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1. 发明授权

US09293364B2 Electroless plating apparatus and electroless plating method 有权
标题翻译：无电镀设备和化学镀方法
公开(公告)号：US09293364B2
公开(公告)日：2016-03-22
申请号：US13677388
申请日：2012-11-15
申请人： EBARA CORPORATION , Dainippon Screen Mfg. Co., Ltd.
发明人： Hiroyuki Kanda , Junichiro Tsujino , Junko Mine , Makoto Kubota , Tsutomu Nakada , Kenichiro Arai
IPC分类号： H01L21/768 , C23C18/16 , H01L23/00 , C23C18/32 , C23C18/54
CPC分类号： C23C18/163 , C23C18/1628 , C23C18/1632 , C23C18/1642 , C23C18/1651 , C23C18/1669 , C23C18/1675 , C23C18/168 , C23C18/1682 , C23C18/1683 , C23C18/32 , C23C18/54 , H01L21/76838 , H01L24/11 , H01L24/13 , H01L24/742 , H01L2224/0401 , H01L2224/05567 , H01L2224/05624 , H01L2224/11464 , H01L2224/742 , H01L2924/00014 , H01L2924/00012 , H01L2224/05552
摘要： There is provided an electroless plating apparatus which, despite using a high-productivity batch processing method, can reduce the amount of a liquid chemical brought out of a processing tank, thereby reducing the cleaning time in a cleaning step, and can perform flushing easily and quickly. The electroless plating apparatus includes a pre-plating treatment module including a pre-plating treatment tank, a plating module, and an inter-module substrate transport device. The pre-plating treatment tank is provided with a pre-plating treatment solution circulation line having a temperature control function for a pre-plating treatment solution. The plating tank is provided with a plating solution circulation line having a filter and a temperature control function for a plating solution. The plating solution circulation line is connected to a flushing line for flushing the interior of the plating solution circulation line and the interior of the plating tank.
摘要翻译：提供了一种化学镀设备，尽管使用高生产率批量处理方法，但是可以减少从处理槽中排出的液体化学物质的量，从而减少清洁步骤中的清洁时间，并且可以容易地进行冲洗，很快。无电解电镀装置包括预镀处理模块，其包括预镀处理槽，镀覆模块和模块间基板输送装置。预镀处理槽设置有预镀处理液循环管线，其具有用于预镀处理溶液的温度控制功能。电镀槽具有电镀液循环管线，其具有用于电镀液的过滤器和温度控制功能。电镀液循环管线连接到用于冲洗电镀液循环管线内部和镀槽内部的冲洗管线。

2. 发明授权

US10968530B2 Electroplating device 有权
公开(公告)号：US10968530B2
公开(公告)日：2021-04-06
申请号：US16260153
申请日：2019-01-29
申请人： EBARA CORPORATION
发明人： Mitsuhiro Shamoto , Tsutomu Nakada , Masashi Shimoyama
IPC分类号： C25D17/12 , H01L21/67 , H01L21/687 , C25D17/06 , C25D5/08 , C25D21/00 , C25D17/00
摘要： In-plane uniformity of a membrane electroplated on a polygon substrate is improved. An electroplating device includes an anode holder configured to hold an anode, a substrate holder configured to hold a polygon substrate, and a regulation plate provided between the anode holder and the substrate holder. The regulation plate has a body portion having a first polygon opening following an outer shape of the polygon substrate, and wall portions protruding on a substrate holder side from edges of the first polygon opening. The wall portions protrude over a first distance on the substrate holder side in first regions which contain middle portions of sides of the first polygon opening, and are notched in second regions which contain corner portions of the first polygon opening, or protrude over a second distance smaller than the first distance on the substrate holder side.

3. 发明申请

US20150267302A1 ELECTROLESS PLATING METHOD 审中-公开
标题翻译：电镀法
公开(公告)号：US20150267302A1
公开(公告)日：2015-09-24
申请号：US14658616
申请日：2015-03-16
申请人： Ebara Corporation
发明人： Makoto Kubota , Akira Susaki , Masashi Shimoyama , Tsutomu Nakada
IPC分类号： C23C22/73
CPC分类号： C23C18/1834 , C23C18/1619 , C23C18/1651 , C23C18/1664 , C23C18/1675 , C23C18/1676
摘要： An electroless plating method which can prevent stoppage of a plating reaction and a decrease in a plating rate is disclosed. This method includes: circulating a plating solution through a plating bath while heating the plating solution; immersing the substrate in the plating solution in the plating bath; forming a first electroless plating film on the substrate while circulating the plating solution at a first flow rate during a period from when the substrate is immersed in the plating solution until a predetermined time elapses; and forming a second electroless plating film on the first electroless plating film while circulating the plating solution at a second flow rate that is lower than the first flow rate after the predetermined time has elapsed.
摘要翻译：公开了一种能够防止电镀反应停止和电镀速度降低的无电镀方法。该方法包括：在加热电镀溶液的同时使镀液循环通过电镀液; 将基板浸渍在电镀液中的电镀液中; 在从基板浸入电镀液中经过预定时间的期间以第一流量使电镀液循环，在基板上形成第一无电镀膜; 在第一化学镀膜上形成第二无电镀膜，同时在经过规定时间后以比第一流量低的第二流量使电镀液循环。

4. 发明授权

US10914019B2 Plating apparatus and plating method 有权
公开(公告)号：US10914019B2
公开(公告)日：2021-02-09
申请号：US16174103
申请日：2018-10-29
申请人： EBARA CORPORATION
发明人： Shao Hua Chang , Yasuyuki Masuda , Jumpei Fujikata , Masashi Shimoyama , Tsutomu Nakada
IPC分类号： C25D21/10 , C25D17/00
摘要： A plating apparatus for plating a substrate is provided to reduce vibration of a paddle. The plating apparatus includes a plating bath configured to accommodate plating solution; a paddle that is arranged in the plating bath, and configured to move in a reciprocating direction along a surface of the substrate to stir the plating solution; a support member for supporting a first end portion of the paddle; a first magnet provided on the paddle; and a second magnet provided on the plating bath. The first magnet and the second magnet are configured to exert a magnetic force on each other so that a second end portion on an opposite side to the first end portion of the paddle is suppressed from vibrating in directions approaching and leaving the substrate while the paddle is moving.

