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1. 发明申请

US20050124084A1 Substrate processing apparatus, control method for the apparatus, and program for implementing the method 有权
标题翻译：基板处理装置，装置的控制方法和实现该方法的程序
公开(公告)号：US20050124084A1
公开(公告)日：2005-06-09
申请号：US10984982
申请日：2004-11-10
申请人： Noriaki Shimizu , Masahiro Numakura
发明人： Noriaki Shimizu , Masahiro Numakura
IPC分类号： H01L21/02 , H01L21/00 , H01L21/66 , C23C16/00 , G01R31/26
CPC分类号： H01L21/67294 , H01L21/67276 , Y10S414/135
摘要： A substrate processing apparatus, according to which inspection of various devices in the substrate processing apparatus can be carried out with improved reliability, while reducing the burden on a user. A processing chamber processes semiconductor wafers therein. A transfer chamber transfers the semiconductor wafers. A FOUP (front opening unified pod) houses a plurality of dummy wafers for inspection of the processing chamber or the transfer chamber. A CPU causes an HDD (hard disk drive) to store a housing state relating to the arrangement of the dummy wafers in the FOUP before replacement of dummy wafers in the FOUP and that after the replacement as dummy wafer setup information.
摘要翻译：一种基板处理装置，根据该基板处理装置，可以在提高可靠性的同时进行基板处理装置中的各种装置的检查，同时减轻用户的负担。处理室在其中处理半导体晶片。传送室传送半导体晶片。 FOUP（前开口统一吊舱）容纳多个用于检查处理室或传送室的虚拟晶片。在更换FOUP中的虚拟晶片之前，将HDD（硬盘驱动器）存储在与FOUP中的虚设晶片的布置有关的壳体状态，以及在替换之后的虚拟晶片设置信息。

2. 发明授权

US08145339B2 Substrate processing apparatus and substrate transfer method adopted therein 有权
标题翻译：基板处理装置及基板转印方法
公开(公告)号：US08145339B2
公开(公告)日：2012-03-27
申请号：US12418869
申请日：2009-04-06
申请人： Kiyohito Iijima , Hiroaki Mochizuki , Masahiro Numakura
发明人： Kiyohito Iijima , Hiroaki Mochizuki , Masahiro Numakura
IPC分类号： G06F19/00
CPC分类号： H01L21/67748 , H01L21/67253 , H01L21/67754
摘要： As an interrupt start button is depressed while control, under which product wafers Wp and dummy wafers Wd are transferred in an order defined in a normal transfer pattern, is repeatedly executed, a decision is made based upon wafer transfer history as to whether or not the most recent transfer pattern cycle has ended. If the cycle is determined to have ended, the operation immediately proceeds to the subsequent cycle to transfer interrupt wafers Wf and Wd in an order defined in the interrupt transfer pattern achieved by replacing Wp in the normal transfer pattern with Wf, whereas if the cycle is determined to be incomplete, the wafer transfer based upon the normal transfer pattern is carried on until the cycle ends and then the operation proceeds to the next cycle to transfer Wf and Wd in the order defined in the interrupt transfer pattern.
摘要翻译：当按照正常传送模式中定义的顺序传送产品晶片Wp和虚拟晶片Wd的控制下按下中断启动按钮时，基于晶片传送历史来决定是否最近的转移模式周期已经结束。如果确定该周期已经结束，则操作立即进行到随后的周期，以按照以Wf代替正常转移模式中的Wp而实现的以中断转移模式中定义的顺序传送中断晶片Wf和Wd，而如果周期为确定为不完全，基于正常转移模式的晶片传送被继续进行，直到循环结束，然后操作进行到下一个周期，以按照中断传送模式中定义的顺序传送Wf和Wd。

