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1. 发明申请

US20100327654A1 Power Module and Vehicle-Mounted Inverter Using the Same 有权
标题翻译：功率模块和使用其的车载变频器
公开(公告)号：US20100327654A1
公开(公告)日：2010-12-30
申请号：US12826409
申请日：2010-06-29
申请人： Katsunori AZUMA , Mutsuhiro Mori , Michiaki Hiyoshi , Seiichi Hayakawa , Koji Sasaki , Isamu Yoshida
发明人： Katsunori AZUMA , Mutsuhiro Mori , Michiaki Hiyoshi , Seiichi Hayakawa , Koji Sasaki , Isamu Yoshida
IPC分类号： B60L1/00
CPC分类号： B60L11/04 , B60L2200/26 , H01L24/28 , H01L24/29 , H01L24/48 , H01L25/072 , H01L25/16 , H01L2224/48091 , H01L2224/4847 , H01L2924/00014 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/19041 , H01L2924/30107 , H01L2924/3025 , H02M7/003 , H03K17/08148 , H03K2017/0806 , H05K7/1432 , Y02T10/70 , Y02T10/7077 , Y10T307/74 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A power module includes an upper arm circuit unit and a lower arm circuit unit each having a power semiconductor element; an insulating substrate with the units mounted on one surface thereof; a metal base bonded onto the other surface of the substrate opposite to the one surface where the units are mounted; a first connection conductor for supplying a high potential to the upper unit from outside; a second connection conductor for supplying a low potential to the lower unit from outside; an insulating sheet interposed between the conductors; and a resin case disposed on the metal base to support the conductors, the conductors are flat conductors and laminated with the sheet sandwiched therebetween; the sheet extends from one end of the laminated structure to secure the creepage distance between the conductors; and the case is furnished with a recess for containing the laminated structure.
摘要翻译：功率模块包括上臂电路单元和下臂电路单元，每个具有功率半导体元件; 绝缘基板，其单元安装在其一个表面上; 金属底座粘合到与安装单元的一个表面相对的基板的另一个表面上; 用于从外部向上部单元提供高电位的第一连接导体; 用于从外部向下部单元提供低电位的第二连接导体; 插入在导体之间的绝缘片; 以及设置在金属基座上以支撑导体的树脂壳体，导体是扁平导体，并且夹在其间的片材层压; 片材从层压结构的一端延伸，以确保导体之间的爬电距离; 并且壳体设置有用于容纳层压结构的凹部。

2. 发明授权

US08519561B2 Power module and vehicle-mounted inverter using the same 有权
标题翻译：电源模块和车载逆变器使用相同
公开(公告)号：US08519561B2
公开(公告)日：2013-08-27
申请号：US12826409
申请日：2010-06-29
申请人： Katsunori Azuma , Mutsuhiro Mori , Michiaki Hiyoshi , Seiichi Hayakawa , Koji Sasaki , Isamu Yoshida
发明人： Katsunori Azuma , Mutsuhiro Mori , Michiaki Hiyoshi , Seiichi Hayakawa , Koji Sasaki , Isamu Yoshida
IPC分类号： B60R16/03
CPC分类号： B60L11/04 , B60L2200/26 , H01L24/28 , H01L24/29 , H01L24/48 , H01L25/072 , H01L25/16 , H01L2224/48091 , H01L2224/4847 , H01L2924/00014 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/19041 , H01L2924/30107 , H01L2924/3025 , H02M7/003 , H03K17/08148 , H03K2017/0806 , H05K7/1432 , Y02T10/70 , Y02T10/7077 , Y10T307/74 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A power module includes an upper arm circuit unit and a lower arm circuit unit each having a power semiconductor element; an insulating substrate with the units mounted on one surface thereof; a metal base bonded onto the other surface of the substrate opposite to the one surface where the units are mounted; a first connection conductor for supplying a high potential to the upper unit from outside; a second connection conductor for supplying a low potential to the lower unit from outside; an insulating sheet interposed between the conductors; and a resin case disposed on the metal base to support the conductors, the conductors are flat conductors and laminated with the sheet sandwiched therebetween; the sheet extends from one end of the laminated structure to secure the creepage distance between the conductors; and the case is furnished with a recess for containing the laminated structure.
摘要翻译：功率模块包括上臂电路单元和下臂电路单元，每个具有功率半导体元件; 绝缘基板，其单元安装在其一个表面上; 金属底座粘合到与安装单元的一个表面相对的基板的另一个表面上; 用于从外部向上部单元提供高电位的第一连接导体; 用于从外部向下部单元提供低电位的第二连接导体; 插入在导体之间的绝缘片; 以及设置在金属基座上以支撑导体的树脂壳体，导体是扁平导体，并且夹在其间的片材层压; 片材从层压结构的一端延伸，以确保导体之间的爬电距离; 并且壳体设置有用于容纳层压结构的凹部。

