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1. 发明授权

US10540474B2 Chip temperature computation method and chip temperature computation device 有权
公开(公告)号：US10540474B2
公开(公告)日：2020-01-21
申请号：US15922910
申请日：2018-03-15
申请人： Industrial Technology Research Institute
发明人： Heng-Chieh Chien , Sheng-Tsai Wu , Ming-Ji Dai , Chih-Ming Shen
IPC分类号： G06F17/50
摘要： A chip temperature computation method and a chip temperature computation device are provided. The chip temperature computation method includes: computing an upper layer thermal resistance and a lower layer thermal resistance of a chip, computing a total thermal resistance of the chip, and computing a temperature of the chip according to the total thermal resistance.

2. 发明申请

US20180040798A1 STRUCTURE OF THERMOELECTRIC MODULE AND FABRICATING METHOD THEREOF 审中-公开
公开(公告)号：US20180040798A1
公开(公告)日：2018-02-08
申请号：US15721743
申请日：2017-09-30
申请人： Industrial Technology Research Institute
发明人： Li-Ling Liao , Ming-Ji Dai , Chun-Kai Liu , Cheng-Heng Kao , Cheng-Chieh Li , Jeffrey Snyder , Fivos Drymiotis
IPC分类号： H01L35/32 , H01L35/34
CPC分类号： H01L35/32 , H01L35/08 , H01L35/34
摘要： A structure of a thermoelectric module including at least one substrate, a thermoelectric device and an insulation protection structure is provided. The thermoelectric device is disposed on the substrate. The insulation protection structure surrounds the thermoelectric device. The thermoelectric device includes at least three electrode plates, first type and second type thermoelectric materials and a diffusion barrier structure. First and second electrode plates among the three electrode plates are disposed on the substrate. The first type thermoelectric material is disposed on the first electrode plate. The second type thermoelectric material is disposed on the second electrode plate. A third electrode plate among the three electrode plates is disposed on the first type and second type thermoelectric materials. The diffusion barrier structure is disposed on two terminals of each of the first type and second type thermoelectric materials. A fabrication method of the foregoing thermoelectric module is also provided.

3. 发明申请

US20140291790A1 ENCAPSULATION OF BACKSIDE ILLUMINATION PHOTOSENSITIVE DEVICE 有权
标题翻译：背光照明感光装置的封装
公开(公告)号：US20140291790A1
公开(公告)日：2014-10-02
申请号：US13943810
申请日：2013-07-17
申请人： Industrial Technology Research Institute
发明人： Zhi-Cheng Hsiao , Ming-Ji Dai , Cheng-Ta Ko
IPC分类号： H01L31/024 , H01L27/146
CPC分类号： H01L31/024 , H01L27/14621 , H01L27/14627 , H01L27/14634 , H01L27/14636 , H01L27/1464 , H01L27/1469
摘要： An encapsulation of backside illumination photosensitive device including a circuit sub-mount, a backside illumination photosensitive device, a plurality of conductive terminals, and a heat dissipation structure is provided. The backside illumination photosensitive device includes an interconnection layer and a photosensitive device array, wherein the interconnection layer is located on the circuit sub-mount, and between the photosensitive device array and the circuit sub-mount. The conductive terminals are located between the interconnection layer and the circuit sub-mount to electrically connect the interconnection layer and the circuit sub-mount. The heat dissipation structure is located under the interconnection layer, and the heat dissipation structure and the photosensitive device array are respectively located at two opposite sides of the interconnection layer.
摘要翻译：提供了包括电路子安装座，背面照明光敏装置，多个导电端子和散热结构的背面照明光敏装置的封装。背面照明光敏装置包括互连层和感光器件阵列，其中互连层位于电路子座上，并且位于感光器件阵列和电路子座之间。导电端子位于互连层和电路子座之间，以电连接互连层和电路子座。散热结构位于互连层下方，散热结构和感光器件阵列分别位于互连层的两个相对侧。

4. 发明申请

US20190213725A1 BOARD DEFECT FILTERING METHOD AND DEVICE THEREOF AND COMPUTER-READABLE RECORDING MEDIUM 审中-公开
公开(公告)号：US20190213725A1
公开(公告)日：2019-07-11
申请号：US16134986
申请日：2018-09-19
申请人： Industrial Technology Research Institute
发明人： Ming-Kaan Liang , An-Chun Luo , Yu-Shan Deng , Chih-Ming Shen , Ming-Ji Dai
IPC分类号： G06T7/00 , G06N3/08 , G06K9/62
CPC分类号： G06T7/001 , G06K9/6267 , G06N3/08 , G06T2207/20132 , G06T2207/30141
摘要： A board defect filtering method is provided. The method includes: receiving a defect list; obtaining a plurality of defect images of a plurality of defect records on the defect list; receiving a circuit layout image; analyzing a defect location of a first defect image of the plurality of defect images according to the circuit layout image; cropping the first defect image to obtain a first cropped defect image according to the defect location; inputting the first cropping defect image to a defect classifying model; and determining whether the first defect image is a qualified product image or not according to an output result of the defect classifying model.

