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1. 发明申请

US20140162407A1 Method And System For Semiconductor Packaging 审中-公开
标题翻译：半导体封装的方法和系统
公开(公告)号：US20140162407A1
公开(公告)日：2014-06-12
申请号：US13709414
申请日：2012-12-10
申请人： Curtis Michael Zwenger , Yoon Joo Kim , Brett Dunlap
发明人： Curtis Michael Zwenger , Yoon Joo Kim , Brett Dunlap
IPC分类号： H01L21/56
CPC分类号： H01L24/96 , H01L21/561 , H01L21/568 , H01L23/3114 , H01L24/19 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/13022 , H01L2224/13024 , H01L2924/12042 , H01L2924/181 , H01L2924/18162 , H01L2924/3511 , H01L2924/00
摘要： Methods and systems for semiconductor packaging are disclosed and may include bonding a semiconductor wafer to a support structure, separating the wafer into discrete die, removing the die from the support structure, and attaching at least a subset of the die to a second support structure. Mold material may be placed in voids between the die utilizing a compression molding process, thereby generating a molded wafer, which may be demounted before depositing redistribution lines on the die and the mold material. Conductive balls may be placed on the redistribution lines before separating into molded packages. The molded wafer may be planarized utilizing a post-mold cure on a heated vacuum chuck after removing it from the second support structure. The redistribution lines may be electrically isolated utilizing polymer layers. The conductive balls may be placed on copper redistribution lines with a surface oxide layer at least 20 angstroms thick.
摘要翻译：公开了用于半导体封装的方法和系统，并且可以包括将半导体晶片接合到支撑结构，将晶片分离成离散模具，将模具从支撑结构移除，以及将至少一个模具子集连接到第二支撑结构。模具材料可以利用压缩模制工艺放置在模具之间的空隙中，从而产生模制的晶片，其可以在将再分配线放置在模具和模具材料上之前拆卸。导电球可以在分离成模制包装之前放置在再分配线上。在将其从第二支撑结构上移除之后，可以在加热的真空吸盘上利用模具后固化来模制模制的晶片。再分布线可以使用聚合物层进行电隔离。导电球可以放置在具有至少20埃厚的表面氧化物层的铜再分配线上。

2. 发明申请

US20140042600A1 Semiconductor Package and Manufacturing Method Thereof 有权
标题翻译：半导体封装及制造方法
公开(公告)号：US20140042600A1
公开(公告)日：2014-02-13
申请号：US13962735
申请日：2013-08-08
申请人： Jin Young Kim , No Sun Park , Yoon Joo Kim , Choon Heung Lee , Jin Han Kim , Seung Jae Lee , Se Woong Cha , Sung Kyu Kim , Glenn Rinne
发明人： Jin Young Kim , No Sun Park , Yoon Joo Kim , Choon Heung Lee , Jin Han Kim , Seung Jae Lee , Se Woong Cha , Sung Kyu Kim , Glenn Rinne
IPC分类号： H01L23/00
CPC分类号： H01L25/0657 , H01L23/00 , H01L23/293 , H01L23/3135 , H01L23/3171 , H01L24/09 , H01L24/19 , H01L24/73 , H01L24/81 , H01L25/50 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16145 , H01L2224/48091 , H01L2224/48227 , H01L2224/73209 , H01L2224/73267 , H01L2924/1461 , H01L2924/18162 , H01L2924/19107 , H01L2924/00
摘要： A semiconductor package and manufacturing method thereof are disclosed and may include a first semiconductor device comprising a first bond pad on a first surface of the first semiconductor device, a first encapsulant material surrounding side edges of the first semiconductor device, and a redistribution layer (RDL) formed on the first surface of the first semiconductor device and on a first surface of the encapsulant material. The RDL may electrically couple the first bond pad to a second bond pad formed above the first surface of the encapsulant material. A second semiconductor device comprising a third bond pad on a first surface of the second semiconductor device may face the first surface of the first semiconductor device and be electrically coupled to the first bond pad on the first semiconductor device. The first surface of the first semiconductor device may be coplanar with the first surface of the encapsulant material.
摘要翻译：公开了半导体封装及其制造方法，并且可以包括第一半导体器件，其包括在第一半导体器件的第一表面上的第一接合焊盘，围绕第一半导体器件的侧边缘的第一密封材料和再分配层（RDL ）形成在第一半导体器件的第一表面上并且在密封剂材料的第一表面上。 RDL可以将第一接合焊盘电耦合到形成在密封剂材料的第一表面上方的第二接合焊盘。包括在第二半导体器件的第一表面上的第三接合焊盘的第二半导体器件可面向第一半导体器件的第一表面并且电耦合到第一半导体器件上的第一接合焊盘。第一半导体器件的第一表面可以与密封剂材料的第一表面共面。

