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1. 发明授权

US6032076A Transintegumental power transformers with high permeability cores 失效
标题翻译：具有高磁导率核心的电力变压器
公开(公告)号：US6032076A
公开(公告)日：2000-02-29
申请号：US045432
申请日：1998-03-20
申请人： David Melvin , H. Thurman Henderson , Arthur J. Helmicki
发明人： David Melvin , H. Thurman Henderson , Arthur J. Helmicki
IPC分类号： A61F2/02 , A61N1/08 , A61N1/378 , A61N2/04 , A61N1/00
CPC分类号： A61N1/08 , A61F2250/0001 , A61N1/3787
摘要： Extra- to intra-corporeal power is provided by a transformer implanted at least partially within a defunctionalized intestinal pouch (or sack), such as an ileal pouch. The transformer includes a continuous loop magnetic core which is implanted within the pouch. The pouch itself includes a passageway permitting the secondary wiring to extend around the and through the magnetic core and through its central opening without entering the pouch providing intracorporeal current. Wire providing the primary windings extend from outside the body in through a stoma into the pouch and surround portions of the magnetic core within the pouch. Because of the use of a generally continuous loop magnetic core of high permeability, there is little or virtually no magnetic flux leakage. A solid circular core of a high permeability material may be used. In an alternate embodiment of the present invention the magnetic core can be divided into two separate portions, one implanted within the pouch and one implanted within the peritoneum adjacent the pouch so that the two core portions combine to form a generally continuous loop magnetic path, separated only by the intestinal wall of the pouch.
摘要翻译：通过植入至少部分在功能化的肠袋（或袋）（例如回肠袋）内的变压器来提供额外的体内功率。变压器包括植入袋内的连续环形磁芯。袋本身包括通道，允许二次布线围绕并通过磁芯延伸并穿过其中心开口而不进入提供体内电流的袋。提供初级绕组的线从身体外部通过造口延伸到袋中并且围绕袋内的磁芯的部分。由于使用高磁导率的通常连续的环形磁芯，因此几乎没有或几乎没有磁通泄漏。可以使用高磁导率材料的实心圆芯。在本发明的替代实施例中，磁芯可以分为两个分开的部分，一个植入在囊内，一个植入在邻近袋的腹膜内，使得两个核心部分组合形成大致连续的环路径，分离只能通过肠壁的肠壁。

2. 发明授权

US07692926B2 Integrated thermal systems 失效
标题翻译：集成热系统
公开(公告)号：US07692926B2
公开(公告)日：2010-04-06
申请号：US11932969
申请日：2007-10-31
申请人： H. Thurman Henderson , Ahmed Shuja , Srinivas Parimi , Frank M. Gerner , Praveen Medis
发明人： H. Thurman Henderson , Ahmed Shuja , Srinivas Parimi , Frank M. Gerner , Praveen Medis
IPC分类号： H05K7/20
CPC分类号： F28D15/043 , H01L23/427 , H01L2924/0002 , H01L2924/09701 , Y10S165/218 , Y10T29/49396 , H01L2924/00
摘要： The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotropic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (μLHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 w/cm2). The operation is dependent upon a unique micropatterened CPS wick which contains up to millions per square centimeter of stacked uniform micro-through-capillaries in semiconductor-grade silicon, which serve as the capillary “engine,” as opposed to the stochastic distribution of pores in the typical heat pipe wick. As with all heat pipes, cooling occurs by virtue of the extraction of heat by the latent heat of phase change of the operating fluid into vapor.
摘要翻译：本发明是使用半导体级硅和微光刻/各向异性蚀刻技术的基于MEMS的两相LHP（环路热管）和CPL（毛细管泵浦环路）来实现平面配置。主要的工作材料是硅（和必要时兼容的硼硅酸盐玻璃），特别与电子和计算机芯片和封装冷却的冷却需求相兼容。微循环热管（μLHP™）利用尖端微加工技术。该设备没有泵或运动部件，并且能够使用革命性的相干多孔硅（CPS）灯芯以高功率密度移动热量。 CPS灯芯将封装热失配应力最小化，并提高强度重量比。当连续孔的直径可以亚微米级控制时，也可以控制爆破压力。两相平面操作提供极低的比热阻（20-60w / cm2）。该操作取决于独特的微电极CPS灯芯，其包含高达数百万个每平方厘米的半导体级硅中的堆叠的均匀微通毛细管，其用作毛细管“发动机”，与毛细管的随机分布相反典型的热管灯芯。与所有热管一样，由于通过工作流体相变的潜热进入蒸气而将热量提取出来，发生冷却。

