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1. 发明申请

US20100327654A1 Power Module and Vehicle-Mounted Inverter Using the Same 有权
标题翻译：功率模块和使用其的车载变频器
公开(公告)号：US20100327654A1
公开(公告)日：2010-12-30
申请号：US12826409
申请日：2010-06-29
申请人： Katsunori AZUMA , Mutsuhiro Mori , Michiaki Hiyoshi , Seiichi Hayakawa , Koji Sasaki , Isamu Yoshida
发明人： Katsunori AZUMA , Mutsuhiro Mori , Michiaki Hiyoshi , Seiichi Hayakawa , Koji Sasaki , Isamu Yoshida
IPC分类号： B60L1/00
CPC分类号： B60L11/04 , B60L2200/26 , H01L24/28 , H01L24/29 , H01L24/48 , H01L25/072 , H01L25/16 , H01L2224/48091 , H01L2224/4847 , H01L2924/00014 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/19041 , H01L2924/30107 , H01L2924/3025 , H02M7/003 , H03K17/08148 , H03K2017/0806 , H05K7/1432 , Y02T10/70 , Y02T10/7077 , Y10T307/74 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A power module includes an upper arm circuit unit and a lower arm circuit unit each having a power semiconductor element; an insulating substrate with the units mounted on one surface thereof; a metal base bonded onto the other surface of the substrate opposite to the one surface where the units are mounted; a first connection conductor for supplying a high potential to the upper unit from outside; a second connection conductor for supplying a low potential to the lower unit from outside; an insulating sheet interposed between the conductors; and a resin case disposed on the metal base to support the conductors, the conductors are flat conductors and laminated with the sheet sandwiched therebetween; the sheet extends from one end of the laminated structure to secure the creepage distance between the conductors; and the case is furnished with a recess for containing the laminated structure.
摘要翻译：功率模块包括上臂电路单元和下臂电路单元，每个具有功率半导体元件; 绝缘基板，其单元安装在其一个表面上; 金属底座粘合到与安装单元的一个表面相对的基板的另一个表面上; 用于从外部向上部单元提供高电位的第一连接导体; 用于从外部向下部单元提供低电位的第二连接导体; 插入在导体之间的绝缘片; 以及设置在金属基座上以支撑导体的树脂壳体，导体是扁平导体，并且夹在其间的片材层压; 片材从层压结构的一端延伸，以确保导体之间的爬电距离; 并且壳体设置有用于容纳层压结构的凹部。

2. 发明授权

US08519561B2 Power module and vehicle-mounted inverter using the same 有权
标题翻译：电源模块和车载逆变器使用相同
公开(公告)号：US08519561B2
公开(公告)日：2013-08-27
申请号：US12826409
申请日：2010-06-29
申请人： Katsunori Azuma , Mutsuhiro Mori , Michiaki Hiyoshi , Seiichi Hayakawa , Koji Sasaki , Isamu Yoshida
发明人： Katsunori Azuma , Mutsuhiro Mori , Michiaki Hiyoshi , Seiichi Hayakawa , Koji Sasaki , Isamu Yoshida
IPC分类号： B60R16/03
CPC分类号： B60L11/04 , B60L2200/26 , H01L24/28 , H01L24/29 , H01L24/48 , H01L25/072 , H01L25/16 , H01L2224/48091 , H01L2224/4847 , H01L2924/00014 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/19041 , H01L2924/30107 , H01L2924/3025 , H02M7/003 , H03K17/08148 , H03K2017/0806 , H05K7/1432 , Y02T10/70 , Y02T10/7077 , Y10T307/74 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A power module includes an upper arm circuit unit and a lower arm circuit unit each having a power semiconductor element; an insulating substrate with the units mounted on one surface thereof; a metal base bonded onto the other surface of the substrate opposite to the one surface where the units are mounted; a first connection conductor for supplying a high potential to the upper unit from outside; a second connection conductor for supplying a low potential to the lower unit from outside; an insulating sheet interposed between the conductors; and a resin case disposed on the metal base to support the conductors, the conductors are flat conductors and laminated with the sheet sandwiched therebetween; the sheet extends from one end of the laminated structure to secure the creepage distance between the conductors; and the case is furnished with a recess for containing the laminated structure.
摘要翻译：功率模块包括上臂电路单元和下臂电路单元，每个具有功率半导体元件; 绝缘基板，其单元安装在其一个表面上; 金属底座粘合到与安装单元的一个表面相对的基板的另一个表面上; 用于从外部向上部单元提供高电位的第一连接导体; 用于从外部向下部单元提供低电位的第二连接导体; 插入在导体之间的绝缘片; 以及设置在金属基座上以支撑导体的树脂壳体，导体是扁平导体，并且夹在其间的片材层压; 片材从层压结构的一端延伸，以确保导体之间的爬电距离; 并且壳体设置有用于容纳层压结构的凹部。

