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1. 发明授权

US09373735B2 Polyimide-metal laminate and solar cell 有权
标题翻译：聚酰亚胺金属层压板和太阳能电池
公开(公告)号：US09373735B2
公开(公告)日：2016-06-21
申请号：US12993951
申请日：2009-05-20
申请人： Hiroto Shimokawa , Takeshi Uekido , Naoyuki Matsumoto , Ken Kawagishi , Hiroaki Yamaguchi
发明人： Hiroto Shimokawa , Takeshi Uekido , Naoyuki Matsumoto , Ken Kawagishi , Hiroaki Yamaguchi
IPC分类号： H01L31/032 , H01L31/0392 , B29C41/24 , B29K79/00
CPC分类号： H01L31/0322 , B29C41/24 , B29K2079/08 , H01L31/03928 , Y02E10/541 , Y02P70/521
摘要： A polyimide-metal laminate comprising a polyimide film and a metal layer for use as an electrode, which is formed on the side (Side B) of the polyimide film which was in contact with a support when producing a self-supporting film in the production of the polyimide film, is used to produce a CIS solar cell.
摘要翻译：一种聚酰亚胺 - 金属层压体，其包含聚酰亚胺膜和用作电极的金属层，所述聚酰亚胺金属层叠体形成在所述聚酰亚胺膜的侧面（B侧），所述聚酰亚胺膜在制造时制造自支撑膜时与载体接触的聚酰亚胺膜用于制造CIS太阳能电池。

2. 发明申请

US20110079277A1 POLYIMIDE-METAL LAMINATE AND SOLAR CELL 有权
标题翻译：聚酰亚胺金属层压板和太阳能电池
公开(公告)号：US20110079277A1
公开(公告)日：2011-04-07
申请号：US12993951
申请日：2009-05-20
申请人： Hiroto Shimokawa , Takeshi Uekido , Naoyuki Matsumoto , Ken Kawagishi , Hiroaki Yamaguchi
发明人： Hiroto Shimokawa , Takeshi Uekido , Naoyuki Matsumoto , Ken Kawagishi , Hiroaki Yamaguchi
IPC分类号： H01L31/0272 , H01L31/0216 , H01L31/0224 , H01L31/04 , H01L31/18
CPC分类号： H01L31/0322 , B29C41/24 , B29K2079/08 , H01L31/03928 , Y02E10/541 , Y02P70/521
摘要： A polyimide-metal laminate comprising a polyimide film and a metal layer for use as an electrode, which is formed on the side (Side B) of the polyimide film which was in contact with a support when producing a self-supporting film in the production of the polyimide film, is used to produce a CIS solar cell.
摘要翻译：一种聚酰亚胺 - 金属层压体，其包含聚酰亚胺膜和用作电极的金属层，所述聚酰亚胺金属层叠体形成在所述聚酰亚胺膜的侧面（B侧），所述聚酰亚胺膜在制造时制造自支撑膜时与载体接触的聚酰亚胺膜用于制造CIS太阳能电池。

3. 发明授权

US09209333B2 Aromatic polyimide film, laminate and solar cell 有权
标题翻译：芳香聚酰亚胺薄膜，层压板和太阳能电池
公开(公告)号：US09209333B2
公开(公告)日：2015-12-08
申请号：US12993970
申请日：2009-05-20
申请人： Hiroto Shimokawa , Takeshi Uekido , Ken Kawagishi , Hiroaki Yamaguchi
发明人： Hiroto Shimokawa , Takeshi Uekido , Ken Kawagishi , Hiroaki Yamaguchi
IPC分类号： H01L31/0392 , C08J5/18
CPC分类号： H01L31/0392 , C08J5/18 , C08J2379/08 , H01L31/03928 , Y02E10/541 , Y02P70/521 , Y10T428/31681
摘要： Disclosed is a polyimide film prepared from an aromatic tetracarboxylic acid component and an aromatic diamine component, which has a dimensional change from 25° C. to 500° C. within a range of from −0.3% to +0.6% based on the initial dimension at 25° C. The polyimide film may be used as a substrate for a CIS solar cell.
摘要翻译：公开了由芳香族四羧酸成分和芳香族二胺成分制成的聚酰亚胺膜，其在基于初始尺寸的范围内，在从25℃至500℃的范围内变化范围为-0.3％至+ 0.6％聚酰亚胺膜可以用作CIS太阳能电池的基板。

