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1. 发明授权

US11359304B2 Powder supply apparatus and plating system 有权
公开(公告)号：US11359304B2
公开(公告)日：2022-06-14
申请号：US16234299
申请日：2018-12-27
申请人： EBARA CORPORATION
发明人： Shao Hua Chang , Jumpei Fujikata
IPC分类号： C25D21/16 , C25D21/18 , C25D17/00 , C25D21/14 , C25D17/02
摘要： There is provided a powder supply apparatus that prevents powder from scattering as much as possible. There is provided the powder supply apparatus that supplies a powder containing a metal used for a plating to a plating solution. This powder supply apparatus includes a plating solution tank, a feed pipe, a gas supply line, and a spiral-air-flow-generating component. The plating solution tank is configured to house the plating solution. The feed pipe is configured to feed the powder into the plating solution tank. The gas supply line is configured to supply a gas. The spiral-air-flow-generating component is configured to receive the gas from the gas supply line to generate a spiral air flow heading toward the plating solution tank inside the feed pipe.

2. 发明申请

US20210262111A1 PADDLE, PROCESSING APPARATUS HAVING THE PADDLE, AND METHOD OF PRODUCING THE PADDLE 有权
公开(公告)号：US20210262111A1
公开(公告)日：2021-08-26
申请号：US17177500
申请日：2021-02-17
申请人： EBARA CORPORATION
发明人： Yasuyuki Masuda , Shao Hua Chang , Yoshitaka Mukaiyama , Masashi Shimoyama , Jumpei Fujikata
IPC分类号： C25D21/10 , C25D17/02 , B33Y10/00 , B33Y50/02 , B33Y80/00
摘要： A paddle capable of reducing an influence of blocking the electric field and capable of improving its mechanical strength is disclosed. The paddle, which is configured to agitate a processing liquid in a processing tank by moving in the processing tank, includes a plurality of agitating beams that form a honeycomb structure. The honeycomb structure has a plurality of hexagonal through-holes formed by the plurality of agitating beams.

3. 发明申请

US20210154629A1 PADDLE, PLATING APPARATUS EQUIPPED WITH THE PADDLE, AND PLATING METHOD 有权
公开(公告)号：US20210154629A1
公开(公告)日：2021-05-27
申请号：US17169130
申请日：2021-02-05
申请人： EBARA CORPORATION
发明人： Yasuyuki Masuda , Masashi Shimoyama , Jumpei Fujikata , Yohei Wakuda , Shao Hua Chang
IPC分类号： B01F11/00 , C25D17/00 , C25D21/10 , C25D17/06 , C25D17/02 , C25D21/18
摘要： A paddle for agitating a plating solution by reciprocating parallel to a surface of a substrate is disclosed. The paddle includes a plurality of vertically-extending agitation rods. Each agitation rod includes: a planar portion perpendicular to a reciprocating direction of the paddle; two slope surfaces extending from side ends of the planar portion in directions closer to each other, the two slope surfaces being symmetric with respect to a center line of the agitation rod, the center line being perpendicular to the planar portion; and a tip portion connected with the two slope surfaces.

4. 发明授权

US10676838B2 Plating device, plating method, substrate holder, resistance measuring module, and substrate holder testing method 有权
公开(公告)号：US10676838B2
公开(公告)日：2020-06-09
申请号：US15878267
申请日：2018-01-23
申请人： EBARA CORPORATION
发明人： Mizuki Nagai , Kazuhito Tsuji , Takashi Kishi , Toshiki Miyakawa , Masashi Shimoyama , Jumpei Fujikata
IPC分类号： C25D17/08 , H01L21/687 , C25D21/12 , C25D17/00 , H01L21/67 , C25D17/06
摘要： A resistance measuring module for measuring electric resistance of a substrate holder is provided. The substrate holder has an electric contact configured to feed a current to a held substrate and contactable with the substrate. The substrate holder is able to hold a testing substrate for measurement of electric resistance of the substrate holder, and is configured such that the electric contact comes into contact with the testing substrate in a state where the testing substrate is held. The resistance measuring module includes: a test probe contactable with the testing substrate held in the substrate holder; and a resistance measuring instrument for measurement of a resistance value between the electric contact and the probe via the testing substrate.

5. 发明授权

US10119198B2 Method of cleaning substrate holder 有权
公开(公告)号：US10119198B2
公开(公告)日：2018-11-06
申请号：US15163588
申请日：2016-05-24
申请人： EBARA CORPORATION
发明人： Jumpei Fujikata , Masashi Shimoyama
IPC分类号： C25D21/08 , C25D17/06 , B08B3/08 , C25D5/12 , C25D17/00
摘要： A method of cleaning a substrate holder comprises suspending the substrate holder in a substrate holder cleaning bath while the substrate holder holds a dummy substrate with a sealing member sealing a peripheral portion of the dummy substrate. The dummy substrate has a larger area of contact with a substrate contact portion of the sealing member and has a larger area of contact with a substrate contact portion of an electrical contact of the substrate holder than those of a substrate to be plated. The method further comprises supplying a cleaning liquid into the substrate holder cleaning bath until the substrate holder is immersed in the cleaning liquid to clean the substrate holder. Different types of cleaning liquids are individually and sequentially supplied into the substrate holder cleaning bath to clean the substrate holder sequentially with the cleaning liquids.