3. 发明授权

US07906855B1 Stacked semiconductor package and method of making same 有权
标题翻译：堆叠式半导体封装及其制作方法
公开(公告)号：US07906855B1
公开(公告)日：2011-03-15
申请号：US12758583
申请日：2010-04-12
申请人： Yoon Joo Kim , In Tae Kim , Ji Young Chung , Bong Chan Kim , Do Hyung Kim , Sung Chul Ha , Sung Min Lee , Jae Kyu Song
发明人： Yoon Joo Kim , In Tae Kim , Ji Young Chung , Bong Chan Kim , Do Hyung Kim , Sung Chul Ha , Sung Min Lee , Jae Kyu Song
IPC分类号： H01L23/48
CPC分类号： H01L24/27 , H01L23/3128 , H01L23/3135 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/0652 , H01L25/0657 , H01L2224/29101 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/48465 , H01L2224/73215 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/838 , H01L2224/85447 , H01L2224/92 , H01L2224/92247 , H01L2225/0651 , H01L2225/06565 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： In accordance with the present invention, there is provided multiple embodiments of a semiconductor package including two or more semiconductor dies which are electrically connected to an underlying substrate through the use of conductive wires, some of which may be fully or partially encapsulated by an adhesive or insulating layer of the package. In a basic embodiment of the present invention, the semiconductor package comprises a substrate having a conductive pattern disposed thereon. Electrically connected to the conductive pattern of the substrate are first and second semiconductor dies. The first semiconductor die and a portion of the substrate are covered by an adhesive layer. The second semiconductor die, the adhesive layer and a portion of the substrate are in turn covered by a package body of the semiconductor package.
摘要翻译：根据本发明，提供了包括两个或更多个半导体管芯的半导体封装的多个实施例，所述半导体管芯通过使用导电线电连接到下面的衬底，其中一些可以被粘合剂完全或部分封装，绝缘层包装。在本发明的基本实施例中，半导体封装包括其上布置有导电图案的衬底。电连接到衬底的导电图案是第一和第二半导体管芯。第一半导体管芯和衬底的一部分被粘合剂层覆盖。第二半导体管芯，粘合剂层和衬底的一部分又由半导体封装的封装主体覆盖。

4. 发明授权

US07847398B2 Semiconductor device having a stacked bump to reduce kirkendall voids and or cracks and method of manufacturing 有权
标题翻译：半导体器件具有堆叠的凸起以减少kirkendall空隙和/或裂纹以及制造方法
公开(公告)号：US07847398B2
公开(公告)日：2010-12-07
申请号：US11832571
申请日：2007-08-01
申请人： Seok Ho Na , Jae Yun Kim , Yoon Joo Kim , Ji Young Chung
发明人： Seok Ho Na , Jae Yun Kim , Yoon Joo Kim , Ji Young Chung
IPC分类号： H01L23/48
CPC分类号： H01L24/85 , H01L23/3128 , H01L23/49838 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/78 , H01L24/83 , H01L2224/0401 , H01L2224/04042 , H01L2224/05624 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/4809 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/48465 , H01L2224/48471 , H01L2224/48475 , H01L2224/4848 , H01L2224/48482 , H01L2224/48483 , H01L2224/48487 , H01L2224/48499 , H01L2224/48624 , H01L2224/48824 , H01L2224/73265 , H01L2224/78301 , H01L2224/83 , H01L2224/85051 , H01L2224/85181 , H01L2224/859 , H01L2224/85986 , H01L2224/92247 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01058 , H01L2924/01079 , H01L2924/01082 , H01L2924/01202 , H01L2924/01203 , H01L2924/01327 , H01L2924/014 , H01L2924/15311 , H01L2924/15313 , H01L2924/181 , H01L2924/00014 , H01L2924/01039 , H01L2924/01004 , H01L2924/00 , H01L2924/00012 , H01L2924/3512
摘要： A semiconductor device has a semiconductor die having at least one bond pad formed on a first surface thereof. A substrate has at least one bond finger formed on a first surface thereof. A second surface of the semiconductor die is attached to the first surface of the substrate. A conductive wire connects the bond pad of the semiconductor die and the bond finger of the substrate wherein at least one end of the conductive wire has a stack bump. An encapsulant is provided to encapsulate the semiconductor die and the conductive wire.
摘要翻译：半导体器件具有在其第一表面上形成有至少一个接合焊盘的半导体管芯。衬底在其第一表面上形成有至少一个键合指状物。半导体管芯的第二表面附接到基板的第一表面。导电线将半导体管芯的接合焊盘和衬底的接合指状物连接，其中导线的至少一端具有堆叠凸起。提供密封剂以封装半导体管芯和导线。