3. 发明授权

US08723320B2 Power module and manufacturing method thereof 有权
标题翻译：电源模块及其制造方法
公开(公告)号：US08723320B2
公开(公告)日：2014-05-13
申请号：US13537116
申请日：2012-06-29
申请人： Isamu Yoshida , Michiaki Hiyoshi , Takehide Yokozuka , Akihiro Muramoto
发明人： Isamu Yoshida , Michiaki Hiyoshi , Takehide Yokozuka , Akihiro Muramoto
IPC分类号： H01L23/48
CPC分类号： H01L23/49811 , H01L23/3735 , H01L25/072 , H01L2924/0002 , H01L2924/01327 , H01L2924/00
摘要： A power module includes a substrate having a surface on which a plurality of wiring patterns are formed, a semiconductor device mounted on the substrate and electrically connected to a part of the plurality of wiring patterns, and a terminal portion with a lead electrically connected to the other part of the plurality of wiring patterns, and is configured that the lead of the terminal portion is formed by laminating a plurality of metal members which contain a material substantially the same as or softer than the material for forming the other part of wiring patterns, and the material of the plurality of metal members, which is the same as or softer than the material for forming the other part of wiring patterns is electrically connected to the other part of wiring patterns through ultrasonic bonding.
摘要翻译：电源模块包括具有其上形成有多个布线图案的表面的基板，安装在基板上并与多个布线图形的一部分电连接的半导体器件，以及端子部分，其引线电连接到多个布线图案的其他部分，并且被构造成通过层叠多个金属构件来形成端子部分的引线，所述多个金属构件包含与用于形成布线图案的其他部分的材料基本相同或者更软的材料，并且与用于形成布线图形的另一部分的材料相同或更软的多个金属构件的材料通过超声波接合电连接到布线图案的另一部分。

4. 发明申请

US20080061431A1 POWER SEMICONDUCTOR MODULE 有权
标题翻译：功率半导体模块
公开(公告)号：US20080061431A1
公开(公告)日：2008-03-13
申请号：US11834724
申请日：2007-08-07
申请人： Shinichi Fujiwara , Masahide Harada , Hideto Yoshinari , Shosaku Ishihara , Shiro Yamashita , Isamu Yoshida , Ukyo Ikeda
发明人： Shinichi Fujiwara , Masahide Harada , Hideto Yoshinari , Shosaku Ishihara , Shiro Yamashita , Isamu Yoshida , Ukyo Ikeda
IPC分类号： H01L23/34
CPC分类号： H01L23/3735 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/83 , H01L24/84 , H01L24/92 , H01L2224/26165 , H01L2224/26175 , H01L2224/291 , H01L2224/29111 , H01L2224/33181 , H01L2224/371 , H01L2224/37147 , H01L2224/3754 , H01L2224/40095 , H01L2224/40225 , H01L2224/40499 , H01L2224/73263 , H01L2224/83136 , H01L2224/83139 , H01L2224/8314 , H01L2224/83385 , H01L2224/83801 , H01L2224/83815 , H01L2224/84801 , H01L2224/84815 , H01L2224/9221 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/1305 , H01L2924/13055 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/014 , H01L2224/83 , H01L2224/84
摘要： A semiconductor module of the present invention comprises a first conductive layer (film) and a second conductive layer (film) which are separately formed on the main surface of a packed substrate, a thermal diffusion plate connected by solder to the upper surface of the first conductive layer, a semiconductor element connected by solder to the upper surface of the thermal diffusion plate, and a lead having one end connected by solder to the second conductive layer and the other end connected by solder to the semiconductor element, wherein the outer periphery of the connected region where the semiconductor element is connected by solder to the upper surface of the thermal diffusion plate is formed with protrusion parts protruding up from the connecting region and a turning of the semiconductor element in the upper surface of the thermal diffusion plate in the solder connecting process is suppressed by the protrusion parts.
摘要翻译：本发明的半导体模块包括在填充基板的主表面上分别形成的第一导电层（膜）和第二导电层（膜），通过焊料与第一导电层（膜）的上表面连接的热扩散板导电层，通过焊料连接到热扩散板的上表面的半导体元件，以及引线，其一端通过焊料连接到第二导电层，另一端通过焊料连接到半导体元件，其中外周边半导体元件通过焊料连接到热扩散板的上表面的连接区域形成有从连接区域突出的突出部分和在焊料中的热扩散板的上表面中的半导体元件的转动连接过程被突出部分抑制。

