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1. 发明授权

US11047063B2 Plating apparatus and plating method 有权
公开(公告)号：US11047063B2
公开(公告)日：2021-06-29
申请号：US16373456
申请日：2019-04-02
申请人： EBARA CORPORATION
发明人： Jumpei Fujikata , Masashi Shimoyama , Yoichi Nakagawa , Yoshitaka Mukaiyama , Yoshio Minami
IPC分类号： C25D17/00 , C25D5/02 , C25D17/06 , C25D17/10
摘要： A plating apparatus according to the present disclosure includes an anode holder configured to hold an anode; a substrate holder placed opposite the anode holder and configured to hold a substrate; and an anode mask installed on a front face of the anode holder and provided with a first opening adapted to allow passage of an electric current flowing between an anode and the substrate. The diameter of the first opening in the anode mask is configured to be adjustable. When a first substrate is plated, a diameter of the first opening is adjusted to a first diameter. When a second substrate is plated, the diameter of the first opening is adjusted to a second diameter smaller than the first diameter.

2. 发明授权

US09677189B2 Plating apparatus and method of determining electric resistance of electric contact of substrate holder 有权
公开(公告)号：US09677189B2
公开(公告)日：2017-06-13
申请号：US14670647
申请日：2015-03-27
申请人： Ebara Corporation
发明人： Yoshio Minami
IPC分类号： C25D7/12 , C25D17/00 , C25D21/12 , C25D17/06
CPC分类号： C25D7/12 , C25D17/001 , C25D17/005 , C25D17/06 , C25D21/12
摘要： A plating apparatus that can obtain each one of electric resistances of plural inner contacts of a substrate holder is disclosed. The plating apparatus includes a resistance-measuring device configured to measure a combined resistance of two electric contacts selected from the plural electric contacts, repeat measuring of a combined resistance of two electric contacts while changing a combination of two electric contacts until a same number of plural combined resistances as the plural electric contacts are measured, create linear equations by coupling each of the plural combined resistances to two variables with use of an equal sign, the two variables representing electric resistances of the corresponding two electric contacts, and solve the linear equations to determine each one of electric resistances of the plural electric contacts.

3. 发明授权

US10113246B2 Substrate holder, plating apparatus, and plating method 有权
公开(公告)号：US10113246B2
公开(公告)日：2018-10-30
申请号：US15116197
申请日：2015-01-29
申请人： EBARA CORPORATION
发明人： Jumpei Fujikata , Yoshio Minami
IPC分类号： C25D17/06 , C25D7/12 , C25D17/02 , C25D21/12 , C25D17/00
摘要： A substrate holder includes: inner contacts (45) to be brought into contact with a periphery of a substrate (W) for passing an electric current to the substrate; outer contacts (42) each having elasticity, the outer contacts (42) having contact surfaces (42a), respectively, to be brought into contact with a feeding terminal (51) coupled to a power source (18), the outer contacts (42) being coupled to the inner contacts (45), respectively; and a conductive block (60) arranged in back of the contact surfaces (42a) and located away from the outer contacts (42). The outer contacts (42) are deformable until the outer contacts (42) are brought into contact with the conductive block (60) when the contact surfaces (42a) are pressed against the feeding terminal (51).

4. 发明授权

US10077504B2 Plating apparatus 有权
公开(公告)号：US10077504B2
公开(公告)日：2018-09-18
申请号：US15450873
申请日：2017-03-06
申请人： EBARA CORPORATION
发明人： Yoshio Minami , Ryuya Koizumi
IPC分类号： C23C18/16 , C25D17/06 , C25D17/00 , C25D21/12 , H01L21/67 , H01L21/677 , H01L21/687 , H01L23/00
CPC分类号： C25D17/001 , C23C18/1628 , C23C18/163 , C23C18/1632 , C23C18/1675 , C25D17/06 , C25D21/12 , H01L21/6723 , H01L21/67751 , H01L21/68721 , H01L24/743 , H01L24/83 , H01L2924/0002 , H01L2924/00
摘要： A plating apparatus is described. The apparatus includes: a substrate holder configured to hold a substrate in a vertical position; at least one processing bath configured to process the substrate held by the substrate holder; a transporter configured to grip and horizontally transport the substrate holder; at least one lifter configured to receive the substrate holder from the transporter, lower the substrate holder to place the substrate holder in the processing bath, elevate the substrate holder from the processing bath after processing of the substrate, and transfer the substrate holder to the transporter; and a controller configured to control operations of the transporter and the lifter.