5. 发明授权

US07956453B1 Semiconductor package with patterning layer and method of making same 有权
标题翻译：具有图案层的半导体封装及其制造方法
公开(公告)号：US07956453B1
公开(公告)日：2011-06-07
申请号：US12015428
申请日：2008-01-16
申请人： Do Hyeong Kim , Bong Chan Kim , Yoon Joo Kim , Ji Young Chung
发明人： Do Hyeong Kim , Bong Chan Kim , Yoon Joo Kim , Ji Young Chung
IPC分类号： H01L23/48 , H01L23/04
CPC分类号： H01L23/5389 , H01L23/3128 , H01L23/3135 , H01L23/481 , H01L23/49816 , H01L24/24 , H01L24/25 , H01L24/45 , H01L24/48 , H01L25/50 , H01L2224/05553 , H01L2224/24051 , H01L2224/24226 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73267 , H01L2224/92244 , H01L2225/0651 , H01L2225/06524 , H01L2225/06541 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10161 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： In accordance with the present invention, there is provided multiple embodiments of a semiconductor package including one or more semiconductor dies which are electrically connected to an underlying substrate through the use of a conductive pattern which is at least partially embedded in a patterning layer of the package. In a basic embodiment of the present invention, the semiconductor package comprises a substrate having a conductive pattern disposed thereon. Electrically connected to the conductive pattern of the substrate is at least one semiconductor die. The semiconductor die and the substrate are at least partially encapsulated by a patterning layer. Embedded in the patterning layer is a wiring pattern which electrically connects the semiconductor die to the conductive pattern. A portion of the wiring pattern is exposed in the patterning layer.
摘要翻译：根据本发明，提供了包括一个或多个半导体管芯的半导体封装的多个实施例，所述半导体管芯通过使用至少部分地嵌入在封装的图案化层中的导电图案电连接到下面的衬底。在本发明的基本实施例中，半导体封装包括其上布置有导电图案的衬底。电连接到衬底的导电图案是至少一个半导体管芯。半导体管芯和衬底被图案化层至少部分地封装。嵌入在图案化层中的是将半导体管芯与导电图案电连接的布线图案。布线图案的一部分在图案形成层中露出。