5. 发明授权

US06861294B2 Semiconductor devices and methods of making the devices 失效
标题翻译：半导体器件和制造器件的方法
公开(公告)号：US06861294B2
公开(公告)日：2005-03-01
申请号：US10673459
申请日：2003-09-30
申请人： Shigeharu Tsunoda , Junichi Saeki , Isamu Yoshida , Kazuya Ooji , Michiharu Honda , Makoto Kitano , Nae Yoneda , Shuji Eguchi , Kunihiko Nishi , Ichiro Anjoh , Kenichi Otsuka
发明人： Shigeharu Tsunoda , Junichi Saeki , Isamu Yoshida , Kazuya Ooji , Michiharu Honda , Makoto Kitano , Nae Yoneda , Shuji Eguchi , Kunihiko Nishi , Ichiro Anjoh , Kenichi Otsuka
IPC分类号： H01L21/56 , H01L23/31 , H01L21/44
CPC分类号： H01L24/97 , H01L21/565 , H01L23/3107 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/05554 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/12044 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/83 , H01L2224/85 , H01L2224/05599 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.
摘要翻译：一种半导体塑料封装，更具体地，优选的封装结构和用于制造BGA封装的方法。树脂密封BGA封装，其中固定支撑半导体部件的支撑框架; 即IC芯片，电路板或电路膜用树脂密封，使用由上半模和下半模组成的模具，下半模具有多个突起，一个在对应于每个外部端子的位置。模具具有在其分割元件之间具有通风口的分隔结构。

6. 发明授权

US06662921B2 Wheel steering apparatus 有权
标题翻译：车轮转向装置
公开(公告)号：US06662921B2
公开(公告)日：2003-12-16
申请号：US10187366
申请日：2002-07-02
申请人： Isamu Yoshida , Keisuke Kazuno , Koji Sato
发明人： Isamu Yoshida , Keisuke Kazuno , Koji Sato
IPC分类号： B62D300
CPC分类号： F16D41/067 , F16H25/20 , F16H25/2204 , Y10T74/18576 , Y10T74/18696
摘要： To provide a wheel steering apparatus capable of exhibiting a stabilized vehicle steerability without transmitting an external disturbance torque to a motor rotor even when the wheel receives an axially acting external force, this wheel steering apparatus includes a reciprocatingly movable rod 3 drivingly connected with a support member 2 for steerably supporting a wheel 1, and a ball screw mechanism 5 for reciprocatingly moving the rod 3 in response to rotation of a drive motor 4. In a rotational transmission system for transmitting rotation of the drive motor 4 to a nut member 5b of the ball screw mechanism 5, a clutch assembly 6 defining a reverse input limiting means is provided for preventing a rotar of the drive motor 4 from being rotated by the external force acting on the wheel 1. This clutch assembly 6 used is of a design wherein although rotation can be transmitted from an input shaft to an output shaft, no rotation is transmitted from the output shaft to the input shaft.
摘要翻译：为了提供即使在车轮受到轴向作用的外力的情况下也能够显示稳定的车辆操纵性而不向外部扰动转矩传递的车轮转向装置，该车轮转向装置包括与支撑部件驱动连接的往复运动杆3 2，用于可转动地支撑车轮1;以及滚珠丝杠机构5，用于响应于驱动马达4的旋转使杆3往复运动。在用于将驱动马达4的旋转传递到螺母构件5b的旋转传动系统中滚珠丝杠机构5，限定反向输入限制装置的离合器组件6被设置成用于防止驱动马达4的转子由于作用在车轮1上的外力而旋转。所使用的离合器组件6具有如下设计：旋转可以从输入轴传递到输出轴，不会从输出轴向输入轴转动。