3. 发明授权

US08564953B2 Semiconductor power module, inverter/converter including the same, and method of manufacturing a cooling jacket for semiconductor power module 有权
标题翻译：半导体功率模块，包括该半导体功率模块的逆变器/转换器以及制造用于半导体功率模块的冷却套的方法
公开(公告)号：US08564953B2
公开(公告)日：2013-10-22
申请号：US13013987
申请日：2011-01-26
申请人： Keisuke Horiuchi , Michiaki Hiyoshi , Koji Sasaki
发明人： Keisuke Horiuchi , Michiaki Hiyoshi , Koji Sasaki
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , F28F3/12 , H01L23/053 , H01L25/165 , H01L2924/0002 , H05K7/20927 , Y10T29/4998 , Y10T29/49989 , H01L2924/00
摘要： In order to achieve reduction in loss, a semiconductor power module comprises DC terminals to be connected to a condenser module and the semiconductor power module is used in combination with a cooling jacket for cooling, and the DC terminals protrude toward the condenser module beyond the cooling jacket.
摘要翻译：为了实现减少损耗，半导体功率模块包括要连接到电容器模块的DC端子，并且半导体功率模块与用于冷却的冷却套组合使用，并且DC端子朝着冷凝器模块突出超过冷却夹克。

4. 发明申请

US20110188204A1 Semiconductor Power Module, Inverter/Converter Including the same, and Method of Manufacturing a Cooling Jacket for Semiconductor Power Module 有权
标题翻译：半导体功率模块，包括其的逆变器/转换器以及制造用于半导体功率模块的冷却夹套的方法
公开(公告)号：US20110188204A1
公开(公告)日：2011-08-04
申请号：US13013987
申请日：2011-01-26
申请人： Keisuke HORIUCHI , Michiaki Hiyoshi , Koji Sasaki
发明人： Keisuke HORIUCHI , Michiaki Hiyoshi , Koji Sasaki
IPC分类号： H05K7/20 , B23P17/00
CPC分类号： H01L23/473 , F28F3/12 , H01L23/053 , H01L25/165 , H01L2924/0002 , H05K7/20927 , Y10T29/4998 , Y10T29/49989 , H01L2924/00
摘要： In order to achieve reduction in loss, a semiconductor power module comprises DC terminals to be connected to a condenser module and the semiconductor power module is used in combination with a cooling jacket for cooling, and the DC terminals protrude toward the condenser module beyond the cooling jacket.
摘要翻译：为了实现减少损耗，半导体功率模块包括要连接到电容器模块的DC端子，并且半导体功率模块与用于冷却的冷却套组合使用，并且DC端子朝着冷凝器模块突出超过冷却夹克。

5. 发明申请

US20160021280A1 MANAGEMENT APPARATUS, IMAGE FORMING APPARATUS MANAGEMENT SYSTEM FOR MANAGING USAGE OF THE IMAGE FORMING APPARATUS 审中-公开
公开(公告)号：US20160021280A1
公开(公告)日：2016-01-21
申请号：US14866501
申请日：2015-09-25
申请人： Atsushi SAKAGAMI , Naoto Sakurai , Daiya Miyasaka , Koji Sasaki , Tomoko Nishizawa
发明人： Atsushi SAKAGAMI , Naoto Sakurai , Daiya Miyasaka , Koji Sasaki , Tomoko Nishizawa
IPC分类号： H04N1/44 , H04N1/32
CPC分类号： H04N1/4426 , G06F3/1222 , G06F21/34 , G06F21/608 , G06F21/629 , G06K15/40 , G06K15/4095 , H04N1/32122 , H04N1/32561 , H04N1/4413 , H04N1/4433 , H04N1/444 , H04N2201/0094 , H04N2201/3205 , H04N2201/3221
摘要： A management apparatus connected to an image forming apparatus for managing usage of the image forming apparatus is disclosed. The management apparatus includes a user data storage part for storing user identification data and use restriction data corresponding to the user identification data, and a use restriction data acquiring part for acquiring the use restriction data corresponding to the user identification data.

