装置供给的旋转或分度间隔轮以均匀的速率进行存储，定向和排出。

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