5. 发明申请

US20190188357A1 CHIP TEMPERATURE COMPUTATION METHOD AND CHIP TEMPERATURE COMPUTATION DEVICE 审中-公开
公开(公告)号：US20190188357A1
公开(公告)日：2019-06-20
申请号：US15922910
申请日：2018-03-15
申请人： Industrial Technology Research Institute
发明人： Heng-Chieh Chien , Sheng-Tsai Wu , Ming-Ji Dai , Chih-Ming Shen
IPC分类号： G06F17/50
摘要： A chip temperature computation method and a chip temperature computation device are provided. The chip temperature computation method includes: computing an upper layer thermal resistance and a lower layer thermal resistance of a chip, computing a total thermal resistance of the chip, and computing a temperature of the chip according to the total thermal resistance.

6. 发明申请

US20130276464A1 MEASUREMENT METHOD, MEASUREMENT APPARATUS, AND COMPUTER PROGRAM PRODUCT 有权
标题翻译：测量方法，测量装置和计算机程序产品
公开(公告)号：US20130276464A1
公开(公告)日：2013-10-24
申请号：US13854139
申请日：2013-04-01
申请人： Industrial Technology Research Institute
发明人： Heng-Chieh Chien , Ming-Ji Dai , Sheng-Tsai Wu , Huey-Lin Hsieh , Jing-Yi Huang
IPC分类号： G01K7/00 , F25B21/04
CPC分类号： G01K7/00 , F25B21/04 , G01K3/08 , H01L35/30 , H01L35/32
摘要： A measurement method, a measurement apparatus, and a computer program product for measuring a thermoelectric module are provided. A temperature is provided to the thermoelectric module. A current is applied to the thermoelectric module to turn both sides of the thermoelectric module into a hot side and a cold side. The temperature of the hot side is higher than that of the cold side. A terminal voltage of the thermoelectric module, a hot side temperature of the hot side, and a cold side temperature of the cold side are measured at different time points. A thermoelectric relationship between the terminal voltages and differences between the hot side temperatures and the corresponding cold side temperatures is obtained according to the terminal voltages, the hot side temperatures, and the cold side temperatures. At least one first parameter of the thermoelectric module is estimated according to the thermoelectric relationship.
摘要翻译：提供了一种用于测量热电模块的测量方法，测量装置和计算机程序产品。向热电模块提供温度。向热电模块施加电流以将热电模块的两侧转变成热侧和冷侧。热侧的温度高于冷侧的温度。在不同的时间点测量热电模块的端电压，热侧的热侧温度和冷侧的冷侧温度。根据端子电压，热侧温度和冷侧温度，获得端子电压与热侧温度与相应的冷侧温度之间的差异的热电关系。根据热电关系估计热电模块的至少一个第一参数。

7. 发明申请

US20130234325A1 FILLED THROUGH-SILICON VIA AND THE FABRICATION METHOD THEREOF 审中-公开
标题翻译：通过硅填充硅及其制造方法
公开(公告)号：US20130234325A1
公开(公告)日：2013-09-12
申请号：US13873249
申请日：2013-04-30
申请人： INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
发明人： Ming-Ji Dai , Ra-Min Tain , Chun-Hsien Chien , Heng-Chieh Chien , Sheng-Tsai Wu
IPC分类号： H01L23/498
CPC分类号： H01L23/49811 , H01L21/486 , H01L21/76898 , H01L23/147 , H01L23/36 , H01L23/481 , H01L23/49827 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/73 , H01L25/0652 , H01L25/0657 , H01L25/18 , H01L2224/0401 , H01L2224/0557 , H01L2224/06181 , H01L2224/11009 , H01L2224/13082 , H01L2224/13147 , H01L2224/13155 , H01L2224/14181 , H01L2224/16225 , H01L2224/73253 , H01L2224/94 , H01L2225/06517 , H01L2225/06541 , H01L2225/06548 , H01L2225/06572 , H01L2924/00014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/1421 , H01L2924/1434 , H01L2924/15311 , H01L2924/157 , H01L2924/15787 , H01L2924/15788 , H01L2924/3511 , H01L2924/01046 , H01L2924/01079 , H01L2224/03 , H01L2224/11 , H01L2224/05552 , H01L2924/00
摘要： By adding particles of high thermal conductivity and low thermal expansion coefficient into the copper as a composite material and filling with the composite material into the through-via hole, the mismatch of the coefficient of thermal expansion and the stress of the through-silicon via are lowered and the thermal conductivity of the through-silicon via is increased.
摘要翻译：通过将高导热性和低热膨胀系数的颗粒作为复合材料添加到铜中，并将复合材料填充到通孔中，热膨胀系数与贯穿硅通孔的应力的失配是降低了通硅通孔的导热性。