5. 发明授权

US10513795B2 Plating apparatus, plating method, and substrate holder 有权
公开(公告)号：US10513795B2
公开(公告)日：2019-12-24
申请号：US16396384
申请日：2019-04-26
申请人： EBARA CORPORATION
发明人： Junko Mine , Tsutomu Nakada , Mitsutoshi Yahagi
IPC分类号： C25D21/12 , H01L23/00 , H01L21/687 , C25D5/18 , C25D17/06 , C25D17/00
摘要： In-plane uniformity of a film that is plated on a polygonal substrate is enhanced. An anode holder configured to hold an anode, a substrate holder configured to hold a polygonal substrate, a plating bath for accommodating the anode holder and the substrate holder, and dipping the anode and the substrate in a plating solution, and a control device for controlling a current that flows between the anode and the substrate are included. The substrate holder has a plurality of power feeding members that are disposed along respective sides of the polygonal substrate. The control device is configured to be able to control the current so that currents of at least two different values are simultaneously supplied to the plurality of power feeding members.

6. 发明申请

US20150090584A1 PLATING APPARATUS AND CLEANING DEVICE USED IN THE PLATING APPARATUS 审中-公开
标题翻译：在镀膜设备中使用的镀膜装置和清洁装置
公开(公告)号：US20150090584A1
公开(公告)日：2015-04-02
申请号：US14497520
申请日：2014-09-26
申请人： Ebara Corporation
发明人： Yoshio Minami , Tsutomu Nakada
IPC分类号： C25D17/06 , C25D3/48 , C25D21/08
CPC分类号： C25D17/06 , C25D3/48 , C25D17/001 , C25D17/004 , C25D17/005 , C25D17/02 , C25D21/08
摘要： A plating apparatus for plating a substrate is disclosed. The plating apparatus includes: a dip-type plating bath; a dry-type plating bath having a hole in a sidewall thereof; and a pressing mechanism configured to press a substrate holder, holding a substrate, against the sidewall of the dry-type plating bath to close the hole. The substrate holder includes a base member and a holding member configured to sandwich the substrate therebetween, a first seal portion configured to seal a gap between the substrate and the holding member, a second seal portion configured to seal a gap between the base member and the holding member, and a third seal portion configured to seal a gap between the holding member and the sidewall of the dry-type plating bath.
摘要翻译：公开了一种用于电镀基板的电镀装置。电镀装置包括：浸渍型电镀浴; 在其侧壁上具有孔的干式电镀浴; 以及按压机构，其构造成将基板保持件按压在所述干式电镀液的侧壁上以将所述基板保持在所述侧壁上以封闭所述孔。衬底保持器包括基部构件和构造成将基板夹在其间的保持构件，被构造成密封基板和保持构件之间的间隙的第一密封部分，被构造成密封基底构件和基部构件之间的间隙的第二密封部分以及构造成密封所述保持构件与所述干式电镀浴的侧壁之间的间隙的第三密封部。

7. 发明授权

US10316426B2 Plating apparatus, plating method, and substrate holder 有权
公开(公告)号：US10316426B2
公开(公告)日：2019-06-11
申请号：US15248248
申请日：2016-08-26
申请人： EBARA CORPORATION
发明人： Junko Mine , Tsutomu Nakada , Mitsutoshi Yahagi
IPC分类号： C25D5/18 , C25D17/00 , C25D17/06 , C25D21/12 , H01L23/00 , H01L21/687
摘要： In-plane uniformity of a film that is plated on a polygonal substrate is enhanced. An anode holder configured to hold an anode, a substrate holder configured to hold a polygonal substrate, a plating bath for accommodating the anode holder and the substrate holder, and dipping the anode and the substrate in a plating solution, and a control device for controlling a current that flows between the anode and the substrate are included. The substrate holder has a plurality of power feeding members that are disposed along respective sides of the polygonal substrate. The control device is configured to be able to control the current so that currents of at least two different values are simultaneously supplied to the plurality of power feeding members.

8. 发明授权

US09708724B2 Anode unit and plating apparatus having such anode unit 有权
公开(公告)号：US09708724B2
公开(公告)日：2017-07-18
申请号：US14629453
申请日：2015-02-23
申请人： EBARA CORPORATION
发明人： Junichiro Tsujino , Tsutomu Nakada , Yusuke Tamari , Mitsutoshi Yahagi , Akira Owatari
IPC分类号： C25C7/02 , C25C7/00 , C25C3/16 , C25C3/12 , C25B9/00 , C25B9/02 , C25D17/12 , C25D17/00
CPC分类号： C25D17/12 , C25D17/001 , C25D17/007
摘要： An anode unit capable of forming a metal film having a uniform thickness on a substrate is disclosed. The anode unit includes an anode, a first feeding portion connected to a central portion of the anode, a second feeding portion located on a central axis of the anode and located away from the anode, and arms extending radially from the second feeding portion. The arms are connected to a periphery of the anode.

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