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    • 4. 发明申请
    • NON-VOLATILE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME
    • 非易失性存储器件及其制造方法
    • US20130234234A1
    • 2013-09-12
    • US13607050
    • 2012-09-07
    • Hyun-Seung YOO
    • Hyun-Seung YOO
    • H01L29/78H01L21/336
    • H01L29/66833H01L27/11582H01L29/7926
    • A method for fabricating a non-volatile memory device includes forming a stacked structure where a plurality of inter-layer dielectric layers and a plurality of second sacrificial layers are alternately stacked over a substrate, forming a channel layer that is coupled with a portion of the substrate by penetrating through the stacked structure, forming a slit that penetrates through the second sacrificial layers by selectively etching the stacked structure, removing the second sacrificial layers that are exposed through the slit, forming an epitaxial layer over the channel layer exposed as a result of the removal of the second sacrificial layers, and forming a gate electrode layer filling a space from which the second sacrificial layers are removed, and a memory layer interposed between the gate electrode layer and the epitaxial layer.
    • 一种用于制造非易失性存储器件的方法包括形成层叠结构,其中多个层间电介质层和多个第二牺牲层交替堆叠在衬底上,形成沟道层,该沟道层与 通过穿过层叠结构形成穿过第二牺牲层的狭缝,通过选择性地蚀刻层叠结构,去除通过狭缝暴露的第二牺牲层,在通过暴露的通道层上形成外延层,作为由 去除第二牺牲层,以及形成填充去除第二牺牲层的空间的栅电极层,以及插入在栅电极层和外延层之间的存储层。