7. 发明授权

US06178839B2 Ball screw with lubricating grease and seal member of solid lubricating composition 有权
标题翻译：滚珠丝杠带润滑脂和固体润滑组合物的密封件
公开(公告)号：US06178839B2
公开(公告)日：2001-01-30
申请号：US09203499
申请日：1998-12-01
申请人： Isamu Yoshida , Masahiro Nobutomo , Takayuki Owada
发明人： Isamu Yoshida , Masahiro Nobutomo , Takayuki Owada
IPC分类号： F16H2524
CPC分类号： F16H25/2418 , F16H25/2204 , F16H57/0497 , Y10T74/19772
摘要： A plurality of balls 3 are disposed for rolling and circulation in a spiral calculation passage defined between a spiral screw groove surface 1a formed on the outer periphery of a screw shaft 1 and a spiral screw groove surface 2a formed on the inner periphery of a ball nut 2. The opposite ends of the ball nut are each formed with a seal mounting portion 2b, in which a seal member 4 made of solid lubricating composition is mounted, sealing off the ball nut 2. The ball nut 2 has lubricating grease G sealed therein.
摘要翻译：多个滚珠3设置成在形成在螺杆轴1的外周上的螺旋形螺旋槽表面1a和形成在滚珠螺母的内周上的螺旋形螺纹槽表面2a之间的螺旋计算通道中滚动和循环滚珠螺母的两端各自形成有密封安装部分2b，其中安装了由固体润滑剂组合物制成的密封构件4，密封球螺母2.滚珠螺母2上密封有润滑脂G 。

8. 发明授权

US6124629A Semiconductor device including a resin sealing member which exposes the rear surface of the sealed semiconductor chip 失效
标题翻译：半导体装置包括使密封的半导体芯片的后表面露出的树脂密封构件
公开(公告)号：US6124629A
公开(公告)日：2000-09-26
申请号：US168097
申请日：1998-10-08
申请人： Gen Murakami , Kunihiro Tsubosaki , Masahiro Ichitani , Kunihiko Nishi , Ichiro Anjo , Asao Nishimura , Makoto Kitano , Akihiro Yaguchi , Sueo Kawai , Masatsugu Ogata , Syuuji Eguchi , Hiroyoshi Kokaku , Masanori Segawa , Hiroshi Hozoji , Takashi Yokoyama , Noriyuki Kinjo , Aizo Kaneda , Junichi Saeki , Shozo Nakamura , Akio Hasebe , Hiroshi Kikuchi , Isamu Yoshida , Takashi Yamazaki , Kazuyoshi Oshima , Tetsuro Matsumoto
发明人： Gen Murakami , Kunihiro Tsubosaki , Masahiro Ichitani , Kunihiko Nishi , Ichiro Anjo , Asao Nishimura , Makoto Kitano , Akihiro Yaguchi , Sueo Kawai , Masatsugu Ogata , Syuuji Eguchi , Hiroyoshi Kokaku , Masanori Segawa , Hiroshi Hozoji , Takashi Yokoyama , Noriyuki Kinjo , Aizo Kaneda , Junichi Saeki , Shozo Nakamura , Akio Hasebe , Hiroshi Kikuchi , Isamu Yoshida , Takashi Yamazaki , Kazuyoshi Oshima , Tetsuro Matsumoto
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50 , H01L23/31 , H01L23/495 , H01L25/10 , H01L29/06 , H05K1/14 , H05K1/18 , H05K3/34
CPC分类号： H01L24/32 , H01L23/3107 , H01L23/4951 , H01L23/49555 , H01L23/49558 , H01L23/49568 , H01L23/49586 , H01L24/05 , H01L24/06 , H01L25/105 , H01L29/0657 , H01L2224/02166 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/05624 , H01L2224/06136 , H01L2224/16 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/4569 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/48624 , H01L2224/48724 , H01L2224/48799 , H01L2224/73215 , H01L2224/85205 , H01L2224/8592 , H01L2225/1005 , H01L2225/1029 , H01L2225/107 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01043 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01058 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01092 , H01L2924/0132 , H01L2924/014 , H01L2924/10253 , H01L2924/13091 , H01L2924/14 , H01L2924/15738 , H01L2924/15747 , H01L2924/1576 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/3511 , H05K1/144 , H05K1/181 , H05K3/3421 , Y10T29/49121
摘要： As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.
摘要翻译：由于半导体芯片尺寸大，高集成度和加速度，所以难以将半导体芯片与包装中的引线组合在一起。鉴于这种困难，已经采用称为半导体和引线堆叠和封装的称为“片上引线”或“引线芯片”结构的封装结构。在该结构的封装中，根据本发明，内引线和半导体芯片的前端部之间的间隙比除引导端部和半导体芯片之外的内引线部分之间的间隙宽，从而减小杂散容量，提高信号传输速率和减少电气噪声。