6. 发明授权

US07723852B1 Stacked semiconductor package and method of making same 有权
标题翻译：堆叠式半导体封装及其制作方法
公开(公告)号：US07723852B1
公开(公告)日：2010-05-25
申请号：US12017266
申请日：2008-01-21
申请人： Yoon Joo Kim , In Tae Kim , Ji Young Chung , Bong Chan Kim , Do Hyung Kim , Sung Chul Ha , Sung Min Lee , Jae Kyu Song
发明人： Yoon Joo Kim , In Tae Kim , Ji Young Chung , Bong Chan Kim , Do Hyung Kim , Sung Chul Ha , Sung Min Lee , Jae Kyu Song
IPC分类号： H01L23/48
CPC分类号： H01L24/27 , H01L23/3128 , H01L23/3135 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/0652 , H01L25/0657 , H01L2224/29101 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/48465 , H01L2224/73215 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/838 , H01L2224/85447 , H01L2224/92 , H01L2224/92247 , H01L2225/0651 , H01L2225/06565 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： In accordance with the present invention, there is provided multiple embodiments of a semiconductor package including two or more semiconductor dies which are electrically connected to an underlying substrate through the use of conductive wires, some of which may be fully or partially encapsulated by an adhesive or insulating layer of the package. In a basic embodiment of the present invention, the semiconductor package comprises a substrate having a conductive pattern disposed thereon. Electrically connected to the conductive pattern of the substrate are first and second semiconductor dies. The first semiconductor die and a portion of the substrate are covered by an adhesive layer. The second semiconductor die, the adhesive layer and a portion of the substrate are in turn covered by a package body of the semiconductor package.
摘要翻译：根据本发明，提供了包括两个或更多个半导体管芯的半导体封装的多个实施例，所述半导体管芯通过使用导电线电连接到下面的衬底，其中一些可以被粘合剂完全或部分封装，绝缘层包装。在本发明的基本实施例中，半导体封装包括其上布置有导电图案的衬底。电连接到衬底的导电图案是第一和第二半导体管芯。第一半导体管芯和衬底的一部分被粘合剂层覆盖。第二半导体管芯，粘合剂层和衬底的一部分又由半导体封装的封装主体覆盖。

7. 发明申请

US20090032947A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20090032947A1
公开(公告)日：2009-02-05
申请号：US11832571
申请日：2007-08-01
申请人： Seok Ho Na , Jae Yun Kim , Yoon Joo Kim , Ji Young Chung
发明人： Seok Ho Na , Jae Yun Kim , Yoon Joo Kim , Ji Young Chung
IPC分类号： H01L23/48 , H01L21/00
CPC分类号： H01L24/85 , H01L23/3128 , H01L23/49838 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/78 , H01L24/83 , H01L2224/0401 , H01L2224/04042 , H01L2224/05624 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/4809 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/48465 , H01L2224/48471 , H01L2224/48475 , H01L2224/4848 , H01L2224/48482 , H01L2224/48483 , H01L2224/48487 , H01L2224/48499 , H01L2224/48624 , H01L2224/48824 , H01L2224/73265 , H01L2224/78301 , H01L2224/83 , H01L2224/85051 , H01L2224/85181 , H01L2224/859 , H01L2224/85986 , H01L2224/92247 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01058 , H01L2924/01079 , H01L2924/01082 , H01L2924/01202 , H01L2924/01203 , H01L2924/01327 , H01L2924/014 , H01L2924/15311 , H01L2924/15313 , H01L2924/181 , H01L2924/00014 , H01L2924/01039 , H01L2924/01004 , H01L2924/00 , H01L2924/00012 , H01L2924/3512
摘要： A semiconductor device has a semiconductor die having at least one bond pad formed on a first surface thereof. A substrate has at least one bond finger formed on a first surface thereof. A second surface of the semiconductor die is attached to the first surface of the substrate. A conductive wire connects the bond pad of the semiconductor die and the bond finger of the substrate wherein at least one end of the conductive wire has a stack bump. An encapsulant is provided to encapsulate the semiconductor die and the conductive wire.
摘要翻译：半导体器件具有在其第一表面上形成有至少一个接合焊盘的半导体管芯。衬底在其第一表面上形成有至少一个键合指状物。半导体管芯的第二表面附接到基板的第一表面。导电线将半导体管芯的接合焊盘和衬底的接合指状物连接，其中导线的至少一端具有堆叠凸起。提供密封剂以封装半导体管芯和导线。

