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1. 发明授权

US08755948B2 Controlling fluid coolant flow in cooling systems of computing devices 有权
标题翻译：控制计算设备冷却系统中的流体冷却剂流量
公开(公告)号：US08755948B2
公开(公告)日：2014-06-17
申请号：US12945958
申请日：2010-11-15
申请人： Fred A. Bower, III , Vinod Kamath , Michael S. Miller
发明人： Fred A. Bower, III , Vinod Kamath , Michael S. Miller
IPC分类号： G05D23/00 , G06F1/00
CPC分类号： G05D23/1934 , H05K7/20772 , H05K7/20836
摘要： Methods and systems for controlling fluid coolant flow in cooling systems of computing devices are disclosed. According to an aspect, a method may include determining a temperature of a fluid coolant in a cooling system of a computing device. For example, a temperature of water exiting a cooling system of a server may be determined. The method may also include determining an operational condition of the computing device. For example, a temperature of a processor, memory, or input/output (I/O) component may be determined. Further, the method may include controlling a flow of the fluid coolant through the cooling system based on the temperature of the fluid coolant and/or the operational condition.
摘要翻译：公开了用于控制计算设备的冷却系统中的流体冷却剂流的方法和系统。根据一个方面，一种方法可以包括确定计算装置的冷却系统中的流体冷却剂的温度。例如，可以确定离开服务器的冷却系统的水的温度。该方法还可以包括确定计算设备的操作条件。例如，可以确定处理器，存储器或输入/输出（I / O）组件的温度。此外，该方法可以包括基于流体冷却剂的温度和/或操作条件来控制通过冷却系统的流体冷却剂的流动。

2. 发明申请

US20120123595A1 CONTROLLING FLUID COOLANT FLOW IN COOLING SYSTEMS OF COMPUTING DEVICES 有权
标题翻译：控制计算机冷却系统中的流体冷却剂流动
公开(公告)号：US20120123595A1
公开(公告)日：2012-05-17
申请号：US12945958
申请日：2010-11-15
申请人： Fred A. Bower, III , Vinod Kamath , Michael S. Miller
发明人： Fred A. Bower, III , Vinod Kamath , Michael S. Miller
IPC分类号： G05D23/00 , G05D7/06 , F28D15/00
CPC分类号： G05D23/1934 , H05K7/20772 , H05K7/20836
摘要： Methods and systems for controlling fluid coolant flow in cooling systems of computing devices are disclosed. According to an aspect, a method may include determining a temperature of a fluid coolant in a cooling system of a computing device. For example, a temperature of water exiting a cooling system of a server may be determined. The method may also include determining an operational condition of the computing device. For example, a temperature of a processor, memory, or input/output (I/O) component may be determined. Further, the method may include controlling a flow of the fluid coolant through the cooling system based on the temperature of the fluid coolant and/or the operational condition.
摘要翻译：公开了用于控制计算设备的冷却系统中的流体冷却剂流的方法和系统。根据一个方面，一种方法可以包括确定计算装置的冷却系统中的流体冷却剂的温度。例如，可以确定离开服务器的冷却系统的水的温度。该方法还可以包括确定计算设备的操作条件。例如，可以确定处理器，存储器或输入/输出（I / O）组件的温度。此外，该方法可以包括基于流体冷却剂的温度和/或操作条件来控制通过冷却系统的流体冷却剂的流动。