3. 发明授权

US07723845B2 System and method of a heat transfer system with an evaporator and a condenser 有权
标题翻译：具有蒸发器和冷凝器的传热系统的系统和方法
公开(公告)号：US07723845B2
公开(公告)日：2010-05-25
申请号：US11932911
申请日：2007-10-31
申请人： H. Thurman Henderson , Ahmed Shuja , Srinivas Parimi , Frank M. Gerner , Praveen Medis
发明人： H. Thurman Henderson , Ahmed Shuja , Srinivas Parimi , Frank M. Gerner , Praveen Medis
IPC分类号： H01L23/12 , H01L31/028
CPC分类号： F28D15/043 , H01L23/427 , H01L2924/0002 , H01L2924/09701 , Y10S165/218 , Y10T29/49396 , H01L2924/00
摘要： The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (μLHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 w/cm2). The operation is dependent upon a unique micropatterened CPS wick which contains up to millions per square centimeter of stacked uniform micro-through-capillaries in semiconductor-grade silicon, which serve as the capillary “engine,” as opposed to the stochastic distribution of pores in the typical heat pipe wick. As with all heat pipes, cooling occurs by virtue of the extraction of heat by the latent heat of phase change of the operating fluid into vapor.
摘要翻译：本发明是使用半导体级硅和微光刻/各向异性蚀刻技术的基于MEMS的两相LHP（环形热管）和CPL（毛细管泵浦环），以实现平面配置。主要的工作材料是硅（和必要时兼容的硼硅酸盐玻璃），特别与电子和计算机芯片和封装冷却的冷却需求相兼容。微循环热管（μLHP™）利用尖端微加工技术。该设备没有泵或运动部件，并且能够使用革命性的相干多孔硅（CPS）灯芯以高功率密度移动热量。 CPS灯芯将封装热失配应力最小化，并提高强度重量比。当连续孔的直径可以亚微米级控制时，也可以控制爆破压力。两相平面操作提供极低的比热阻（20-60w / cm2）。该操作取决于独特的微电极CPS灯芯，其包含高达数百万个每平方厘米的半导体级硅中的堆叠的均匀微通毛细管，其用作毛细管“发动机”，与毛细管的随机分布相反典型的热管灯芯。与所有热管一样，由于通过工作流体相变的潜热进入蒸气而将热量提取出来，发生冷却。

4. 发明授权

US07705342B2 Porous semiconductor-based evaporator having porous and non-porous regions, the porous regions having through-holes 失效
公开(公告)号：US07705342B2
公开(公告)日：2010-04-27
申请号：US11530107
申请日：2006-09-08
申请人： H. Thurman Henderson , Ahmed Shuja , Srinivas Parimi , Frank M. Gerner , Praveen Medis
发明人： H. Thurman Henderson , Ahmed Shuja , Srinivas Parimi , Frank M. Gerner , Praveen Medis
IPC分类号： H01L47/00 , H01L23/06
CPC分类号： F28D15/043 , H01L23/427 , H01L2924/0002 , H01L2924/09701 , Y10S165/218 , Y10T29/49396 , H01L2924/00
摘要： The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (μLHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 W/cm2). The operation is dependent upon a unique micropatterened CPS wick which contains up to millions per square centimeter of stacked uniform micro-through-capillaries in semiconductor-grade silicon, which serve as the capillary “engine,” as opposed to the stochastic distribution of pores in the typical heat pipe wick. As with all heat pipes, cooling occurs by virtue of the extraction of heat by the latent heat of phase change of the operating fluid into vapor.In the cooling of a laptop computer processor the device could be attached to the processor during laptop assembly. Consistent with efforts to miniaturize electronics components, the current invention can be directly integrated with a unpackaged chip. For applications requiring larger cooling surface areas, the planar evaporators can be spread out in a matrix and integrally connected through properly sized manifold systems.