3. 发明授权

US07738987B2 Device and method for controlling substrate processing apparatus 有权
标题翻译：用于控制基板处理装置的装置和方法
公开(公告)号：US07738987B2
公开(公告)日：2010-06-15
申请号：US11945539
申请日：2007-11-27
申请人： Masahiro Numakura
发明人： Masahiro Numakura
IPC分类号： G06F19/00 , G06F7/00 , C23F1/00 , H01L21/306 , C23C14/00 , C25B11/00 , C25B13/00
CPC分类号： H01L21/67196 , H01L21/67253
摘要： Depending on the degree of microfabrication requested for each wafer lot, transfer of wafers is controlled. A substrate processing apparatus includes a plurality of PMs 400 and an LLM 500 and is controlled by an EC 200. The EC 200 includes a selection unit 255 and a transfer control unit 260. The unit 255 selects the PM to which the next wafer is to be transferred, and selects, for each lot, whether the wafers are transferred to the same PM in one-lot units or in one-substrate units depending on the degree of the microfabrication requested for each lot. When the wafer transfer in lot units is selected, the unit 260 sequentially transfers the wafers included in the lot to the selected PM. Otherwise the unit 260 sequentially OR transfers the wafers included in the lot from the selected PM to a different PM one by one.
摘要翻译：根据每个晶片批次要求的微加工程度，控制晶片的转移。基板处理装置包括多个PM 400和LLM 500，并由EC 200控制.EC 200包括选择单元255和转移控制单元260.单元255选择下一个晶片所在的PM 根据每个批次要求的微细加工程度，对每个批次选择晶圆是以单批单位还是单基板单位转移到同一个PM。当选择批量单位的晶片转移时，单元260将批次中包括的晶片顺序地传送到所选择的PM。否则，单元260顺序地将包括在批次中的晶片从所选择的PM逐个传送到不同的PM。

4. 发明授权

US08571703B2 System, method and storage medium for controlling a processing system 有权
标题翻译：用于控制加工系统的系统，方法和存储介质
公开(公告)号：US08571703B2
公开(公告)日：2013-10-29
申请号：US12203512
申请日：2008-09-03
申请人： Masahiro Numakura , Keiji Osada
发明人： Masahiro Numakura , Keiji Osada
IPC分类号： G06F7/00
CPC分类号： H01L21/67276
摘要： A processing system includes process modules, load lock modules, an equipment controller, and a machine controller. The equipment controller controls transfer and processing of wafers in the processing system. A transfer destination determining portion determines the transfer destination of each wafer such that each wafer is sequentially transferred to a normally operating process module. When an abnormality occurs in a process module, an evacuation portion temporarily evacuates to a cassette stage the wafer determined to be transferred to the abnormal process module and that has not yet been transferred to the abnormal process module. When an error of the abnormal process module is dealt with, a transfer destination change portion changes the transfer destination of a wafer scheduled to be first transferred from the cassette case, to the transfer inhibition-released process module. When the error of the transfer-inhibited processing chamber is released, the transfer route is optimized.
摘要翻译：处理系统包括处理模块，加载锁定模块，设备控制器和机器控制器。设备控制器控制处理系统中晶片的转移和处理。转移目的地确定部分确定每个晶片的转移目的地，使得每个晶片被顺序地转移到正常操作的处理模块。当处理模块发生异常时，抽真空部分将确定要传送到异常处理模块并且尚未传送到异常处理模块的晶片临时抽空到盒级。当处理异常处理模块的错误时，转移目的地改变部分将预定从首先传送的晶片的转移目的地改变到转移禁止释放处理模块。当释放转移禁止处理室的误差时，优化传送路径。

5. 发明授权

US08382910B2 Cleaning method for substrate processing system, storage medium, and substrate processing system 有权
标题翻译：基板处理系统，存储介质和基板处理系统的清洗方法
公开(公告)号：US08382910B2
公开(公告)日：2013-02-26
申请号：US12398587
申请日：2009-03-05
申请人： Masahiro Numakura , Hiroaki Mochizuki , Kiyohito Iijima
发明人： Masahiro Numakura , Hiroaki Mochizuki , Kiyohito Iijima
IPC分类号： B08B9/08
CPC分类号： H01L21/67207 , H01L21/67028 , H01L21/67253
摘要： A cleaning method for a substrate processing system capable of appropriately cleaning a housing chamber. In the substrate processing system, the number of execution times of product processing is accumulated, if the product processing to be executed next corresponds to first product processing for a subsequent lot, a time interval between preceding and subsequent lots is not longer than a predetermined time period, and a type of the last product processing performed for the preceding lot is the same as that of the first product processing to be performed for the subsequent lot. When the accumulated number of execution times is not less than a predetermined number of times, a cleaning treatment is executed, which corresponds to a chamber indicated in a system recipe set for a lot including a wafer on which the product processing is performed immediately before execution of the cleaning treatment.
摘要翻译：一种能够适当地清洁容纳室的基板处理系统的清洁方法。在基板处理系统中，累积产品处理的执行次数，如果接下来要执行的产品处理对应于后续批次的第一产品处理，则之前和后续批次之间的时间间隔不长于预定时间期间，并且对于前一批次执行的最后一个产品处理的类型与为后续批次执行的第一产品处理的类型相同。当累计执行次数不小于预定次数时，执行清洁处理，其对应于在紧接执行产品处理之前执行的包括晶片的批次设置的系统配方中指示的室的清洁处理。