6. 发明授权

US10113246B2 Substrate holder, plating apparatus, and plating method 有权
公开(公告)号：US10113246B2
公开(公告)日：2018-10-30
申请号：US15116197
申请日：2015-01-29
申请人： EBARA CORPORATION
发明人： Jumpei Fujikata , Yoshio Minami
IPC分类号： C25D17/06 , C25D7/12 , C25D17/02 , C25D21/12 , C25D17/00
摘要： A substrate holder includes: inner contacts (45) to be brought into contact with a periphery of a substrate (W) for passing an electric current to the substrate; outer contacts (42) each having elasticity, the outer contacts (42) having contact surfaces (42a), respectively, to be brought into contact with a feeding terminal (51) coupled to a power source (18), the outer contacts (42) being coupled to the inner contacts (45), respectively; and a conductive block (60) arranged in back of the contact surfaces (42a) and located away from the outer contacts (42). The outer contacts (42) are deformable until the outer contacts (42) are brought into contact with the conductive block (60) when the contact surfaces (42a) are pressed against the feeding terminal (51).

7. 外观设计

USD705280S1 Sealing ring 有权
标题翻译：密封圈
公开(公告)号：USD705280S1
公开(公告)日：2014-05-20
申请号：US29460477
申请日：2013-07-11
申请人： Ebara Corporation
设计人： Masaaki Kimura , Mitsutoshi Yahagi , Jumpei Fujikata

8. 发明授权

US11385125B2 Leak check method, leak check apparatus, plating method, and plating apparatus 有权
公开(公告)号：US11385125B2
公开(公告)日：2022-07-12
申请号：US16711983
申请日：2019-12-12
申请人： EBARA CORPORATION
发明人： Kiyoshi Suzuki , Jumpei Fujikata
IPC分类号： G01M3/32 , C25D7/12 , C25D17/06 , C25D17/00
摘要： A leak check method includes: performing a first inspection of measuring a pressure in an internal space formed by a seal of the substrate holder, while evacuating the internal space, and detecting that the pressure reaches a first pressure threshold value within a predetermined first inspection time; performing a second inspection of closing the internal space that has been evacuated, measuring the pressure in the closed internal space, and detecting that the pressure in the closed internal space does not exceed a second pressure threshold value within a predetermined second inspection time; and performing a third inspection of measuring a pressure difference between the pressure in the closed internal space and a vacuum pressure in a master container, and detecting that an amount of increase in the pressure difference within a predetermined third inspection time is kept equal to or below a pressure difference threshold value.

9. 发明申请

US20180179656A1 METHOD AND APPARATUS FOR PROCESSING A SUBSTRATE 审中-公开
公开(公告)号：US20180179656A1
公开(公告)日：2018-06-28
申请号：US15849371
申请日：2017-12-20
申请人： Ebara Corporation
发明人： Takahisa Okuzono , Jumpei Fujikata
IPC分类号： C25D5/34 , C25D17/00 , C25D17/06 , C25D21/12 , C25D21/08 , C23C18/18 , C23C18/16
CPC分类号： C25D5/34 , C23C18/163 , C23C18/1827 , C25D17/001 , C25D17/004 , C25D17/06 , C25D21/08 , C25D21/12
摘要： A method which can perform a soft pre-wetting treatment of a substrate, such as a wafer, with use of a pre-wetting liquid in a smaller amount. This method includes: holding a substrate between a first holding member and a second holding member, with the surface of the substrate being exposed through an opening of the second holding member, and pressing a sealing ridge of the substrate holder against a peripheral portion of the substrate; pressing a sealing block against the substrate holder; forming a vacuum in an external space; performing a seal inspection to check a sealed state provided by the sealing ridge based on a change in pressure in the external space; and performing a pre-wetting treatment by supplying a pre-wetting liquid to the external space while evacuating air from the external space to bring the pre-wetting liquid into contact with the exposed surface of the substrate.

10. 发明授权

US09376760B2 Plating apparatus and method of cleaning substrate holder 有权
标题翻译：电镀装置及其清洗方法
公开(公告)号：US09376760B2
公开(公告)日：2016-06-28
申请号：US13943984
申请日：2013-07-17
申请人： EBARA CORPORATION
发明人： Jumpei Fujikata , Masashi Shimoyama
IPC分类号： B08B3/00 , C25D21/08 , C25D17/06 , C25D5/12 , C25D17/00
CPC分类号： C25D21/08 , B08B3/08 , C25D5/12 , C25D17/001 , C25D17/06
摘要： A plating apparatus includes: a plating bath configured to store a plating solution therein; a substrate transport device configured to remove a substrate before plating from a substrate cassette and return the substrate after plating to the substrate cassette; a substrate holder configured to detachably hold the substrate with a sealing member sealing a peripheral portion of the substrate and immerse the substrate in the plating solution in the plating bath; a dummy substrate arranged in a position accessible by the substrate transport device; and a substrate holder cleaning bath configured to immerse the substrate holder in a cleaning liquid to clean the substrate holder when holding the dummy substrate with the sealing member sealing a peripheral portion of the dummy substrate.
摘要翻译：电镀装置包括：电镀液，其被配置为在其中存储电镀液; 基板输送装置，其被配置为在从基板盒进行电镀之前去除基板，并且在电镀之后将所述基板返回到所述基板盒; 衬底保持器，其被构造成用封闭所述衬底的周边部分的密封构件可拆卸地保持所述衬底，并将所述衬底浸入所述电镀液中的所述电镀溶液中; 布置在由所述基板输送装置可接近的位置的虚设基板; 以及衬底保持器清洗槽，其被配置为当用密封构件密封虚设衬底的周边部分来保持虚设衬底时，将衬底保持器浸入清洁液中以清洁衬底保持器。

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