8. 发明申请

US20220114419A1 CLASSIFICATION DEVICE AND CLASSIFICATION METHOD BASED ON NEURAL NETWORK 有权
公开(公告)号：US20220114419A1
公开(公告)日：2022-04-14
申请号：US17121763
申请日：2020-12-15
申请人： Industrial Technology Research Institute
发明人： Yu-Shan Deng , An-Chun Luo , Po-Han Chang , Chun-Ju Lin , Ming-Ji Dai
IPC分类号： G06N3/04
摘要： A classification device and a classification method based on a neural network are provided. A heterogeneous integration module includes a convolutional layer, a data normalization layer, a connected layer and a classification layer. The convolutional layer generates a first feature map according to a first image data. The data normalization layer normalizes a first numerical data to generate a first normalized numerical data. The first numerical data corresponds to the first image data. The connected layer generates a first feature vector according to the first feature map and the first normalized numerical data. The classification layer generates a first classification result corresponding to a first time point according to the first feature vector. The heterogeneous integration module generates a second classification result corresponding to a second time point. A recurrent neural network generates a third classification result according to the first classification result and the second classification result.

9. 发明申请

US20180022563A1 ROLLER WITH PRESSURE SENSOR AND R TO R DEVICE 审中-公开
公开(公告)号：US20180022563A1
公开(公告)日：2018-01-25
申请号：US15220958
申请日：2016-07-27
申请人： Industrial Technology Research Institute
发明人： Ming-Kaan Liang , Ming-Ji Dai , Chin-Hung Wang , Chih-Ming Shen
IPC分类号： B65H23/188 , B65H23/04
CPC分类号： B65H23/1888 , B65H23/044 , B65H23/192 , B65H27/00 , B65H2408/2171 , B65H2515/30 , B65H2515/31 , B65H2515/312 , B65H2553/26 , B65H2220/01 , B65H2220/02
摘要： Provided is a roller with pressure sensor. The roller includes a pressure sensor mounted to the roller. The pressure sensor includes a plurality of pressure sensing units distributed on a thin film. The pressure sensing units are electrically connected to each other with a metal wire but not in contact with each other. Also provided is a roll-to-roll device, which includes a roller mechanism and a pressure sensor.

10. 发明授权

US09448121B2 Measurement method, measurement apparatus, and computer program product 有权
标题翻译：测量方法，测量仪器和计算机程序产品
公开(公告)号：US09448121B2
公开(公告)日：2016-09-20
申请号：US13854139
申请日：2013-04-01
申请人： Industrial Technology Research Institute
发明人： Heng-Chieh Chien , Ming-Ji Dai , Sheng-Tsai Wu , Huey-Lin Hsieh , Jing-Yi Huang
IPC分类号： G01K1/00 , G01K7/00 , F25B21/04 , G01K3/08 , H01L35/30 , H01L35/32
CPC分类号： G01K7/00 , F25B21/04 , G01K3/08 , H01L35/30 , H01L35/32
摘要： A measurement method, a measurement apparatus, and a computer program product for measuring a thermoelectric module are provided. A temperature is provided to the thermoelectric module. A current is applied to the thermoelectric module to turn both sides of the thermoelectric module into a hot side and a cold side. The temperature of the hot side is higher than that of the cold side. A terminal voltage of the thermoelectric module, a hot side temperature of the hot side, and a cold side temperature of the cold side are measured at different time points. A thermoelectric relationship between the terminal voltages and differences between the hot side temperatures and the corresponding cold side temperatures is obtained according to the terminal voltages, the hot side temperatures, and the cold side temperatures. At least one first parameter of the thermoelectric module is estimated according to the thermoelectric relationship.
摘要翻译：提供了一种用于测量热电模块的测量方法，测量装置和计算机程序产品。向热电模块提供温度。向热电模块施加电流以将热电模块的两侧转变成热侧和冷侧。热侧的温度高于冷侧的温度。在不同的时间点测量热电模块的端电压，热侧的热侧温度和冷侧的冷侧温度。根据端子电压，热侧温度和冷侧温度，获得端子电压与热侧温度与相应的冷侧温度之间的差异的热电关系。根据热电关系估计热电模块的至少一个第一参数。

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