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    • 2. 发明授权
    • Method of manufacturing a semiconductor device
    • 制造半导体器件的方法
    • US07910474B2
    • 2011-03-22
    • US12098190
    • 2008-04-04
    • Tatsuya UsamiNoboru MoritaKoichi OhtoKazuhiko Endo
    • Tatsuya UsamiNoboru MoritaKoichi OhtoKazuhiko Endo
    • H01L21/4763
    • H01L21/76834H01L21/76801H01L21/76802H01L21/76807H01L21/76832H01L23/5222H01L23/53228H01L23/53295H01L2924/0002H01L2924/00
    • An object of the present invention is to provide a semiconductor device which comprises a barrier film having a high etching selection ratio of the interlayer insulating film thereto, a good preventive function against the Cu diffusion, a low dielectric constant and excellent adhesiveness to the Cu interconnection and a manufacturing method thereof.The barrier film (for instance, a second barrier film 6) disposed between the interconnection or the via plug and its overlying interlayer insulating film is made to have a layered structure made of a plurality of films containing silicon and carbon (preferably, silicon, carbon and nitrogen), with different carbon contents, and, in particular, a low-carbon-concentration film 6a with a small carbon content is set to be a lower layer therein and a high-carbon-concentration film 6b with a large carbon content is set to be an upper layer therein, whereby the effectual prevention against the Cu diffusion, a high etching selection ratio and good adhesiveness to the Cu interconnection can be certainly provided by the presence of the low-carbon-concentration film 6a, while the overall dielectric constant can be well reduced by the presence of the high-carbon-concentration film 6b.
    • 本发明的目的是提供一种半导体器件,其包括其间的层间绝缘膜的蚀刻选择率高的阻挡膜,对Cu扩散的良好的预防功能,低介电常数和对Cu互连的优异粘合性 及其制造方法。 设置在互连或通孔插塞及其上覆层间绝缘膜之间的阻挡膜(例如,第二阻挡膜6)具有由多个含有硅和碳的膜(优选硅,碳 和氮),具有不同的碳含量,特别是具有小碳含量的低碳浓度膜6a被设定为下层,并且具有大碳含量的高碳浓度膜6b为 在其中设置为上层,由此通过低碳浓度膜6a的存在可以确定地提供对Cu扩散的有效防止,高的蚀刻选择率和对Cu互连的良好的粘合性,而整个电介质 通过高碳浓度膜6b的存在可以很好地降低常数。
    • 4. 发明授权
    • Semiconductor device and manufacturing method thereof
    • 半导体装置及其制造方法
    • US07391115B2
    • 2008-06-24
    • US10768676
    • 2004-02-02
    • Tatsuya UsamiNoboru MoritaKoichi OhtoKazuhiko Endo
    • Tatsuya UsamiNoboru MoritaKoichi OhtoKazuhiko Endo
    • H01L23/48H01L23/52H01L29/40
    • H01L21/76834H01L21/76801H01L21/76802H01L21/76807H01L21/76832H01L23/5222H01L23/53228H01L23/53295H01L2924/0002H01L2924/00
    • An object of the present invention is to provide a semiconductor device which comprises a barrier film having a high etching selection ratio of the interlayer insulating film thereto, a good preventive function against the Cu diffusion, a low dielectric constant and excellent adhesiveness to the Cu interconnection and a manufacturing method thereof.The barrier film (for instance, a second barrier film 6) disposed between the interconnection or the via plug and its overlying interlayer insulating film is made to have a layered structure made of a plurality of films containing silicon and carbon (preferably, silicon, carbon and nitrogen), with different carbon contents, and, in particular, a low-carbon-concentration film 6a with a small carbon content is set to be a lower layer therein and a high-carbon-concentration film 6b with a large carbon content is set to be an upper layer therein, whereby the effectual prevention against the Cu diffusion, a high etching selection ratio and good adhesiveness to the Cu interconnection can be certainly provided by the presence of the low-carbon-concentration film 6a, while the overall dielectric constant can be well reduced by the presence of the high-carbon-concentration film 6b.
    • 本发明的目的是提供一种半导体器件,其包括其间的层间绝缘膜的蚀刻选择率高的阻挡膜,对Cu扩散的良好的预防功能,低介电常数和对Cu互连的优异粘合性 及其制造方法。 设置在互连或通孔插塞及其上覆层间绝缘膜之间的阻挡膜(例如,第二阻挡膜6)具有由多个含有硅和碳的膜(优选硅,碳 和氮),具有不同的碳含量,特别是具有小碳含量的低碳浓度膜6a被设定为下层,并且具有大碳的高碳浓度膜6b 含量被设定为上层,由此可以通过低碳浓度膜6a的存在来确定地提供对Cu扩散的有效防止,高的蚀刻选择率和对Cu互连的良好的粘附性,同时 通过存在高碳浓度膜6b可以很好地降低总介电常数。
    • 6. 发明授权
    • SRAM cell and SRAM device
    • SRAM单元和SRAM器件
    • US08040717B2
    • 2011-10-18
    • US12521408
    • 2007-12-20
    • Shinichi OuchiYongxun LiuMeishoku MasaharaTakashi MatsukawaKazuhiko Endo
    • Shinichi OuchiYongxun LiuMeishoku MasaharaTakashi MatsukawaKazuhiko Endo
    • G11C11/00
    • H01L27/1104H01L21/845H01L27/11H01L27/1211H01L29/785H01L29/7856
    • A static random access memory (SRAM) cell includes a first to a fourth semiconductor thin plate that are provided on a substrate and are arranged parallel to each other. On respective semiconductor thin plates, there is formed a first four-terminal double-gate field effect transistor (FET) with a first conductivity type, a second and a third four-terminal double-gate FET which are connected in series with each other and have a second conductivity type, a fourth and a fifth four-terminal double-gate FET which are connected in series with each other and have the second conductivity type, and a sixth four-terminal double-gate FET with the first conductivity type. The third and the fourth four-terminal double-gate FETs form select transistors, and the first, second, fifth and sixth four-terminal double-gate FETs form a complementary metal-oxide-semiconductor (CMOS) inverter.