4. 发明申请

US20110067760A1 AROMATIC POLYIMIDE FILM, LAMINATE AND SOLAR CELL 有权
标题翻译：芳香聚酰亚胺膜，层压板和太阳能电池
公开(公告)号：US20110067760A1
公开(公告)日：2011-03-24
申请号：US12993970
申请日：2009-05-20
申请人： Hiroto Shimokawa , Takeshi Uekido , Ken Kawagishi , Hiroaki Yamaguchi
发明人： Hiroto Shimokawa , Takeshi Uekido , Ken Kawagishi , Hiroaki Yamaguchi
IPC分类号： C08G73/10 , B32B15/08 , H01L31/0216
CPC分类号： H01L31/0392 , C08J5/18 , C08J2379/08 , H01L31/03928 , Y02E10/541 , Y02P70/521 , Y10T428/31681
摘要： Disclosed is a polyimide film prepared from an aromatic tetracarboxylic acid component and an aromatic diamine component, which has a dimensional change from 25° C. to 500° C. within a range of from −0.3% to +0.6% based on the initial dimension at 25° C. The polyimide film may be used as a substrate for a CIS solar cell.
摘要翻译：公开了由芳香族四羧酸成分和芳香族二胺成分制成的聚酰亚胺膜，其在基于初始尺寸的范围内，在从25℃至500℃的范围内变化范围为-0.3％至+ 0.6％聚酰亚胺膜可以用作CIS太阳能电池的基板。

5. 发明授权

US08858751B2 Method for producing flexible metal laminate 有权
标题翻译：柔性金属层压板的制造方法
公开(公告)号：US08858751B2
公开(公告)日：2014-10-14
申请号：US13395822
申请日：2010-09-09
申请人： Takuro Kochiyama , Hiroto Shimokawa , Yoshitaka Mineki , Masami Sasaki
发明人： Takuro Kochiyama , Hiroto Shimokawa , Yoshitaka Mineki , Masami Sasaki
IPC分类号： B32B37/04 , B32B15/08 , B32B37/10 , H05K3/02 , B32B15/20 , B32B27/34 , H05K1/03
CPC分类号： H05K3/022 , B32B15/08 , B32B15/20 , B32B27/34 , B32B37/1027 , B32B2307/406 , B32B2307/408 , B32B2311/00 , B32B2379/08 , H05K1/0393 , H05K2201/0355 , H05K2203/068 , H05K2203/1545 , Y10T156/10
摘要： A method for producing a flexible metal laminate includes continuously thermocompression-bonding laminate metal foils to a resin film. The thermocompression-bonding step is conducted by placing a protection metal foil between a pressure surface of a heat and pressure forming apparatus and the laminate metal foils. When the protection metal foil is subjected to an abrasion resistance test, in which the protection metal foil is placed such that a matte surface of the protection metal foil contacts a plate material having a surface equivalent to the pressure surface and in which the matte surface is rubbed against the surface of the plate material by applying a load to a shiny surface of the protection metal foil and pulling the protection metal foil, a streak is found on the matte surface only in a case where the load is over 500 g per area of 76 mm×26 mm.
摘要翻译：柔性金属层叠体的制造方法包括将层压金属箔连续热压接在树脂膜上。通过将保护金属箔放置在热压成形装置的压力表面和层压金属箔之间来进行热压接步骤。当保护金属箔经受耐磨性试验时，其中保护金属箔被放置成使得保护金属箔的无光泽表面与具有与压力表面相当的表面的板材接触，并且其中无光泽表面是通过向保护金属箔的光泽表面施加负载并拉动保护金属箔而摩擦板材表面，仅在每个面积的负载超过500g的情况下，在无光泽表面上发现条纹 76毫米×26毫米。

6. 发明申请

US20060154037A1 Polyimide-copper composite laminate 审中-公开
标题翻译：聚酰亚胺 - 铜复合层压板
公开(公告)号：US20060154037A1
公开(公告)日：2006-07-13
申请号：US11052829
申请日：2005-02-09
申请人： Hiroto Shimokawa , Kohji Narui , Toshinori Hosoma , Toshihiko Anno
发明人： Hiroto Shimokawa , Kohji Narui , Toshinori Hosoma , Toshihiko Anno
IPC分类号： B32B15/08 , B32B27/06
CPC分类号： B32B9/005 , B32B9/041 , B32B15/08 , B32B15/20 , B32B27/281 , B32B27/34 , B32B2250/05 , B32B2250/40 , B32B2274/00 , B32B2307/306 , B32B2307/732 , B32B2457/08 , H05K1/0346 , H05K3/025 , H05K2201/0154 , H05K2203/0152 , Y10T428/24975 , Y10T428/31681 , Y10T428/31721
摘要： A polyimide-copper composite laminate is composed of a metallic carrier having a thickness of 10-35 μm and a thin copper film having a thickness of 1-8 μm, and an intervening heat-resistant layer and an aromatic polyimide film directly fixed to the thin copper film without adhesive.
摘要翻译：聚酰亚胺 - 铜复合层叠体由厚度为10-35μm的金属载体和厚度为1-8μm的薄铜膜构成，并且将中间耐热层和芳香族聚酰亚胺膜直接固定在薄铜膜无粘合剂。

