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    • 1. 发明授权
    • Bumper retention system
    • 保险杠保持系统
    • US08827352B2
    • 2014-09-09
    • US13408048
    • 2012-02-29
    • Chen-Shih WangHamid G. KiaJohn N. OwensElisabeth J. BergerVenkat Aitharaju
    • Chen-Shih WangHamid G. KiaJohn N. OwensElisabeth J. BergerVenkat Aitharaju
    • B60R19/26
    • B60R19/34
    • A system for controlling displacement of a vulnerable component in connection with an impact event at the system. The system includes a frame structure, the vulnerable component, and a composite crush member (a) connected to the frame structure and the vulnerable component, forming a first close connection between the composite crush member and the vulnerable component and a second close connection between the composite crush member and the frame structure, (b) comprises primarily a polymer composite and is configured, and (c) is arranged in the system to fail in a predetermined manner in response to the impact event. The system also includes a retention feature configured and connected, directly or indirectly, to the vulnerable component and to the frame structure to, in operation of the system, maintain at least one of the first close connection and the second close connection during and following the composite crush member the impact event.
    • 一个系统,用于控制与该系统的冲击事件相关的易损件的位移。 该系统包括框架结构,脆弱部件和连接到框架结构和易损部件的复合挤压构件(a),在复合挤压构件和易损件之间形成第一紧密连接,以及第二紧密连接 复合挤压构件和框架结构,(b)主要包括聚合物复合材料并且被构造,并且(c)被布置在系统中以响应于冲击事件以预定方式失效。 该系统还包括保持特征,该保持特征被直接或间接地配置和间接地连接到脆弱部件和框架结构,以在系统的操作过程中保持第一紧密连接和第二紧密连接中的至少一个, 复合挤压构件的冲击事件。
    • 2. 发明授权
    • Packaging and de-packaging methods using shape memory polymers
    • 使用形状记忆聚合物的包装和去包装方法
    • US08733071B2
    • 2014-05-27
    • US13307494
    • 2011-11-30
    • Ingrid A. RousseauJohn N. OwensElisabeth J. BergerHamid G. Kia
    • Ingrid A. RousseauJohn N. OwensElisabeth J. BergerHamid G. Kia
    • B65B43/00B65B47/00
    • B65B33/00B29C61/02B29C61/06B29C61/10B29L2031/712
    • A method disclosed herein includes packaging and de-packaging a part. The part is packaged by placing the part adjacent to a shape memory polymer (SMP) while the SMP is in a permanent shape. The SMP is heated to a temperature above a switching temperature of the SMP, and a force is applied to the heated SMP such that it conforms to i) a shape of the part and/or ii) a desired shape for packing the part, thereby changing the SMP from the permanent shape into a temporary shape. The SMP is cooled to a temperature below the switching temperature to set the SMP into the temporary shape. The part is de-packaged by heating the SMP to a temperature above its switching temperature, thereby reverting the SMP from the temporary shape into the permanent shape and releasing the part. The part is removed from the SMP in the permanent shape.
    • 本文公开的方法包括包装和拆包部件。 通过将部件邻近形状记忆聚合物(SMP)放置在部件中,同时SMP处于永久形状。 将SMP加热到高于SMP的切换温度的温度,并且对加热的SMP施加力,使得其符合i)部件的形状和/或ii)用于包装部件的期望形状,由此 将SMP从永久形状变成临时形状。 将SMP冷却至低于开关温度的温度,将SMP设定为临时形状。 通过将SMP加热到高于其开关温度的温度来将部件取消封装,从而将SMP从临时形状恢复到永久形状并释放部件。 该部件从永久形状的SMP中移除。
    • 7. 发明授权
    • Method for enhanced dielectric curing
    • 电介质固化方法
    • US5252631A
    • 1993-10-12
    • US743626
    • 1991-08-12
    • John N. Owens
    • John N. Owens
    • C08J3/24C08K3/04C08J3/28C08K5/19C08L63/02
    • C08J3/247C08K3/04C08J2363/00
    • A heat curable resin composition consists essentially of a thermosetting resin, a curing agent chemically reacting with the resin for curing the resin upon the application of a predetermined amount of heat for a predetermined period of time, and an additive system consisting of a chemically inert salt which is soluble in the resin and carbon blacks for increasing the dielectric loss factor of the composition without a significant increase in viscosity of the composition to accelerate the dielectric heating rate. A method of preparing the heat curable resin composition includes the steps of mixing the thermosetting resin and curing agent which chemically reacts with the resin for curing the resin upon the application of a predetermined amount of heat for a predetermined period of time and mixing an additive system consisting of a chemically inert salt and carbon blacks in the resin and increasing the dielectric loss factor of the composition without a significant increase in viscosity of the composition. The composition is dielectrically heated at an accelerated rate which is faster than the rate of heating the mixture of the resin and curing agent alone.
    • 热固性树脂组合物基本上由热固性树脂组成,固化剂与树脂发生化学反应,用于在预定时间内施加预定量的热量以固化树脂,以及由化学惰性盐组成的添加剂体系 其可溶于树脂和炭黑中,以增加组合物的介电损耗因子,而不会显着增加组合物的粘度,从而加速介电加热速率。 制备热固性树脂组合物的方法包括以下步骤:将热固性树脂和固化剂混合,并在预定时间段内施加预定量的热量,与固化树脂发生化学反应,固化添加剂体系 由树脂中的化学惰性盐和炭黑组成,并增加组合物的介电损耗因子,而不会显着增加组合物的粘度。 组合物以比单独加热树脂和固化剂的混合物的速度更快的加速速率进行介电加热。