3. 发明申请

US20130074339A1 Overmolded Dual In-Line Memory Module Cooling Structure 有权
标题翻译：包覆成型双列直插式存储器模块冷却结构
公开(公告)号：US20130074339A1
公开(公告)日：2013-03-28
申请号：US13247275
申请日：2011-09-28
申请人： Michael A. Boraas , Vinod Kamath , Michael S. Miller , Mark E. Steinke , Jamil A. Wakil
发明人： Michael A. Boraas , Vinod Kamath , Michael S. Miller , Mark E. Steinke , Jamil A. Wakil
IPC分类号： B21D53/02 , B23P15/26
CPC分类号： B23P15/26 , H01L21/565 , H01L23/3737 , H01L23/4334 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , Y10T29/53113 , H01L2924/00
摘要： Methods, apparatuses, and computer program products for forming an overmolded dual in-line memory module (DIMM) cooling structure are provided. Embodiments include identifying, by a tagging module, contextual information indicating circumstances in which the photograph was taken; based on the contextual information, selecting, by the tagging module, candidate profiles from a plurality of friend profiles associated with a profile of a user; and suggesting, by the tagging module to the user, the selected candidate profiles as potential friends to tag in the photograph.
摘要翻译：提供了用于形成包覆成型的双列直插存储器模块（DIMM）冷却结构的方法，装置和计算机程序产品。实施例包括通过标签模块识别指示拍摄照片的情况的上下文信息; 基于上下文信息，由标签模块从与用户的简档相关联的多个朋友简档中选择候选简档; 并且通过标签模块向用户提示所选择的候选简档作为在照片中标记的潜在朋友。

4. 发明授权

US08900503B2 Method of forming an overmolded dual in-line memory module cooling structure 有权
标题翻译：形成包覆成型双列直插式存储器模块冷却结构的方法
公开(公告)号：US08900503B2
公开(公告)日：2014-12-02
申请号：US13247275
申请日：2011-09-28
申请人： Michael A. Boraas , Vinod Kamath , Michael S. Miller , Mark E. Steinke , Jamil A. Wakil
发明人： Michael A. Boraas , Vinod Kamath , Michael S. Miller , Mark E. Steinke , Jamil A. Wakil
IPC分类号： B29C45/14
CPC分类号： B23P15/26 , H01L21/565 , H01L23/3737 , H01L23/4334 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , Y10T29/53113 , H01L2924/00
摘要： Methods, apparatuses, and computer program products for forming an overmolded dual in-line memory module (DIMM) cooling structure are provided. Embodiments include identifying, by a tagging module, contextual information indicating circumstances in which the photograph was taken; based on the contextual information, selecting, by the tagging module, candidate profiles from a plurality of friend profiles associated with a profile of a user; and suggesting, by the tagging module to the user, the selected candidate profiles as potential friends to tag in the photograph.
摘要翻译：提供了用于形成包覆成型的双列直插存储器模块（DIMM）冷却结构的方法，装置和计算机程序产品。实施例包括通过标签模块识别指示拍摄照片的情况的上下文信息; 基于上下文信息，由标签模块从与用户的简档相关联的多个朋友简档中选择候选简档; 并且通过标签模块向用户提示所选择的候选简档作为在照片中标记的潜在朋友。

5. 发明授权

US09307674B2 Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component 有权
公开(公告)号：US09307674B2
公开(公告)日：2016-04-05
申请号：US13102200
申请日：2011-05-06
申请人： Timothy J. Chainer , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark E. Steinke
发明人： Timothy J. Chainer , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark E. Steinke
IPC分类号： H01L23/427 , H01L23/473 , H05K7/20 , F28D15/02
CPC分类号： H05K7/20336 , F28D15/02 , H05K7/20509 , H05K7/20772 , H05K7/20936
摘要： Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