6. 发明授权

US08055378B2 Device for controlling processing system, method for controlling processing system and computer-readable storage medium stored processing program 有权
标题翻译：用于控制处理系统的装置，控制处理系统的方法和计算机可读存储介质存储处理程序
公开(公告)号：US08055378B2
公开(公告)日：2011-11-08
申请号：US12203509
申请日：2008-09-03
申请人： Masahiro Numakura
发明人： Masahiro Numakura
IPC分类号： G06F19/00 , G06F7/00
CPC分类号： G05B19/4184 , G05B2219/31355 , G05B2219/32243 , G05B2219/32297 , G05B2219/45031 , H01L21/67276 , Y02P90/14 , Y02P90/20
摘要： A processing system includes process modules, load lock modules, an equipment controller, and a machine controller. The equipment controller controls transfer and processing of wafers in the processing system. A transfer destination determining portion determines the transfer destination of each wafer such that each wafer is sequentially transferred to a normally operating process module. When an abnormality occurs in a process module, an evacuation portion temporarily evacuates to a cassette stage the wafer determined is to be transferred to the abnormal process module and that has not yet been transferred to the abnormal process module. When a new transfer destination of the evacuated wafer is determined, if a process that is performed immediately before processing the evacuated wafer in the processing module as the new transfer destination satisfies a predetermined condition, a transfer inhibition portion inhibits the transfer of the evacuated wafer to the new transfer destination.
摘要翻译：处理系统包括处理模块，加载锁定模块，设备控制器和机器控制器。设备控制器控制处理系统中晶片的转移和处理。转移目的地确定部分确定每个晶片的转移目的地，使得每个晶片被顺序地转移到正常操作的处理模块。当处理模块发生异常时，抽真空部分临时抽出到盒级，所确定的晶片将被传送到异常处理模块，并且尚未传送到异常处理模块。当确定了真空晶片的新的转移目的地时，如果在作为新的转移目的地的处理模块中处理真空晶片之前立即执行的处理满足预定条件，则转移抑制部分禁止将真空晶片转移到新的转运目的地。

7. 发明申请

US20100089423A1 CLEANING METHOD AND STORAGE MEDIUM 审中-公开
标题翻译：清洁方法和储存介质
公开(公告)号：US20100089423A1
公开(公告)日：2010-04-15
申请号：US12577347
申请日：2009-10-12
申请人： Kiyohito IIJIMA , Masahiro Numakura , Hiroaki Mochizuki
发明人： Kiyohito IIJIMA , Masahiro Numakura , Hiroaki Mochizuki
IPC分类号： B08B9/00
CPC分类号： H01L21/67276 , H01J37/32862 , H01J37/32935
摘要： A cleaning method is provided to clean processing chambers of a substrate processing apparatus for transferring substrates included in each of lots to the processing chambers on a lot basis and processing the substrates in the processing chambers simultaneously. The cleaning method includes checking whether a lot is switched to another lot to which different cleaning conditions are applied prior to the processing in the processing chambers, performing a cleaning process on the processing chambers under cleaning conditions of a previous lot by transferring cleaning substrates into the processing chambers when it is determined that a lot is switched to another lot to which different cleaning conditions are applied, and omitting the cleaning process of the processing chambers when it is determined that a lot is switched to another lot to which the same cleaning conditions are applied.
摘要翻译：提供一种清洁方法，用于清洁基板处理装置的处理室，用于将批次中包含的基板批量传送到处理室，同时处理处理室中的基板。清洁方法包括在处理室中的处理之前检查批次是否切换到施加了不同清洁条件的另一批次，通过将清洁基板转移到处理室中的清洁条件下对处理室进行清洁处理当确定批次被切换到施加不同清洁条件的另一批次时，处理室，并且当确定批次被切换到具有相同清洁条件的另一批次时，省略处理室的清洁处理应用。