5. 发明授权

US09624594B2 Plating apparatus 有权
公开(公告)号：US09624594B2
公开(公告)日：2017-04-18
申请号：US14194514
申请日：2014-02-28
申请人： EBARA CORPORATION
发明人： Yoshio Minami , Ryuya Koizumi
IPC分类号： C25D17/00 , C25D17/06 , C23C18/16 , H01L21/02 , C25D21/12 , H01L21/67 , H01L21/677 , H01L21/687
CPC分类号： C25D17/001 , C23C18/1628 , C23C18/163 , C23C18/1632 , C23C18/1675 , C25D17/06 , C25D21/12 , H01L21/6723 , H01L21/67751 , H01L21/68721 , H01L24/743 , H01L24/83 , H01L2924/0002 , H01L2924/00
摘要： A plating apparatus is described. The apparatus includes: a substrate holder configured to hold a substrate in a vertical position; at least one processing bath configured to process the substrate held by the substrate holder; a transporter configured to grip and horizontally transport the substrate holder; at least one lifter configured to receive the substrate holder from the transporter, lower the substrate holder to place the substrate holder in the processing bath, elevate the substrate holder from the processing bath after processing of the substrate, and transfer the substrate holder to the transporter; and a controller configured to control operations of the transporter and the lifter.

6. 发明授权

US09844794B2 Substrate plating apparatus and substrate plating method 有权
公开(公告)号：US09844794B2
公开(公告)日：2017-12-19
申请号：US14257929
申请日：2014-04-21
申请人： EBARA CORPORATION
发明人： Yoshio Minami , Masaaki Kimura
IPC分类号： B08B3/04 , B05C3/02 , B05C21/00 , B05C3/04 , C25D17/00 , C25D17/06 , C25D21/08
CPC分类号： B05C3/02 , B05C3/04 , B05C21/00 , B08B3/047 , C25D17/001 , C25D17/004 , C25D17/06 , C25D21/08
摘要： A substrate plating apparatus is disclosed. The apparatus includes a substrate holder; a plating bath configured to plate a surface of the substrate in a plating solution; a cleaning bath configured to clean the substrate holder and the substrate with a cleaning liquid; an inner shell disposed in the cleaning bath and configured to house the substrate holder holding the substrate therein; and a cleaning liquid supply conduit configured to supply a cleaning liquid into the inner shell to clean the substrate, together with the substrate holder, with the cleaning liquid. The inner shell has an inner surface having an uneven configuration that follows an uneven exterior configuration of the substrate holder holding the substrate.

7. 发明授权

US09340891B2 Plating method and plating apparatus 有权
标题翻译：电镀方法和电镀装置
公开(公告)号：US09340891B2
公开(公告)日：2016-05-17
申请号：US13849178
申请日：2013-03-22
申请人： EBARA CORPORATION
发明人： Yoshio Minami , Jumpei Fujikata , Takashi Kishi
IPC分类号： C25D17/00 , C25D17/06 , C25D21/12
CPC分类号： C25D17/06 , C25D17/001 , C25D17/004 , C25D21/12
摘要： A plating method includes holding a substrate with a substrate holder while bringing a sealing member into pressure contact with a peripheral portion of the substrate to form an enclosed internal space in the substrate holder; performing a first-stage leakage test of the substrate holder by producing a vacuum in the internal space and checking whether pressure in the internal space reaches a predetermined vacuum pressure within a certain period of time; and if the substrate holder has passed the first-stage leakage test, performing a second-stage leakage test of the substrate holder by closing off the internal space after producing the vacuum therein and checking whether a change in the pressure in the internal space reaches a predetermined value within a certain period of time.
摘要翻译：一种电镀方法，包括：在使基板保持器的基板与基板的周边部分压力接触的同时保持基板，同时在所述基板支架内形成封闭的内部空间; 通过在内部空间中产生真空并检查内部空间中的压力是否在一定时间内达到预定的真空压力来进行基板保持器的第一级泄漏测试; 并且如果衬底保持器已经通过了第一级泄漏测试，则通过在其中产生真空之后关闭内部空间来进行衬底保持器的第二级泄漏测试，并且检查内部空间中的压力变化是否达到一定时间内的预定值。

