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    • 1. 发明授权
    • Plating method and plating apparatus
    • 电镀方法和电镀装置
    • US09340891B2
    • 2016-05-17
    • US13849178
    • 2013-03-22
    • EBARA CORPORATION
    • Yoshio MinamiJumpei FujikataTakashi Kishi
    • C25D17/00C25D17/06C25D21/12
    • C25D17/06C25D17/001C25D17/004C25D21/12
    • A plating method includes holding a substrate with a substrate holder while bringing a sealing member into pressure contact with a peripheral portion of the substrate to form an enclosed internal space in the substrate holder; performing a first-stage leakage test of the substrate holder by producing a vacuum in the internal space and checking whether pressure in the internal space reaches a predetermined vacuum pressure within a certain period of time; and if the substrate holder has passed the first-stage leakage test, performing a second-stage leakage test of the substrate holder by closing off the internal space after producing the vacuum therein and checking whether a change in the pressure in the internal space reaches a predetermined value within a certain period of time.
    • 一种电镀方法,包括:在使基板保持器的基板与基板的周边部分压力接触的同时保持基板,同时在所述基板支架内形成封闭的内部空间; 通过在内部空间中产生真空并检查内部空间中的压力是否在一定时间内达到预定的真空压力来进行基板保持器的第一级泄漏测试; 并且如果衬底保持器已经通过了第一级泄漏测试,则通过在其中产生真空之后关闭内部空间来进行衬底保持器的第二级泄漏测试,并且检查内部空间中的压力变化是否达到 一定时间内的预定值。