6. 发明授权

US08714451B2 Image forming apparatus management system, image forming apparatus, managing apparatus, terminal apparatus, image forming apparatus managing method, and image forming program 有权
标题翻译：图像形成装置管理系统，图像形成装置，管理装置，终端装置，图像形成装置管理方法以及图像形成程序
公开(公告)号：US08714451B2
公开(公告)日：2014-05-06
申请号：US12029120
申请日：2008-02-11
申请人： Atsushi Sakagami , Naoto Sakurai , Koji Sasaki , Daiya Miyasaka , Tomoko Nishizawa , Yasuhiko Tsugawa , Yohei Ono
发明人： Atsushi Sakagami , Naoto Sakurai , Koji Sasaki , Daiya Miyasaka , Tomoko Nishizawa , Yasuhiko Tsugawa , Yohei Ono
IPC分类号： G06F17/00 , G06K15/00 , G06K7/10 , G06K19/00 , G06F13/00
CPC分类号： H04N1/4433 , G06F3/1203 , G06F3/1238 , H04N1/00204 , H04N1/00244 , H04N1/00323 , H04N1/00344 , H04N1/2183 , H04N1/4426 , H04N2201/001 , H04N2201/0051 , H04N2201/0065 , H04N2201/0087 , H04N2201/0094 , H04N2201/214 , H04N2201/216 , H04N2201/3205 , H04N2201/3276
摘要： A disclosed managing apparatus and image forming apparatus management system ensure confidentiality of information in an image forming apparatus while usability is maintained. An image forming apparatus acquires IC card identifying information with an IC card reader. A management server acquires a user ID associated with the acquired IC card identifying information and use limit information concerning use of the image forming apparatus. A process is performed in the image forming apparatus in accordance with the use limit information.
摘要翻译：所公开的管理装置和图像形成装置管理系统在保持可用性的同时确保图像形成装置中的信息的机密性。图像形成装置利用IC卡读取器获取IC卡识别信息。管理服务器获取与获取的IC卡识别信息相关联的用户ID以及关于图像形成装置的使用的限制信息。根据使用限制信息在图像形成装置中执行处理。

7. 发明授权

US08339984B2 Automatic network retrieval and display device 有权
标题翻译：自动网络检索和显示设备
公开(公告)号：US08339984B2
公开(公告)日：2012-12-25
申请号：US12787244
申请日：2010-05-25
申请人： Koji Sasaki
发明人： Koji Sasaki
IPC分类号： H04L12/28 , H04L12/56 , H04B7/212 , H04J3/16 , H04J3/22 , H04J3/24
CPC分类号： H04L12/5691
摘要： An automatic network retrieval and display device including: a transmission/reception processing unit 2 that receives information on at least one existing network and extracts error information and the like; a data conversion processing unit 4 that decides a connection state of each network on the basis of extracted information and outputs packet information lists in descending order of excellence in connection state; a network monitor processing unit 3 that extracts radio field intensity information from a network identifier and creates network identification information lists in decreasing order of radio field intensity; a network information establishment processing unit 5 that establishes a connection priority based on a communication state of the network on the basis of the network identification information list and the packet information list; a network switch processing unit 6 that connects to a network with a high priority on the basis of the connection priority of the network; and, a display unit 7 that displays a terminal on the connected network. This device can keep track of the communication state without requiring transmission of a packet used exclusively for displaying a communication state or requiring any terminal as a destination for transmission, and is connectable automatically to a network with a high priority.
摘要翻译：一种自动网络检索和显示装置，包括：发送/接收处理单元2，其接收关于至少一个现有网络的信息并提取错误信息等; 数据转换处理单元4，其基于所提取的信息来决定每个网络的连接状态，并以连接状态优异的降序输出分组信息列表; 网络监视器处理单元3，其从网络标识符提取无线电场强度信息，并以无线电场强度的降序创建网络识别信息列表; 网络信息建立处理单元5，其基于网络识别信息列表和分组信息列表，基于网络的通信状态建立连接优先级; 网络交换处理单元6，其基于网络的连接优先级连接到具有高优先级的网络; 以及在连接的网络上显示终端的显示单元7。该设备可以跟踪通信状态，而不需要传输专门用于显示通信状态或要求任何终端作为传输目的地的分组，并且可以自动连接到具有高优先级的网络。

8. 发明申请

US20120242747A1 LIQUID EJECTION HEAD AND MANUFACTURING METHOD THEREOF 有权
标题翻译：液体喷射头及其制造方法
公开(公告)号：US20120242747A1
公开(公告)日：2012-09-27
申请号：US13420834
申请日：2012-03-15
申请人： Toshiaki Kurosu , Koji Sasaki , Kouji Hasegawa , Satoshi Ibe , Yoshinori Tagawa
发明人： Toshiaki Kurosu , Koji Sasaki , Kouji Hasegawa , Satoshi Ibe , Yoshinori Tagawa
IPC分类号： B41J2/135 , B23P17/00
CPC分类号： B41J2/1603 , B41J2/1623 , B41J2/1626 , B41J2/1631 , B41J2/1639 , B41J2/1645 , B41J2002/14403
摘要： Provided is a liquid ejection head, including: an ejection orifice forming member having an ejection orifice for ejecting liquid; a substrate having a supply port for supplying the liquid to the ejection orifice; and a filter disposed at a position upstream of the ejection orifice when the liquid is supplied to the ejection orifice, in which the filter includes an opening having a diameter smaller than or equal to a diameter of the ejection orifice, and a tapered shape structure disposed at a position upstream of the opening when the liquid is supplied to the ejection orifice, the tapered shape structure having a distal end directed toward an upstream side.
摘要翻译：提供一种液体喷射头，包括：具有用于喷射液体的喷射孔的喷射口形成部件; 具有用于将液体供给到喷射口的供给口的基板; 以及当所述液体被供应到所述喷射孔时，所述过滤器设置在所述喷射口的上游位置处，所述过滤器包括具有小于或等于所述喷射孔的直径的直径的开口，并且设置有锥形形状结构当液体被供应到喷射口时在开口上游的位置处，锥形形状结构具有朝向上游侧的远端。