8. 发明授权

US08129849B1 Method of making semiconductor package with adhering portion 有权
标题翻译：制造具有粘附部分的半导体封装的方法
公开(公告)号：US08129849B1
公开(公告)日：2012-03-06
申请号：US12589868
申请日：2009-10-28
申请人： Youn Sang Kim , Bong Chan Kim , Yoon Joo Kim
发明人： Youn Sang Kim , Bong Chan Kim , Yoon Joo Kim
IPC分类号： H01L23/28
CPC分类号： H01L23/3128 , H01L21/561 , H01L23/3185 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2224/92247 , H01L2224/97 , H01L2225/0651 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15311 , H01L2924/181 , H01L2924/30107 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： Disclosed are a semiconductor package and a method of making the same. In the semiconductor package, a substrate and a semiconductor die are covered with and encapsulated by vertically pressing thermosetting resin having fluidity in a predetermined temperature range and denaturalizing itself in gel. Thus, it is possible to reduce a thickness of the semiconductor package and prevent wire sweeping.
摘要翻译：公开了一种半导体封装及其制造方法。在半导体封装中，衬底和半导体管芯被在预定温度范围内具有流动性的垂直压制热固性树脂覆盖并包封，并且在凝胶中自身变质。因此，可以减小半导体封装的厚度并防止线扫。

9. 发明授权

US07963478B2 Wing-flapping flying apparatus and method of using the same 有权
标题翻译：飞翼飞行装置及其使用方法
公开(公告)号：US07963478B2
公开(公告)日：2011-06-21
申请号：US11997029
申请日：2006-02-08
申请人： Kwang Ho Kim , Jae Hak Jeon , Yoon Joo Kim
发明人： Kwang Ho Kim , Jae Hak Jeon , Yoon Joo Kim
IPC分类号： B64C33/00
CPC分类号： B64C33/02
摘要： The present invention provides a wing-flapping flying apparatus, which can fly by moving its wings similar to a bird hovering or flying in the air by flapping its wings. The wing-flapping flying apparatus comprises: a body; a rotating shaft rotatably joined to the body; driving means for rotating the rotating shaft; and wings reciprocated between two points and connected to the rotating shaft so as to be rotated together with the rotating shaft and to be relatively torsionally rotated with respect to the rotating shaft. The wing-flapping flying apparatus generates lift throughout an entire wing-flapping movement without generating lift only throughout the half of a wing-flapping movement or offsetting the generated lift by the other half of the wing-flapping movement. Therefore, the wing-flapping flying apparatus can provide not only a stable flight but also a softly hovering or ascending and descending flight.
摘要翻译：本发明提供了一种飞翼飞行装置，其可以通过使翅膀类似于通过扑翼而悬挂在空中的鸟类飞行。飞翼飞行装置包括：主体; 可旋转地连接到主体的旋转轴; 用于旋转所述旋转轴的驱动装置; 并且翼在两点之间往复运动并连接到旋转轴，以便与旋转轴一起旋转并且相对于旋转轴相对地扭转。飞翼飞行装置在整个飞翼拍动运动中产生升力，而不会在飞翼运动的整个半部中产生升力，或者将所产生的升力抵消翼翼运动的另一半。因此，飞翼飞行装置不仅可以提供稳定的飞行，还可以提供轻柔的悬停或上升和下降的飞行。

10. 发明授权

US07633144B1 Semiconductor package 有权
标题翻译：半导体封装
公开(公告)号：US07633144B1
公开(公告)日：2009-12-15
申请号：US11440662
申请日：2006-05-24
申请人： Youn Sang Kim , Bong Chan Kim , Yoon Joo Kim
发明人： Youn Sang Kim , Bong Chan Kim , Yoon Joo Kim
IPC分类号： H01L21/56
CPC分类号： H01L23/3128 , H01L21/561 , H01L23/3185 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2224/92247 , H01L2224/97 , H01L2225/0651 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15311 , H01L2924/181 , H01L2924/30107 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： Disclosed are a semiconductor package and a method of making the same. In the semiconductor package, a substrate and a semiconductor die are covered with and encapsulated by vertically pressing thermosetting resin having fluidity in a predetermined temperature range and denaturalizing itself in gel. Thus, it is possible to reduce a thickness of the semiconductor package and prevent wire sweeping.
摘要翻译：公开了一种半导体封装及其制造方法。在半导体封装中，衬底和半导体管芯被在预定温度范围内具有流动性的垂直压制热固性树脂覆盖并包封，并且在凝胶中自身变质。因此，可以减小半导体封装的厚度并防止线扫。

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