    • 静态随机存取存储器(SRAM)单元包括设置在基板上并且彼此平行布置的第一至第四半导体薄板。 在相应的半导体薄板上形成具有第一导电类型的第一四端双栅场效应晶体管(FET),彼此串联连接的第二和第三四端双栅FET 具有彼此串联并具有第二导电类型的第二导电类型,第四和第五四端子双栅极FET以及具有第一导电类型的第六四端子双栅极FET。 第三和第四四端子双栅极FET形成选择晶体管,第一,第二,第五和第六四端子双栅极FET形成互补的金属氧化物半导体(CMOS)反相器。
    • 9. 发明申请
    • Activation signal output circuit and determining circuit
    • 激活信号输出电路和确定电路
    • US20060071654A1
    • 2006-04-06
    • US10536338
    • 2003-11-26
    • Kazuo MizunoRyu KimuraYoshiyuki KagoYukiomi TanakaKazuhiko EndoHisanori UdaHiroaki Hayashi
    • Kazuo MizunoRyu KimuraYoshiyuki KagoYukiomi TanakaKazuhiko EndoHisanori UdaHiroaki Hayashi
    • G01R25/00
    • H03D1/10H03D1/18
    • A start signal output circuit having an RF/DC conversion circuit to which radio frequency power (RF) of specified frequency is inputted and from which a direct current potential (DC) is outputted, comprises a detection/amplification circuit 210 which includes a voltage doubler wave-detector circuit 10 configured including a sensing diode Q1 (Tr34) for sensing the RF power, a differential amplifier including differential pair transistors Tr31 and Tr32, and a current mirror circuit. A base current of one Tr31 of the differential pair transistors is brought into substantial agreement with a DC component of a current flowing through the sensing diode Q1 (Tr34). A total of currents flowing through the differential pair transistors Tr31 and Tr32 is regulated to a substantially constant value by the current mirror circuit. Thus, the start signal output circuit which is small in size, high in sensitivity and low in power consumption can be realized.
    • 具有输入了特定频率的射频功率(RF)并从其输出直流电位(DC)的RF / DC转换电路的启动信号输出电路包括检测/放大电路210,其包括倍压器 波检测器电路10被配置为包括用于感测RF功率的感测二极管Q 1(Tr 34),包括差分对晶体管Tr 31和Tr 32的差分放大器和电流镜电路。 差分对晶体管的一个Tr 31的基极电流与流经感测二极管Q 1(Tr 34)的电流的直流分量基本一致。 流过差分对晶体管Tr 31和Tr 32的总电流通过电流镜电路被调节到基本恒定的值。 因此,可以实现尺寸小,灵敏度高,功耗低的启动信号输出电路。
    • 10. 发明授权
    • Deflection yoke for color cathode-ray tube
    • 彩色阴极射线管偏转磁轭
    • US06495950B1
    • 2002-12-17
    • US09533363
    • 2000-03-22
    • Katsumi ItoAkihiko MoriKazuhiko Endo
    • Katsumi ItoAkihiko MoriKazuhiko Endo
    • H01J2970
    • H01J29/703
    • A deflection yoke capable of easily adjusting a member having a pair of magnetic pieces by moving the member to a standard state in the case of correcting misconvergence. According to the deflection yoke of the invention, a member having a pair of magnetic pieces disposed in the horizontal deflection direction is attached to an electron gun side of the deflection yoke. The shape of a part of each of ends of the member coincides with a part of the outer shape of the electron gun side of the deflection yoke. The adjusting person can easily set the member into the standard state by adjusting the parts with his/her fingers. By moving the member in the horizontal direction from such a state, misconvergence can be corrected.
    • 一种偏转线圈,其能够通过在校正失会聚的情况下将构件移动到标准状态来容易地调节具有一对磁片的构件。 根据本发明的偏转线圈,具有沿水平偏转方向设置的一对磁性片的构件安装在偏转线圈的电子枪侧。 构件的每个端部的一部分的形状与偏转线圈的电子枪侧的外部形状的一部分重合。 调整人员可以通过用手指调节部件,轻松地将会员设置为标准状态。 通过从这种状态沿水平方向移动构件,可以纠正失会聚。