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    • 1. 发明授权
    • Bumper retention system
    • 保险杠保持系统
    • US08827352B2
    • 2014-09-09
    • US13408048
    • 2012-02-29
    • Chen-Shih WangHamid G. KiaJohn N. OwensElisabeth J. BergerVenkat Aitharaju
    • Chen-Shih WangHamid G. KiaJohn N. OwensElisabeth J. BergerVenkat Aitharaju
    • B60R19/26
    • B60R19/34
    • A system for controlling displacement of a vulnerable component in connection with an impact event at the system. The system includes a frame structure, the vulnerable component, and a composite crush member (a) connected to the frame structure and the vulnerable component, forming a first close connection between the composite crush member and the vulnerable component and a second close connection between the composite crush member and the frame structure, (b) comprises primarily a polymer composite and is configured, and (c) is arranged in the system to fail in a predetermined manner in response to the impact event. The system also includes a retention feature configured and connected, directly or indirectly, to the vulnerable component and to the frame structure to, in operation of the system, maintain at least one of the first close connection and the second close connection during and following the composite crush member the impact event.
    • 一个系统,用于控制与该系统的冲击事件相关的易损件的位移。 该系统包括框架结构,脆弱部件和连接到框架结构和易损部件的复合挤压构件(a),在复合挤压构件和易损件之间形成第一紧密连接,以及第二紧密连接 复合挤压构件和框架结构,(b)主要包括聚合物复合材料并且被构造,并且(c)被布置在系统中以响应于冲击事件以预定方式失效。 该系统还包括保持特征,该保持特征被直接或间接地配置和间接地连接到脆弱部件和框架结构,以在系统的操作过程中保持第一紧密连接和第二紧密连接中的至少一个, 复合挤压构件的冲击事件。
    • 2. 发明申请
    • BUMPER RETENTION SYSTEM
    • 保险杠保持系统
    • US20130221692A1
    • 2013-08-29
    • US13408048
    • 2012-02-29
    • Chen-Shih WangHamid G. KiaJohn N. OwensElisabeth J. BergerVenkat Aitharaju
    • Chen-Shih WangHamid G. KiaJohn N. OwensElisabeth J. BergerVenkat Aitharaju
    • B60R19/26
    • B60R19/34
    • A system for controlling displacement of a vulnerable component in connection with an impact event at the system. The system includes a frame structure, the vulnerable component, and a composite crush member (a) connected to the frame structure and the vulnerable component, forming a first close connection between the composite crush member and the vulnerable component and a second close connection between the composite crush member and the frame structure, (b) comprises primarily a polymer composite and is configured, and (c) is arranged in the system to fail in a predetermined manner in response to the impact event. The system also includes a retention feature configured and connected, directly or indirectly, to the vulnerable component and to the frame structure to, in operation of the system, maintain at least one of the first close connection and the second close connection during and following the composite crush member the impact event.
    • 一个系统,用于控制与该系统的冲击事件相关的易损件的位移。 该系统包括框架结构,脆弱部件和连接到框架结构和易损部件的复合挤压构件(a),在复合挤压构件和易损件之间形成第一紧密连接,以及第二紧密连接 复合挤压构件和框架结构,(b)主要包括聚合物复合材料并且被构造,并且(c)被布置在系统中以响应于冲击事件以预定方式失效。 该系统还包括保持特征,该保持特征被直接或间接地配置和间接地连接到脆弱部件和框架结构,以在系统的操作过程中保持第一紧密连接和第二紧密连接中的至少一个 复合挤压构件的冲击事件。
    • 8. 发明授权
    • Packaging and de-packaging methods using shape memory polymers
    • 使用形状记忆聚合物的包装和去包装方法
    • US08733071B2
    • 2014-05-27
    • US13307494
    • 2011-11-30
    • Ingrid A. RousseauJohn N. OwensElisabeth J. BergerHamid G. Kia
    • Ingrid A. RousseauJohn N. OwensElisabeth J. BergerHamid G. Kia
    • B65B43/00B65B47/00
    • B65B33/00B29C61/02B29C61/06B29C61/10B29L2031/712
    • A method disclosed herein includes packaging and de-packaging a part. The part is packaged by placing the part adjacent to a shape memory polymer (SMP) while the SMP is in a permanent shape. The SMP is heated to a temperature above a switching temperature of the SMP, and a force is applied to the heated SMP such that it conforms to i) a shape of the part and/or ii) a desired shape for packing the part, thereby changing the SMP from the permanent shape into a temporary shape. The SMP is cooled to a temperature below the switching temperature to set the SMP into the temporary shape. The part is de-packaged by heating the SMP to a temperature above its switching temperature, thereby reverting the SMP from the temporary shape into the permanent shape and releasing the part. The part is removed from the SMP in the permanent shape.
    • 本文公开的方法包括包装和拆包部件。 通过将部件邻近形状记忆聚合物(SMP)放置在部件中,同时SMP处于永久形状。 将SMP加热到高于SMP的切换温度的温度,并且对加热的SMP施加力,使得其符合i)部件的形状和/或ii)用于包装部件的期望形状,由此 将SMP从永久形状变成临时形状。 将SMP冷却至低于开关温度的温度,将SMP设定为临时形状。 通过将SMP加热到高于其开关温度的温度来将部件取消封装,从而将SMP从临时形状恢复到永久形状并释放部件。 该部件从永久形状的SMP中移除。