5. 发明授权

US5231877A Solid state microanemometer 失效
标题翻译：固态微量计
公开(公告)号：US5231877A
公开(公告)日：1993-08-03
申请号：US626304
申请日：1990-12-12
申请人： H. Thurman Henderson
发明人： H. Thurman Henderson
IPC分类号： G01F1/684 , G01P5/12 , G01P13/02
CPC分类号： G01P5/12 , G01F1/6845 , G01P13/02 , G01P2015/084 , Y10S438/924
摘要： A solid state microanemometer is micromachined from a crystal to a shape with four thick external sides that define an outer rectangle, four thin sections that define an inner rectangle and four diagonally directed branches interconnecting the corners of the outer rectangle to the inner rectangle. Four semiconductor resistors located on the four inner sections form a sensing bridge. Each external side has a pair of electrical contacts that are electrically interconnected, via conductive leads that extend along the diagonal branches and partially along the inner sections, to one of the semiconductor resistors. The physically connected semiconductor resistors and external sides form a rugged solid state device, while thermal and electrical isolation of the resistors from each other permits higher operating temperatures and improved fluid flow sensing capability.
摘要翻译：固体微尺度计从晶体微加工成具有四个厚的外侧的形状，其限定外部矩形，限定内部矩形的四个薄部分和将外部矩形的角部与内部矩形互连的四个对角线指向的分支。位于四个内部部分上的四个半导体电阻形成感测桥。每个外侧具有一对电触头，其通过沿着对角分支延伸并且部分地沿内部部分延伸的导电引线电连接到半导体电阻器之一。物理连接的半导体电阻器和外部侧面形成坚固的固态器件，而电阻器的热和电隔离彼此允许更高的工作温度和改善的流体流量检测能力。

6. 发明申请

US20080115913A1 METHOD OF FABRICATING SEMICONDUCTOR-BASED POROUS STRUCTURE 审中-公开
标题翻译：制备基于半导体的多孔结构的方法
公开(公告)号：US20080115913A1
公开(公告)日：2008-05-22
申请号：US11933000
申请日：2007-10-31
申请人： H. Thurman Henderson , Ahmed Shuja , Srinivas Parimi , Frank M. Gerner , Praveen Medis
发明人： H. Thurman Henderson , Ahmed Shuja , Srinivas Parimi , Frank M. Gerner , Praveen Medis
IPC分类号： F28D15/00
CPC分类号： F28D15/043 , H01L23/427 , H01L2924/0002 , H01L2924/09701 , Y10S165/218 , Y10T29/49396 , H01L2924/00
摘要： The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (μLHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60w/cm2). The operation is dependent upon a unique micropatterened CPS wick which contains up to millions per square centimeter of stacked uniform micro-through-capillaries in semiconductor-grade silicon, which serve as the capillary “engine,” as opposed to the stochastic distribution of pores in the typical heat pipe wick. As with all heat pipes, cooling occurs by virtue of the extraction of heat by the latent heat of phase change of the operating fluid into vapor.In the cooling of a laptop computer processor the device could be attached to the processor during laptop assembly. Consistent with efforts to miniaturize electronics components, the current invention can be directly integrated with a unpackaged chip. For applications requiring larger cooling surface areas, the planar evaporators can be spread out in a matrix and integrally connected through properly sized manifold systems.
摘要翻译：本发明是使用半导体级硅和微光刻/各向异性蚀刻技术的基于MEMS的两相LHP（环形热管）和CPL（毛细管泵浦环），以实现平面配置。主要的工作材料是硅（和必要时兼容的硼硅酸盐玻璃），特别与电子和计算机芯片和封装冷却的冷却需求相兼容。微循环热管（muLHP TM）利用尖端微加工技术。该设备没有泵或运动部件，并且能够使用革命性的相干多孔硅（CPS）灯芯以高功率密度移动热量。 CPS灯芯将封装热失配应力最小化，并提高强度重量比。当连续孔的直径可以亚微米级控制时，也可以控制爆破压力。两相平面操作提供极低的比热阻（20-60w / cm 2）。该操作取决于独特的微电极CPS灯芯，其包含高达数百万个每平方厘米的半导体级硅中的堆叠的均匀微通毛细管，其用作毛细管“发动机”，与毛细管的随机分布相反典型的热管灯芯。与所有热管一样，由于通过工作流体相变的潜热进入蒸气而将热量提取出来，发生冷却。在笔记本电脑处理器的冷却中，该设备可以在笔记本电脑组装期间连接至处理器。与电子元件小型化的努力一致，本发明可直接与未封装的芯片集成。对于需要较大冷却表面积的应用，平面蒸发器可以以矩阵形式展开并通过适当尺寸的歧管系统整体连接。