9. 发明授权

US6100115A Semiconductor device 失效
公开(公告)号：US6100115A
公开(公告)日：2000-08-08
申请号：US166121
申请日：1998-10-05
申请人： Gen Murakami , Kunihiro Tsubosaki , Masahiro Ichitani , Kunihiko Nishi , Ichiro Anjo , Asao Nishimura , Makoto Kitano , Akihiro Yaguchi , Sueo Kawai , Masatsugu Ogata , Syuuji Eguchi , Hiroyoshi Kokaku , Masanori Segawa , Hiroshi Hozoji , Takashi Yokoyama , Noriyuki Kinjo , Aizo Kaneda , Junichi Saeki , Shozo Nakamura , Akio Hasebe , Hiroshi Kikuchi , Isamu Yoshida , Takashi Yamazaki , Kazuyoshi Oshima , Tetsuro Matsumoto
发明人： Gen Murakami , Kunihiro Tsubosaki , Masahiro Ichitani , Kunihiko Nishi , Ichiro Anjo , Asao Nishimura , Makoto Kitano , Akihiro Yaguchi , Sueo Kawai , Masatsugu Ogata , Syuuji Eguchi , Hiroyoshi Kokaku , Masanori Segawa , Hiroshi Hozoji , Takashi Yokoyama , Noriyuki Kinjo , Aizo Kaneda , Junichi Saeki , Shozo Nakamura , Akio Hasebe , Hiroshi Kikuchi , Isamu Yoshida , Takashi Yamazaki , Kazuyoshi Oshima , Tetsuro Matsumoto
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50 , H01L23/31 , H01L23/495 , H01L25/10 , H01L29/06 , H05K1/14 , H05K1/18 , H05K3/34
CPC分类号： H01L24/32 , H01L23/3107 , H01L23/4951 , H01L23/49555 , H01L23/49558 , H01L23/49568 , H01L23/49586 , H01L24/05 , H01L24/06 , H01L25/105 , H01L29/0657 , H01L2224/02166 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/05624 , H01L2224/06136 , H01L2224/16 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/4569 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/48624 , H01L2224/48724 , H01L2224/48799 , H01L2224/73215 , H01L2224/85205 , H01L2224/8592 , H01L2225/1005 , H01L2225/1029 , H01L2225/107 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01043 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01058 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01092 , H01L2924/0132 , H01L2924/014 , H01L2924/10253 , H01L2924/13091 , H01L2924/14 , H01L2924/15738 , H01L2924/15747 , H01L2924/1576 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/3511 , H05K1/144 , H05K1/181 , H05K3/3421 , Y10T29/49121
摘要： As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

10. 发明授权

US5914531A Semiconductor device having a ball grid array package structure using a supporting frame 失效
标题翻译：具有使用支撑框架的球栅阵列封装结构的半导体器件
公开(公告)号：US5914531A
公开(公告)日：1999-06-22
申请号：US805737
申请日：1997-02-25
申请人： Shigeharu Tsunoda , Junichi Saeki , Isamu Yoshida , Kazuya Ooji , Michiharu Honda , Makoto Kitano , Nae Yoneda , Shuji Eguchi , Kunihiko Nishi , Ichiro Anjoh , Kenichi Otsuka
发明人： Shigeharu Tsunoda , Junichi Saeki , Isamu Yoshida , Kazuya Ooji , Michiharu Honda , Makoto Kitano , Nae Yoneda , Shuji Eguchi , Kunihiko Nishi , Ichiro Anjoh , Kenichi Otsuka
IPC分类号： H01L21/50 , H01L21/56 , H01L21/58 , H01L21/60 , H01L23/04 , H01L23/31 , H01L23/495
CPC分类号： H01L21/565 , H01L23/3107 , H01L23/3128 , H01L2224/05554 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01079 , H01L2924/01087 , H01L2924/12044 , H01L2924/14 , H01L2924/15311 , H01L2924/181
摘要： A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.
摘要翻译：一种半导体塑料封装，更具体地，优选的封装结构和用于制造BGA封装的方法。树脂密封BGA封装，其中固定支撑半导体部件的支撑框架; 即IC芯片，电路板或电路膜用树脂密封，使用由上半模和下半模构成的模具，下半模具有多个突起，一个在对应于每个外部端子的位置。模具具有在其分割元件之间具有通风口的分隔结构。

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