7. 发明申请

US20090136725A1 PROCESS FOR PRODUCING COPPER WIRING POLYIMIDE FILM, AND COPPER WIRING POLYIMIDE FILM 审中-公开
标题翻译：生产铜线聚酰亚胺膜和铜线聚酰亚胺薄膜的方法
公开(公告)号：US20090136725A1
公开(公告)日：2009-05-28
申请号：US12294421
申请日：2007-03-23
申请人： Hiroto Shimokawa , Keita Bamba
发明人： Hiroto Shimokawa , Keita Bamba
IPC分类号： H05K3/18 , H05K1/09 , H05K3/38 , B44C1/22 , B05D5/12 , B32B15/08
CPC分类号： H05K3/108 , H05K1/0346 , H05K3/025 , H05K3/427 , H05K2201/0154 , H05K2203/0264 , H05K2203/0353 , Y10T156/11 , Y10T428/24917 , Y10T428/265
摘要： There is disclosed a copper wiring polyimide film having wiring with ultra fine pitch and excellent in the linearity. The copper wiring polyimide film is produced by a process for producing a copper wiring polyimide film having a 20 to 45 μm-pitch copper wiring part by a semi-additive method using a copper foil laminated polyimide film with carrier. The process comprises (a) a step of providing a copper foil laminated film comprising a copper foil having a film side surface roughness Rz of not more than 1.0 μm and a thickness in the range of 0.5 to 2 μm laminated on a surface of a polyimide film, (b) a step of forming a plating resist pattern layer in which a wiring pattern having 20 to 45 μm pitch can be formed on the upper surface of the copper foil, (c) a step of conducting copper plating on the copper foil part exposed from the resist, (d) a step of removing the plating resist, and (e) a step of removing the copper foil exposed on the plating resist-removed part to expose a polyimide film.
摘要翻译：公开了具有超细间距的布线并且线性优异的铜布线聚酰亚胺膜。铜布线性聚酰亚胺膜是通过使用铜箔层叠聚酰亚胺膜与载体的半添加法制造具有20〜45μm间距铜配线部的铜布线聚酰亚胺膜的工序。该方法包括（a）提供包含铜箔的铜箔层压膜的步骤，该铜箔层压膜层压在聚酰亚胺表面上的具有不大于1.0μm的膜侧表面粗糙度Rz和0.5-2μm的厚度的铜箔薄膜，（b）形成电镀抗蚀剂图案层的步骤，其中可以在铜箔的上表面上形成具有20至45μm间距的布线图案，（c）在铜箔上进行镀铜的步骤（d）去除电镀抗蚀剂的步骤，（e）除去暴露在电镀抗蚀剂去除部分上的铜箔以露出聚酰亚胺膜的步骤。

8. 发明申请

US20120168053A1 METHOD FOR PRODUCING FLEXIBLE METAL LAMINATE 有权
标题翻译：生产柔性金属层压板的方法
公开(公告)号：US20120168053A1
公开(公告)日：2012-07-05
申请号：US13395822
申请日：2010-09-09
申请人： Takuro Kochiyama , Hiroto Shimokawa , Yoshitaka Mineki , Masami Sasaki
发明人： Takuro Kochiyama , Hiroto Shimokawa , Yoshitaka Mineki , Masami Sasaki
IPC分类号： B32B37/00 , B32B37/10 , B32B37/06
CPC分类号： H05K3/022 , B32B15/08 , B32B15/20 , B32B27/34 , B32B37/1027 , B32B2307/406 , B32B2307/408 , B32B2311/00 , B32B2379/08 , H05K1/0393 , H05K2201/0355 , H05K2203/068 , H05K2203/1545 , Y10T156/10
摘要： A method for producing a flexible metal laminate includes continuously thermocompression-bonding laminate metal foils to a resin film. The thermocompression-bonding step is conducted by placing a protection metal foil between a pressure surface of a heat and pressure forming apparatus and the laminate metal foils. When the protection metal foil is subjected to an abrasion resistance test, in which the protection metal foil is placed such that a matte surface of the protection metal foil contacts a plate material having a surface equivalent to the pressure surface and in which the matte surface is rubbed against the surface of the plate material by applying a load to a shiny surface of the protection metal foil and pulling the protection metal foil, a streak is found on the matte surface only in a case where the load is over 500 g per area of 76 mm×26 mm.
摘要翻译：柔性金属层叠体的制造方法包括将层压金属箔连续热压接在树脂膜上。通过将保护金属箔放置在热压成形装置的压力表面和层压金属箔之间来进行热压接步骤。当保护金属箔经受耐磨性试验时，其中保护金属箔被放置成使得保护金属箔的无光泽表面与具有与压力表面相当的表面的板材接触，并且其中无光泽表面是通过向保护金属箔的光泽表面施加负载并拉动保护金属箔而摩擦板材表面，仅在每个面积的负载超过500g的情况下，在无光泽表面上发现条纹 76毫米×26毫米。