7. 发明申请

US20080110598A1 SYSTEM AND METHOD OF A HEAT TRANSFER SYSTEM AND A CONDENSOR 有权
标题翻译：传热系统和冷凝器的系统和方法
公开(公告)号：US20080110598A1
公开(公告)日：2008-05-15
申请号：US11932911
申请日：2007-10-31
申请人： H. Thurman Henderson , Ahmed Shuja , Srinivas Parimi , Frank M. Gerner , Praveen Medis
发明人： H. Thurman Henderson , Ahmed Shuja , Srinivas Parimi , Frank M. Gerner , Praveen Medis
IPC分类号： F28D15/00
CPC分类号： F28D15/043 , H01L23/427 , H01L2924/0002 , H01L2924/09701 , Y10S165/218 , Y10T29/49396 , H01L2924/00
摘要： The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (μLHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 w/cm2). The operation is dependent upon a unique micropatterened CPS wick which contains up to millions per square centimeter of stacked uniform micro-through-capillaries in semiconductor-grade silicon, which serve as the capillary “engine,” as opposed to the stochastic distribution of pores in the typical heat pipe wick. As with all heat pipes, cooling occurs by virtue of the extraction of heat by the latent heat of phase change of the operating fluid into vapor.In the cooling of a laptop computer processor the device could be attached to the processor during laptop assembly. Consistent with efforts to miniaturize electronics components, the current invention can be directly integrated with a unpackaged chip. For applications requiring larger cooling surface areas, the planar evaporators can be spread out in a matrix and integrally connected through properly sized manifold systems.
摘要翻译：本发明是使用半导体级硅和微光刻/各向异性蚀刻技术的基于MEMS的两相LHP（环形热管）和CPL（毛细管泵浦环），以实现平面配置。主要的工作材料是硅（和必要时兼容的硼硅酸盐玻璃），特别与电子和计算机芯片和封装冷却的冷却需求相兼容。微循环热管（muLHP TM）利用尖端微加工技术。该设备没有泵或运动部件，并且能够使用革命性的相干多孔硅（CPS）灯芯以高功率密度移动热量。 CPS灯芯将封装热失配应力最小化，并提高强度重量比。当连续孔的直径可以亚微米级控制时，也可以控制爆破压力。两相平面操作提供极低的比热阻（20-60w / cm 2）。该操作取决于独特的微电极CPS灯芯，其包含高达数百万个每平方厘米的半导体级硅中的堆叠的均匀微通毛细管，其用作毛细管“发动机”，与毛细管的随机分布相反典型的热管灯芯。与所有热管一样，由于通过工作流体相变的潜热进入蒸气而将热量提取出来，发生冷却。在笔记本电脑处理器的冷却中，该设备可以在笔记本电脑组装期间连接至处理器。与电子元件小型化的努力一致，本发明可直接与未封装的芯片集成。对于需要较大冷却表面积的应用，平面蒸发器可以以矩阵形式展开并通过适当尺寸的歧管系统整体连接。

8. 发明授权

US4930347A Solid state microanemometer with improved sensitivity and response time 失效
标题翻译：固态微量度计具有改进的灵敏度和响应时间
公开(公告)号：US4930347A
公开(公告)日：1990-06-05
申请号：US355980
申请日：1989-05-23
申请人： H. Thurman Henderson
发明人： H. Thurman Henderson
IPC分类号： G01F1/684
CPC分类号： G01F1/6845
摘要： A solid state microanemometer with improved sensitivity and response time is micromachined out of a single deep level doped semiconductor crystal and includes four corner supports interconnected to four spanning members which form the resistor legs of a Wheatstone bridge. The bottom of the supports are electrostatically bonded to a glass plate, thus thermally isolating the resistor legs a predetermined distance above the top surface of the plate and electrically isolating the supports. Electrically conductive material deposited on the four corner supports provides electrical contacts which enable a voltage to be applied across the resistor legs. Preferably, an n.sup.+ material is diffused into the region of the crystal located beneath the electrically conductive material, and the exposed surfaces of the crystal are sealed with a passivation layer.
摘要翻译：具有改善的灵敏度和响应时间的固态微量度计是从单个深度掺杂的半导体晶体中微加工的，并且包括与形成惠斯登电桥的电阻器腿的四个跨越构件互连的四个角支撑。支撑体的底部被静电地接合到玻璃板，从而将电阻器腿在板的顶表面上方预定的距离热隔离并电隔离支撑件。沉积在四个角支架上的导电材料提供了电触点，使电压跨越电阻器支脚施加。优选地，n +材料扩散到位于导电材料下方的晶体的区域中，并且用钝化层密封晶体的暴露表面。

