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1. 发明授权

US08569808B1 Temperature stabilitized MEMS 有权
标题翻译：温度稳定的MEMS
公开(公告)号：US08569808B1
公开(公告)日：2013-10-29
申请号：US13441134
申请日：2012-04-06
申请人： Tung-Tsun Chen , Chia-Hua Chu , Chung-Hsien Lin , Jui-Cheng Huang
发明人： Tung-Tsun Chen , Chia-Hua Chu , Chung-Hsien Lin , Jui-Cheng Huang
IPC分类号： H01L29/66
CPC分类号： H01L23/34 , B81B7/0096 , B81B2201/0278 , B81C1/0023 , H01L23/345 , H01L27/0629 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor device with temperature control system. Embodiments of the device may include a MEMS chip including a first heater with a dedicated first temperature control loop and a CMOS chip including a second heater with a dedicated second temperature control loop. Each control loop may have a dedicated temperature sensor for controlling the thermal output of each heater. The first heater and sensor are disposed proximate to a MEMS device in the MEMS chip for direct heating thereof. The temperature of the MEMS chip and CMOS chip are independently controllable of each other via the temperature control loops.
摘要翻译：具有温度控制系统的半导体器件。该装置的实施例可以包括包括具有专用第一温度控制回路的第一加热器和包括具有专用第二温度控制回路的第二加热器的CMOS芯片的MEMS芯片。每个控制回路可以具有用于控制每个加热器的热输出的专用温度传感器。第一加热器和传感器靠近MEMS芯片中的MEMS器件设置，用于直接加热MEMS芯片。 MEMS芯片和CMOS芯片的温度可以通过温度控制回路彼此独立控制。

2. 发明申请

US20130264610A1 TEMPERATURE STABILITIZED MEMS 有权
标题翻译：温度稳定的MEMS
公开(公告)号：US20130264610A1
公开(公告)日：2013-10-10
申请号：US13441134
申请日：2012-04-06
申请人： Tung-Tsun CHEN , Chia-Hua CHU , Chung-Hsien LIN , Jui-Cheng HUANG
发明人： Tung-Tsun CHEN , Chia-Hua CHU , Chung-Hsien LIN , Jui-Cheng HUANG
IPC分类号： H01L29/66 , H01L27/06
CPC分类号： H01L23/34 , B81B7/0096 , B81B2201/0278 , B81C1/0023 , H01L23/345 , H01L27/0629 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor device with temperature control system. Embodiments of the device may include a MEMS chip including a first heater with a dedicated first temperature control loop and a CMOS chip including a second heater with a dedicated second temperature control loop. Each control loop may have a dedicated temperature sensor for controlling the thermal output of each heater. The first heater and sensor are disposed proximate to a MEMS device in the MEMS chip for direct heating thereof. The temperature of the MEMS chip and CMOS chip are independently controllable of each other via the temperature control loops.
摘要翻译：具有温度控制系统的半导体器件。该装置的实施例可以包括包括具有专用第一温度控制回路的第一加热器和包括具有专用第二温度控制回路的第二加热器的CMOS芯片的MEMS芯片。每个控制回路可以具有用于控制每个加热器的热输出的专用温度传感器。第一加热器和传感器靠近MEMS芯片中的MEMS器件设置，用于直接加热MEMS芯片。 MEMS芯片和CMOS芯片的温度可以通过温度控制回路彼此独立控制。

3. 发明申请

US20130213139A1 MEMS VACUUM LEVEL MONITOR IN SEALED PACKAGE 有权
标题翻译：密封包装中的MEMS真空度监测器
公开(公告)号：US20130213139A1
公开(公告)日：2013-08-22
申请号：US13401134
申请日：2012-02-21
申请人： Tung-Tsun CHEN , Jui-Cheng HUANG , Chung-Hsien LIN
发明人： Tung-Tsun CHEN , Jui-Cheng HUANG , Chung-Hsien LIN
IPC分类号： G01L7/00 , H01L29/84
CPC分类号： G01L21/22 , B81C99/0045 , H01L27/0688
摘要： A vacuum sensor for sensing vacuum in a sealed enclosure is provided. The sealed enclosure includes active MEMS devices desired to be maintained in vacuum conditions. The vacuum sensor includes a motion beam anchored to an internal surface in the sealed enclosure. A driving electrode is disposed beneath the motion beam and a bias is supplied to cause the motion beam to deflect through electromotive force. A sensing electrode is also provided and detects capacitance between the sensing electrode disposed on the internal surface, and the motion beam. Capacitance changes as the gap between the motion beam and the sensing electrode changes. The amount of deflection is determined by the vacuum level in the sealed enclosure. The vacuum level in the sealed enclosure is thereby sensed by the sensing electrode.
摘要翻译：提供了用于感测密封外壳中的真空的真空传感器。密封的外壳包括希望保持在真空条件下的有源MEMS器件。真空传感器包括锚定在密封外壳中的内表面的运动梁。驱动电极设置在运动光束下方，并且提供偏压以使运动光束通过电动势偏转。还提供感测电极并且检测设置在内表面上的感测电极与运动光束之间的电容。电容随着运动光束与感应电极之间的间隙而变化。偏转量由密封外壳中的真空度决定。因此，密封外壳中的真空度由感测电极感测。