6. 发明授权

US09027360B2 Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system 有权
标题翻译：多组分电子系统的热电增强型液态冷却
公开(公告)号：US09027360B2
公开(公告)日：2015-05-12
申请号：US13102195
申请日：2011-05-06
申请人： Timothy J. Chainer , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark E. Steinke
发明人： Timothy J. Chainer , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark E. Steinke
IPC分类号： F25D23/12 , F25D17/06
CPC分类号： H05K7/20763 , F25B21/02 , F25B21/04 , F25D17/06 , H05K7/20254 , H05K7/20263 , H05K7/20781 , H05K7/2079 , H05K7/20836
摘要： Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled structure, a thermal conduction path coupling the electronic component and the liquid-cooled structure, a coolant loop in fluid communication with a coolant-carrying channel of the liquid-cooled structure, and an outdoor-air-cooled heat exchange unit coupled to facilitate heat transfer from the liquid-cooled structure via, at least in part, the coolant loop. The thermoelectric array facilitates transfer of heat from the electronic component to the liquid-cooled structure, and the heat exchange unit cools coolant passing through the coolant loop by dissipating heat from the coolant to outdoor ambient air. In one implementation, temperature of coolant entering the liquid-cooled structure is greater than temperature of the outdoor ambient air to which heat is dissipated.
摘要翻译：提供了用于促进电子部件的冷却的装置和方法。该装置包括液冷结构，耦合电子部件和液冷结构的热传导路径，与液冷结构的冷却剂传送通道流体连通的冷却剂回路，室外空气冷却热交换单元被耦合以便于至少部分地通过冷却剂回路从液冷结构经由热传递。热电阵列有助于将热量从电子部件传递到液冷结构，并且热交换单元通过将冷却剂的热量散发到室外环境空气来冷却通过冷却剂回路的冷却剂。在一个实施方案中，进入液冷结构的冷却剂的温度大于散热的室外环境空气的温度。

7. 发明授权

US08638559B2 User-serviceable liquid DIMM cooling system 有权
标题翻译：用户可维修的液体DIMM散热系统
公开(公告)号：US08638559B2
公开(公告)日：2014-01-28
申请号：US13293174
申请日：2011-11-10
申请人： Richard M. Barina , Vinod Kamath , Chunjian Ni , Derek I. Schmidt , Mark E. Steinke , James S. Womble
发明人： Richard M. Barina , Vinod Kamath , Chunjian Ni , Derek I. Schmidt , Mark E. Steinke , James S. Womble
IPC分类号： H05K7/20
CPC分类号： F28D15/0275 , G06F1/185 , G06F1/20 , H01L23/4093 , H01L23/427 , H01L23/473 , H01L2924/0002 , H05K7/20509 , H05K7/20772 , H05K7/20809 , H01L2924/00
摘要： A cooling system for a memory module comprises a heat conduction assembly for conducting heat from the memory module to liquid-cooled mounting blocks. In one embodiment, each heat conduction assembly includes a frame having opposing first and second supports, first and second heat spreader plates each extending from the first support to the second support, and a pair of flattened heat pipes each extending along a respective one of the heat spreader plates from the first support to the second support. The liquid-cooled mounting blocks releasably support the heat conduction assembly over a memory module socket with the memory module between the heat spreader plates.
摘要翻译：用于存储器模块的冷却系统包括用于将热量从存储器模块传导到液冷的安装块的热传导组件。在一个实施例中，每个热传导组件包括具有相对的第一和第二支撑件的框架，每个从第一支撑件延伸到第二支撑件的第一和第二散热板，以及一对扁平化的热管，散热板从第一支撑到第二支撑。液体冷却的安装块通过存储器模块插座可释放地支撑热传导组件，存储器模块位于散热板之间。

8. 发明授权

US08493738B2 Cooled electronic system with thermal spreaders coupling electronics cards to cold rails 失效
标题翻译：冷却电子系统，散热器将电子卡耦合到冷轨
公开(公告)号：US08493738B2
公开(公告)日：2013-07-23
申请号：US13102211
申请日：2011-05-06
申请人： Timothy J. Chainer , Michael A. Gaynes , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark D. Schultz , Daniel P. Simco , Mark E. Steinke
发明人： Timothy J. Chainer , Michael A. Gaynes , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark D. Schultz , Daniel P. Simco , Mark E. Steinke
IPC分类号： H05K7/20
CPC分类号： H05K7/20772 , H05K7/20781 , H05K7/2079
摘要： Liquid-cooled electronic systems are provided which include an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket or removal of the card from the socket. A liquid-cooled cold rail is disposed at the one end of the socket, and a thermal spreader couples the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The thermally conductive extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.
摘要翻译：提供液冷电子系统，其包括具有电子卡的电子组件和在一端具有闩锁的插座。闩锁有助于将卡固定在插座内或从插座中取出卡。液冷冷轨布置在插座的一端，散热器将电子卡连接到冷轨。热散布器包括耦合到卡的相对侧上的第一和第二表面的第一和第二热传递板，以及从板的端部边缘延伸的导热延伸件，其将相应的传递板联接到液体冷却的冷轨。导热延伸部设置在闩锁的侧面，并且卡可以使用闩锁固定在插座内或从插座中移除而不移除冷轨或散热器。