9. 发明申请

US20110005812A1 METAL FOIL LAMINATED POLYIMIDE RESIN SUBSTRATE 有权
标题翻译：金属箔层压聚酰胺树脂基材
公开(公告)号：US20110005812A1
公开(公告)日：2011-01-13
申请号：US12739640
申请日：2008-10-24
申请人： Hiroto Shimokawa , Atsushi Okabe
发明人： Hiroto Shimokawa , Atsushi Okabe
IPC分类号： H05K1/03 , B32B27/06 , B32B15/08 , B32B37/06 , B32B37/10
CPC分类号： H05K3/384 , B32B5/147 , B32B15/08 , B32B15/20 , B32B27/08 , B32B27/20 , B32B27/281 , B32B2255/06 , B32B2255/10 , B32B2255/24 , B32B2307/206 , B32B2307/306 , B32B2307/3065 , B32B2307/308 , B32B2307/50 , B32B2307/538 , B32B2307/54 , B32B2307/714 , B32B2457/08 , H05K1/0346 , H05K3/389 , H05K2201/0154 , H05K2201/0355 , H05K2203/0723 , Y10T428/27
摘要： The present invention relates to a metal foil laminated polyimide resin substrate wherein a metal foil is directly laminated on one side or both sides of a polyimide resin substrate; and the surface of the metal foil to be bonded to the polyimide resin substrate has a surface roughness (Rzjis) of 3.0 μm or less; a surface area ratio (B) of 1.25 to 2.50, in which the surface area ratio (B) is calculated as a ratio [A/6550] of a surface area of a two-dimensional region with a surface area of 6550 μm2 which is determined by a laser method (three-dimensional area: A μm2) to the area of the two-dimensional region; and a chromium content per unit area of the two-dimensional region of 2.0 mg/m2 or more.
摘要翻译：金属箔叠层聚酰亚胺树脂基板技术领域本发明涉及金属箔叠层聚酰亚胺树脂基板，其中金属箔直接层压在聚酰亚胺树脂基板的一面或两面上; 并且与聚酰亚胺树脂基板接合的金属箔的表面的表面粗糙度（Rzjis）为3.0μm以下，表面积比（B）为1.25〜2.50，其中表面积比（B）以表面积为6550μm2的二维区域的表面积的比[A / 6550]计算，其为通过激光法（三维面积：Aμm2）与二维区域的面积确定; 并且二维区域的每单位面积的铬含量为2.0mg / m 2以上。

10. 发明申请

US20090266589A1 PROCESS FOR PRODUCING METAL WIRING BOARD 审中-公开
标题翻译：生产金属接线板的工艺
公开(公告)号：US20090266589A1
公开(公告)日：2009-10-29
申请号：US12090245
申请日：2006-10-13
申请人： Hiroto Shimokawa , Nobu Iizumi , keita Bamba , Tadahiro Yokozawa
发明人： Hiroto Shimokawa , Nobu Iizumi , keita Bamba , Tadahiro Yokozawa
IPC分类号： H05K1/09 , H05K3/06
CPC分类号： H05K3/388 , H05K1/036 , H05K3/067 , H05K3/108 , H05K3/26 , H05K3/386 , H05K3/389 , H05K2201/0154 , H05K2201/0761
摘要： Is disclosed a process for producing a metal wiring substrate comprising a heat resistant resin substrate and a metal wiring which is laminated on the substrate and in which a surface laminated with the substrate is surface-treated with at least one metal selected from Ni, Cr, Co, Zn, Sn and Mo or an alloy comprising at least one of these metals (hereafter, the metal used for the surface-treatment is referred to as a surface-treatment metal). This process comprises the steps of forming the metal wiring on the resin substrate, and washing at least a surface of the resin substrate with an etching solution capable of removing the surface-treatment metal to increase adhesion of the surface of the resin substrate. The produced metal wiring substrate has excellent adhesion with adhesives for affixing anisotropic conductive films and IC chips to films.
摘要翻译：公开了一种制造金属布线基板的方法，该金属布线基板包括耐热树脂基板和金属布线，该金属布线基板和金属布线层叠在基板上，其中与基板层压的表面用至少一种选自Ni，Cr， Co，Zn，Sn和Mo或包含这些金属中的至少一种的合金（以下将用于表面处理的金属称为表面处理金属）。该方法包括以下步骤：在树脂基板上形成金属布线，并用能够除去表面处理金属的蚀刻溶液至少洗涤树脂基板的表面以提高树脂基板的表面的粘合力。所生产的金属布线基板具有优异的粘合性，用于将各向异性导电膜和IC芯片固定到膜上。

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