9. 发明授权

US08183681B2 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US08183681B2
公开(公告)日：2012-05-22
申请号：US12493502
申请日：2009-06-29
申请人： Shinji Hiramitsu , Hiroyuki Ohta , Koji Sasaki , Masato Nakamura , Osamu Ikeda , Satoshi Matsuyoshi
发明人： Shinji Hiramitsu , Hiroyuki Ohta , Koji Sasaki , Masato Nakamura , Osamu Ikeda , Satoshi Matsuyoshi
IPC分类号： H01L23/48
CPC分类号： H01L23/051 , H01L23/24 , H01L2224/33181
摘要： A semiconductor device which includes a semiconductor chip; an electrically conductive base electrode bonded to the lower surface of the chip by a first bonding member; an electrically conductive lead electrode bonded to the upper surface of the chip by a second bonding member; and a first stress relief member for reducing stress developed in the first bonding member due to the difference in thermal expansion between the chip and the base electrode. Both the base electrode and the first stress relief member are in direct contact with the lower surface of the first bonding member. A protrusion is formed upstanding from the base electrode in direct contact with the first bonding member, and the first stress relief member surrounds a circumferential portion of the protrusion.
摘要翻译：一种半导体器件，包括半导体芯片; 通过第一接合部件接合到所述芯片的下表面的导电基极; 通过第二接合部件将芯片的上表面接合的导电性引线电极; 以及由于芯片和基极之间的热膨胀差异，用于减小在第一接合部件中产生的应力的第一应力消除部件。基极和第一应力消除构件都与第一接合构件的下表面直接接触。从与第一接合构件直接接触的基极形成突起，并且第一应力消除构件围绕突起的周向部分。

10. 发明授权

US08102050B2 Semiconductor device and the method of manufacturing the same 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US08102050B2
公开(公告)日：2012-01-24
申请号：US12243477
申请日：2008-10-01
申请人： Koji Sasaki , Kazuo Matsuzaki , Takashi Kobayashi
发明人： Koji Sasaki , Kazuo Matsuzaki , Takashi Kobayashi
IPC分类号： H01L23/48
CPC分类号： H01L24/04 , H01L24/03 , H01L24/48 , H01L2224/48 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01033 , H01L2924/01045 , H01L2924/0105 , H01L2924/01061 , H01L2924/01074 , H01L2924/04941 , H01L2924/10253 , H01L2924/14 , H01L2924/3511 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device includes a semiconductor substrate; a metal electrode wiring laminate on the semiconductor substrate, the metal electrode wiring laminate being patterned with a predetermined wiring pattern; the metal electrode wiring laminate including an undercoating barrier metal laminate and aluminum or aluminum alloy film on the undercoating barrier metal laminate; and organic passivation film covering the metal electrode wiring laminate, wherein the barrier metal laminate is a three-layered laminate including titanium films sandwiching a titanium nitride film. The semiconductor device according to the invention facilitates improving the moisture resistance of the portion of the barrier metal laminate exposed temporarily in the manufacturing process, facilitates employing only one passivation film, facilitates preventing the failures caused by cracks from occurring and the failures caused by Si nodules remaining in the aluminum alloy from increasing.
摘要翻译：半导体器件包括半导体衬底; 在所述半导体基板上的金属电极布线层压体，所述金属电极布线层叠体以预定的布线图案形成图案; 所述金属电极布线层压体包括底涂阻隔金属层压体和铝或铝合金膜在所述底涂层阻挡金属层压板上; 以及覆盖所述金属电极布线层叠体的有机钝化膜，其中所述阻挡金属层压体为包含夹着氮化钛膜的钛膜的三层层叠体。根据本发明的半导体器件有助于提高在制造过程中暂时暴露的阻挡金属层叠体的部分的耐湿性，仅使用一个钝化膜，有助于防止由裂纹引起的故障和由Si结节引起的故障留在铝合金中增加。

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