8. 发明授权

US07640072B2 Substrate processing apparatus, control method for the apparatus, and program for implementing the method 有权
标题翻译：基板处理装置，装置的控制方法和实现该方法的程序
公开(公告)号：US07640072B2
公开(公告)日：2009-12-29
申请号：US12125959
申请日：2008-05-23
申请人： Noriaki Shimizu , Masahiro Numakura
发明人： Noriaki Shimizu , Masahiro Numakura
IPC分类号： G06F19/00 , H01L21/306 , C23F1/00
CPC分类号： H01L21/67294 , H01L21/67276 , Y10S414/135
摘要： A substrate processing apparatus, according to which inspection of various devices in the substrate processing apparatus can be carried out with improved reliability, while reducing the burden on a user. A processing chamber processes semiconductor wafers therein. A transfer chamber transfers the semiconductor wafers. A FOUP (front opening unified pod) houses a plurality of dummy wafers for inspection of the processing chamber or the transfer chamber. A CPU causes an HDD (hard disk drive) to store a housing state relating to the arrangement of the dummy wafers in the FOUP before replacement of dummy wafers in the FOUP and that after the replacement as dummy wafer setup information.
摘要翻译：一种基板处理装置，根据该基板处理装置，可以在提高可靠性的同时进行基板处理装置中的各种装置的检查，同时减轻用户的负担。处理室在其中处理半导体晶片。传送室传送半导体晶片。 FOUP（前开口统一吊舱）容纳多个用于检查处理室或传送室的虚拟晶片。在更换FOUP中的虚拟晶片之前，CPU将硬盘（硬盘驱动器）存储与FOUP中的虚设晶片的布置相关的壳体状态，以及在替换之后的虚拟晶片设置信息。

9. 发明授权

US07455747B2 Substrate processing apparatus, control method for the apparatus, and program for implementing the method 有权
标题翻译：基板处理装置，装置的控制方法和实现该方法的程序
公开(公告)号：US07455747B2
公开(公告)日：2008-11-25
申请号：US10984982
申请日：2004-11-10
申请人： Noriaki Shimizu , Masahiro Numakura
发明人： Noriaki Shimizu , Masahiro Numakura
IPC分类号： H01L21/306 , H01L21/67 , B05C11/00 , C23C16/00 , G06F19/00
CPC分类号： H01L21/67294 , H01L21/67276 , Y10S414/135
摘要： A substrate processing apparatus, according to which inspection of various devices in the substrate processing apparatus can be carried out with improved reliability, while reducing the burden on a user. A processing chamber processes semiconductor wafers therein. A transfer chamber transfers the semiconductor wafers. A FOUP (front opening unified pod) houses a plurality of dummy wafers for inspection of the processing chamber or the transfer chamber. A CPU causes an HDD (hard disk drive) to store a housing state relating to the arrangement of the dummy wafers in the FOUP before replacement of dummy wafers in the FOUP and that after the replacement as dummy wafer setup information.
摘要翻译：一种基板处理装置，根据该基板处理装置，可以在提高可靠性的同时进行基板处理装置中的各种装置的检查，同时减轻用户的负担。处理室在其中处理半导体晶片。传送室传送半导体晶片。 FOUP（前开口统一吊舱）容纳多个用于检查处理室或传送室的虚拟晶片。在更换FOUP中的虚拟晶片之前，CPU将硬盘（硬盘驱动器）存储与FOUP中的虚设晶片的布置相关的壳体状态，以及在替换之后的虚拟晶片设置信息。

10. 发明授权

US07367769B2 Semiconductor production system, cluster tool, control method of semiconductor production system and maintenance method of cluster tool 有权
标题翻译：半导体生产系统，集群工具，半导体生产系统的控制方法和集群工具的维护方法
公开(公告)号：US07367769B2
公开(公告)日：2008-05-06
申请号：US10471289
申请日：2002-03-18
申请人： Tomoyuki Ishii , Masahiro Numakura
发明人： Tomoyuki Ishii , Masahiro Numakura
IPC分类号： H01L21/677 , G06F7/00
CPC分类号： H01L21/67276 , G05B2219/45032 , Y10S414/139
摘要： PS control sections MC1, MC2 configured to independently control the operations in process ships PS1, PS2 are provided respectively, and an LM control section MC3 configured to control the operation in a loader module LM is provided independently.With this structure, the operations of the process ships PS1, PS2 and the loader module LM can be checked while the process ships PS1, PS2 are not coupled to the loader module LM.
摘要翻译：分别提供被配置为独立地控制处理船舶PS 1，PS 2中的操作的PS控制部分MC 1，MC 2，并且独立地提供被配置为控制加载器模块LM中的操作的LM控制部分MC 3。利用这种结构，可以在处理装置PS 1，PS 2未联接到装载机模块LM的同时检查处理船PS 1，PS 2和装载机模块LM的操作。

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