4. 发明授权

US08887573B2 MEMS vacuum level monitor in sealed package 有权
标题翻译： MEMS真空度监测仪在密封包装中
公开(公告)号：US08887573B2
公开(公告)日：2014-11-18
申请号：US13401134
申请日：2012-02-21
申请人： Tung-Tsun Chen , Jui-Cheng Huang , Chung-Hsien Lin
发明人： Tung-Tsun Chen , Jui-Cheng Huang , Chung-Hsien Lin
IPC分类号： G01L11/00 , G01L13/02
CPC分类号： G01L21/22 , B81C99/0045 , H01L27/0688
摘要： A vacuum sensor for sensing vacuum in a sealed enclosure is provided. The sealed enclosure includes active MEMS devices desired to be maintained in vacuum conditions. The vacuum sensor includes a motion beam anchored to an internal surface in the sealed enclosure. A driving electrode is disposed beneath the motion beam and a bias is supplied to cause the motion beam to deflect through electromotive force. A sensing electrode is also provided and detects capacitance between the sensing electrode disposed on the internal surface, and the motion beam. Capacitance changes as the gap between the motion beam and the sensing electrode changes. The amount of deflection is determined by the vacuum level in the sealed enclosure. The vacuum level in the sealed enclosure is thereby sensed by the sensing electrode.
摘要翻译：提供了用于感测密封外壳中的真空的真空传感器。密封的外壳包括希望保持在真空条件下的有源MEMS器件。真空传感器包括锚定在密封外壳中的内表面的运动梁。驱动电极设置在运动光束下方，并且提供偏压以使运动光束通过电动势偏转。还提供感测电极并且检测设置在内表面上的感测电极与运动光束之间的电容。电容随着运动光束与感应电极之间的间隙而变化。偏转量由密封外壳中的真空度决定。因此，密封外壳中的真空度由感测电极感测。

5. 发明授权

US08762925B2 MEMS modeling system and method 有权
标题翻译： MEMS建模系统及方法
公开(公告)号：US08762925B2
公开(公告)日：2014-06-24
申请号：US13029942
申请日：2011-02-17
申请人： Tung-Tsun Chen , Yung-Chow Peng , Jui-Cheng Huang
发明人： Tung-Tsun Chen , Yung-Chow Peng , Jui-Cheng Huang
IPC分类号： G06F17/50
CPC分类号： G06F17/5081 , G06F17/5022 , G06F17/5068 , G06F2217/02 , G06F2217/06
摘要： A system and method for modeling microelectromechanical devices is disclosed. An embodiment includes separating the microelectromechanical design into separate regions and modeling the separate regions separately. Parametric parameters or parametric equations may be utilized in the separate models. The separate models may be integrated into a MEMS device model. The MEMS device model may be tested and calibrated, and then may be used to model new designs for microelectromechanical devices.
摘要翻译：公开了一种用于对微机电装置进行建模的系统和方法。一个实施例包括将微机电设计分离成单独的区域并分别对分开的区域进行建模。参数化参数或参数方程可用于分开的模型。单独的模型可以集成到MEMS器件模型中。可以对MEMS器件模型进行测试和校准，然后可以用于为微机电器件的新设计建模。

6. 发明申请

US20120215497A1 MEMS Modeling System and Method 有权
标题翻译： MEMS建模系统与方法
公开(公告)号：US20120215497A1
公开(公告)日：2012-08-23
申请号：US13029942
申请日：2011-02-17
申请人： Tung-Tsun Chen , Yung-Chow Peng , Jui-Cheng Huang
发明人： Tung-Tsun Chen , Yung-Chow Peng , Jui-Cheng Huang
IPC分类号： G06F17/50 , G06F17/10 , G06G7/62
CPC分类号： G06F17/5081 , G06F17/5022 , G06F17/5068 , G06F2217/02 , G06F2217/06
摘要： A system and method for modeling microelectromechanical devices is disclosed. An embodiment includes separating the microelectromechanical design into separate regions and modeling the separate regions separately. Parametric parameters or parametric equations may be utilized in the separate models. The separate models may be integrated into a MEMS device model. The MEMS device model may be tested and calibrated, and then may be used to model new designs for microelectromechanical devices.
摘要翻译：公开了一种用于对微机电装置进行建模的系统和方法。一个实施例包括将微机电设计分离成单独的区域并分别对分开的区域进行建模。参数化参数或参数方程可用于分开的模型。单独的模型可以集成到MEMS器件模型中。可以对MEMS器件模型进行测试和校准，然后可以用于为微机电器件的新设计建模。

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