9. 发明授权

US07723760B2 Semiconductor-based porous structure enabled by capillary force 有权
标题翻译：通过毛细管力实现基于半导体的多孔结构
公开(公告)号：US07723760B2
公开(公告)日：2010-05-25
申请号：US11932951
申请日：2007-10-31
申请人： H. Thurman Henderson , Ahmed Shuja , Srinivas Parimi , Frank M. Gerner , Praveen Medis
发明人： H. Thurman Henderson , Ahmed Shuja , Srinivas Parimi , Frank M. Gerner , Praveen Medis
IPC分类号： H01L31/028
CPC分类号： F28D15/043 , H01L23/427 , H01L2924/0002 , H01L2924/09701 , Y10S165/218 , Y10T29/49396 , H01L2924/00
摘要： The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (μLHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 w/cm2). The operation is dependent upon a unique micropatterened CPS wick which contains up to millions per square centimeter of stacked uniform micro-through-capillaries in semiconductor-grade silicon, which serve as the capillary “engine,” as opposed to the stochastic distribution of pores in the typical heat pipe wick. As with all heat pipes, cooling occurs by virtue of the extraction of heat by the latent heat of phase change of the operating fluid into vapor.
摘要翻译：本发明是使用半导体级硅和微光刻/各向异性蚀刻技术的基于MEMS的两相LHP（环形热管）和CPL（毛细管泵浦环），以实现平面配置。主要的工作材料是硅（和必要时兼容的硼硅酸盐玻璃），特别与电子和计算机芯片和封装冷却的冷却需求相兼容。微循环热管（μLHP™）利用尖端微加工技术。该设备没有泵或运动部件，并且能够使用革命性的相干多孔硅（CPS）灯芯以高功率密度移动热量。 CPS灯芯将封装热失配应力最小化，并提高强度重量比。当连续孔的直径可以亚微米级控制时，也可以控制爆破压力。两相平面操作提供极低的比热阻（20-60w / cm2）。该操作取决于独特的微电极CPS灯芯，其包含高达数百万个每平方厘米的半导体级硅中的堆叠的均匀微通毛细管，其用作毛细管“发动机”，与毛细管的随机分布相反典型的热管灯芯。与所有热管一样，由于通过工作流体相变的潜热进入蒸气而将热量提取出来，发生冷却。

10. 发明申请

US20080128898A1 INTEGRATED THERMAL SYSTEMS 失效
标题翻译：集成热系统
公开(公告)号：US20080128898A1
公开(公告)日：2008-06-05
申请号：US11932969
申请日：2007-10-31
申请人： H. Thurman Henderson , Ahmed Shuja , Srinivas Parimi , Frank M. Gerner , Praveen Medis
发明人： H. Thurman Henderson , Ahmed Shuja , Srinivas Parimi , Frank M. Gerner , Praveen Medis
IPC分类号： H01L23/34 , F28D15/00
CPC分类号： F28D15/043 , H01L23/427 , H01L2924/0002 , H01L2924/09701 , Y10S165/218 , Y10T29/49396 , H01L2924/00
摘要： The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotropic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (μLHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 w/cm2). The operation is dependent upon a unique micropatterened CPS wick which contains up to millions per square centimeter of stacked uniform micro-through-capillaries in semiconductor-grade silicon, which serve as the capillary “engine,” as opposed to the stochastic distribution of pores in the typical heat pipe wick. As with all heat pipes, cooling occurs by virtue of the extraction of heat by the latent heat of phase change of the operating fluid into vapor.In the cooling of a laptop computer processor the device could be attached to the processor during laptop assembly. Consistent with efforts to miniaturize electronics components, the current invention can be directly integrated with a unpackaged chip. For applications requiring larger cooling surface areas, the planar evaporators can be spread out in a matrix and integrally connected through properly sized manifold systems.
摘要翻译：本发明是使用半导体级硅和微光刻/各向异性蚀刻技术的基于MEMS的两相LHP（环路热管）和CPL（毛细管泵浦环路）来实现平面配置。主要的工作材料是硅（和必要时兼容的硼硅酸盐玻璃），特别与电子和计算机芯片和封装冷却的冷却需求相兼容。微循环热管（muLHP TM）利用尖端微加工技术。该设备没有泵或运动部件，并且能够使用革命性的相干多孔硅（CPS）灯芯以高功率密度移动热量。 CPS灯芯将封装热失配应力最小化，并提高强度重量比。当连续孔的直径可以亚微米级控制时，也可以控制爆破压力。两相平面操作提供极低的比热阻（20-60w / cm 2）。该操作取决于独特的微电极CPS灯芯，其包含高达数百万个每平方厘米的半导体级硅中的堆叠的均匀微通毛细管，其用作毛细管“发动机”，与毛细管的随机分布相反典型的热管灯芯。与所有热管一样，由于通过工作流体相变的潜热进入蒸气而将热量提取出来，发生冷却。在笔记本电脑处理器的冷却中，该设备可以在笔记本电脑组装期间连接至处理器。与电子元件小型化的努力一致，本发明可直接与未封装的芯片集成。对于需要较大冷却表面积的应用，平面蒸发器可以以矩阵形式展开并通过适当尺寸的歧管系统整体连接。

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