8. 发明授权

US10294578B2 Plating apparatus and plating method 有权
公开(公告)号：US10294578B2
公开(公告)日：2019-05-21
申请号：US14919002
申请日：2015-10-21
申请人： EBARA CORPORATION
发明人： Jumpei Fujikata , Masashi Shimoyama , Yoichi Nakagawa , Yoshitaka Mukaiyama , Yoshio Minami
IPC分类号： C25D5/02 , C25D17/00 , C25D17/06 , C25D17/10
摘要： A plating apparatus according to the present disclosure includes an anode holder configured to hold an anode; a substrate holder placed opposite the anode holder and configured to hold a substrate; and an anode mask installed on a front face of the anode holder and provided with a first opening adapted to allow passage of an electric current flowing between an anode and the substrate. The diameter of the first opening in the anode mask is configured to be adjustable. When a first substrate is plated, a diameter of the first opening is adjusted to a first diameter. When a second substrate is plated, the diameter of the first opening is adjusted to a second diameter smaller than the first diameter.

9. 发明授权

US09984910B2 Plating apparatus and plating method 有权
公开(公告)号：US09984910B2
公开(公告)日：2018-05-29
申请号：US15630130
申请日：2017-06-22
申请人： EBARA CORPORATION
发明人： Yoshio Minami
IPC分类号： H01L21/677 , C25D17/00 , C25D17/06
CPC分类号： H01L21/67775 , C25D17/00 , C25D17/001 , C25D17/06
摘要： A plating apparatus allows a substrate holder to be serviced easily while ensuring easy access to the substrate holder and while a substrate is being processed in the plating apparatus. The plating apparatus includes a plating section for plating a substrate, a substrate holder for holding the substrate, a substrate holder transporter for holding and transporting the substrate holder, a stocker for storing the substrate holder, and a stocker setting section for storing the stocker therein. The stocker includes a moving mechanism for moving the stocker into and out of the stocker setting section.

10. 发明申请

US20150090584A1 PLATING APPARATUS AND CLEANING DEVICE USED IN THE PLATING APPARATUS 审中-公开
标题翻译：在镀膜设备中使用的镀膜装置和清洁装置
公开(公告)号：US20150090584A1
公开(公告)日：2015-04-02
申请号：US14497520
申请日：2014-09-26
申请人： Ebara Corporation
发明人： Yoshio Minami , Tsutomu Nakada
IPC分类号： C25D17/06 , C25D3/48 , C25D21/08
CPC分类号： C25D17/06 , C25D3/48 , C25D17/001 , C25D17/004 , C25D17/005 , C25D17/02 , C25D21/08
摘要： A plating apparatus for plating a substrate is disclosed. The plating apparatus includes: a dip-type plating bath; a dry-type plating bath having a hole in a sidewall thereof; and a pressing mechanism configured to press a substrate holder, holding a substrate, against the sidewall of the dry-type plating bath to close the hole. The substrate holder includes a base member and a holding member configured to sandwich the substrate therebetween, a first seal portion configured to seal a gap between the substrate and the holding member, a second seal portion configured to seal a gap between the base member and the holding member, and a third seal portion configured to seal a gap between the holding member and the sidewall of the dry-type plating bath.
摘要翻译：公开了一种用于电镀基板的电镀装置。电镀装置包括：浸渍型电镀浴; 在其侧壁上具有孔的干式电镀浴; 以及按压机构，其构造成将基板保持件按压在所述干式电镀液的侧壁上以将所述基板保持在所述侧壁上以封闭所述孔。衬底保持器包括基部构件和构造成将基板夹在其间的保持构件，被构造成密封基板和保持构件之间的间隙的第一密封部分，被构造成密封基底构件和基部构件之间的间隙的第二密封部分以及构造成密封所述保持构件与所述干式电镀浴的侧壁之间的间隙的第三密封部。

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