9. 发明申请

US20120254400A1 SYSTEM TO IMPROVE OPERATION OF A DATA CENTER WITH HETEROGENEOUS COMPUTING CLOUDS 有权
标题翻译：改进具有异质计算云的数据中心的操作的系统
公开(公告)号：US20120254400A1
公开(公告)日：2012-10-04
申请号：US13077578
申请日：2011-03-31
申请人： Madhusudan K. Iyengar , Vinod Kamath , Eren Kursun , Roger R. Schmidt
发明人： Madhusudan K. Iyengar , Vinod Kamath , Eren Kursun , Roger R. Schmidt
IPC分类号： G06F15/173
CPC分类号： G06F9/5094 , Y02D10/22
摘要： A system to improve operation of a data center with heterogeneous computing clouds may include monitoring components to track data center climate controls and individual heterogeneous computing clouds' operating parameters within the data center. The system may also include a controller that regulates the individual heterogeneous computing clouds and data center climate controls based upon data generated by the monitoring components to improve the operating performance of the individual heterogeneous computing clouds as well as the operating performance of the data center. The system may further include spilling computing clouds to receive excess workload of an individual heterogeneous computing cloud without violating individual heterogeneous computing clouds contracts.
摘要翻译：改进具有异构计算云的数据中心运行的系统可能包括监视组件以跟踪数据中心气候控制和数据中心内的个别异构计算云运行参数。该系统还可以包括控制器，其基于由监视组件生成的数据来调节各个异构计算云和数据中心气候控制，以改善各个异构计算云的操作性能以及数据中心的操作性能。该系统可以进一步包括溢出计算云以接收单个异构计算云的额外的工作量，而不违反个别的异构计算云合同。

10. 发明授权

US07826215B2 Ducted air temperature sensor 有权
标题翻译：导管空气温度传感器
公开(公告)号：US07826215B2
公开(公告)日：2010-11-02
申请号：US12032230
申请日：2008-02-15
申请人： Troy Williams Glover , Michael Sean June , Vinod Kamath , Whitcomb Randloph Scott, III
发明人： Troy Williams Glover , Michael Sean June , Vinod Kamath , Whitcomb Randloph Scott, III
IPC分类号： H05K7/20 , F28F7/00 , H05K5/00 , G05D23/00
CPC分类号： H05K7/20836 , H05K7/20727
摘要： A temperature isolation duct in a computer system comprising a chassis securing a circuit board and a fan system that draws air through the chassis, and a heat-generating component is mounted on the circuit board and exposed to the air flow. The hot air duct passively directs air heated by the heat-generating component from a single hot air duct inlet in direct downstream alignment with the heat-generating component to a single hot air duct outlet. A thermal sensor is secured within, or in direct alignment with, the hot air duct near the duct outlet for sensing the temperature of air flowing through the hot air duct and generating a temperature signal. A controller is in electronic communication with the thermal sensor for receiving the temperature signal and in electronic communication with the fan system for sending a fan speed control signal.
摘要翻译：计算机系统中的温度隔离管道，包括固定电路板的底盘和通过底盘吸入空气的风扇系统，以及发电部件安装在电路板上并暴露于空气流中。热风管道将发热部件加热的空气从发热部件直接下游对准，将单个热风管道入口导向单个热风管道出口。热传感器固定在管道出口附近的热空气管道内或与其直接对准，以便感测流过热风管道的空气的温度并产生温度信号。控制器与热传感器进行电子通信，用于接收温度信号，并与风扇系统进行电子通信，以发送风扇速度控制信号。

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