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    • 2. 发明申请
    • MEMORY DEVICE
    • 内存设备
    • US20140286088A1
    • 2014-09-25
    • US14018148
    • 2013-09-04
    • Masahiro TAKAHASHITsuneo INABADong Keun KIMJi Wang LEE
    • Masahiro TAKAHASHITsuneo INABADong Keun KIMJi Wang LEE
    • G11C11/16
    • G11C11/1673G11C11/161G11C11/1659
    • According to one embodiment, a memory device includes a memory cell, a sense amplifier, unit structures and a reference signal generator. Each structure includes a first end, a first transistor, a first local line, a variable resistance element, a second transistor, a second local line, and a third transistor coupled in series. The reference signal generator includes first to fourth global lines, and first and second ones of the unit structures. The first unit structure is coupled at the first end to the first global line and coupled at the second end to the third global line. The second unit structure is coupled at the first end to the fourth global line and coupled at the second end to the second global line.
    • 根据一个实施例,存储器件包括存储器单元,读出放大器,单元结构和参考信号发生器。 每个结构包括第一端,第一晶体管,第一局部线,可变电阻元件,第二晶体管,第二本地线和串联耦合的第三晶体管。 参考信号发生器包括第一至第四全局线,以及第一和第二单元结构。 第一单元结构在第一端耦合到第一全局线并且在第二端耦合到第三全局线。 第二单元结构在第一端耦合到第四全局线并且在第二端耦合到第二全局线。
    • 8. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE
    • 半导体存储器件
    • US20100103718A1
    • 2010-04-29
    • US12559335
    • 2009-09-14
    • Yoshiaki ASAOTakeshi KAJIYAMATsuneo INABA
    • Yoshiaki ASAOTakeshi KAJIYAMATsuneo INABA
    • G11C11/00G11C5/06G11C11/14
    • G11C11/1659
    • A semiconductor memory device includes first and second bit line provided in the same level layer above a semiconductor substrate, a first variable-resistance element disposed under the first bit line, having one terminal connected to one end of a current path of a first MOSFET, a second variable-resistance element disposed under the second bit line, and having one terminal connected to one end of a current path of a second MOSFET, a first interconnect layer connecting the first bit line to the other terminal of the first variable-resistance element, and connecting the first bit line to the other end of the current path of the second MOSFET, and a second interconnect layer connecting the second bit line to the other terminal of the second variable-resistance element, and connecting the second bit line to the other end of the current path of the first MOSFET.
    • 半导体存储器件包括设置在半导体衬底上的同一电平层中的第一和第二位线,设置在第一位线下方的第一可变电阻元件,其一端连接到第一MOSFET的电流通路的一端, 第二可变电阻元件,设置在第二位线下方,并且具有连接到第二MOSFET的电流通路的一端的一个端子,将第一位线连接到第一可变电阻元件的另一端子的第一互连层 并且将第一位线连接到第二MOSFET的电流路径的另一端,以及将第二位线连接到第二可变电阻元件的另一端的第二互连层,并将第二位线连接到第二位线 第一个MOSFET的电流通路的另一端。
    • 9. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE AND REDUNDANCY METHOD THEREFOR
    • 半导体存储器件及其冗余方法
    • US20100008125A1
    • 2010-01-14
    • US12414083
    • 2009-03-30
    • Tsuneo INABA
    • Tsuneo INABA
    • G11C11/00G11C29/00
    • G11C5/02G11C13/00G11C13/0004G11C13/0007G11C13/0011G11C29/025G11C2213/71G11C2213/72
    • A memory cell array is formed by arranging memory cells at intersections of plural first wirings and plural second wirings, and a rectifying element and a variable resistive element are connected in series in the memory cell. The variable resistive element has at least a first resistance value and a second resistance value that is higher than the first resistance value. The control circuit selectively drives the first wirings and the second wirings. The control circuit can perform a short-circuit failure countermeasure program operation. In the short-circuit failure countermeasure program operation, the variable resistive element of the memory cell whose rectifying element is in a short-circuit failure state is programmed from the first resistance value to the second resistance value.
    • 存储单元阵列通过在多个第一布线和多个第二布线的交叉处布置存储单元而形成,并且整流元件和可变电阻元件串联连接在存储单元中。 可变电阻元件具有比第一电阻值高的至少第一电阻值和第二电阻值。 控制电路选择性地驱动第一布线和第二布线。 控制电路可以执行短路故障对策程序操作。 在短路故障对策编程动作中,将整流元件处于短路故障状态的存储单元的可变电阻元件从第一电阻值编程为第二电阻值。
    • 10. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE
    • 半导体存储器件
    • US20110069534A1
    • 2011-03-24
    • US12883019
    • 2010-09-15
    • Tsuneo INABA
    • Tsuneo INABA
    • G11C11/00
    • G11C11/16G11C7/18G11C11/1657G11C11/1659Y10S977/935
    • According to one embodiment, a semiconductor memory device includes bit line pairs extending in a column direction, each of the bit line pairs includes a first bit line and a second bit line, and memory cell groups connected to the bit line pairs, respectively, and each includes memory cells. Each of the memory cells comprises a first transistor, a second transistor and a resistive memory element. One end of the resistive memory element is connected to the first bit line. A drain region of the first transistor and a drain region of the second transistor are connected to each other and connected to the other end of the resistive memory element. A source region of the first transistor and a source region of the second transistor are connected to the second bit line.
    • 根据一个实施例,半导体存储器件包括沿列方向延伸的位线对,每个位线对包括第一位线和第二位线,以及分别连接到位线对的存储单元组,以及 每个都包含存储单元。 每个存储单元包括第一晶体管,第二晶体管和电阻存储元件。 电阻性存储元件的一端连接到第一位线。 第一晶体管的漏极区域和第二晶体管的漏极区域彼此连接并连接到电阻存储元件的另一端。 第一晶体管的源极区域和第二晶体管的源极区域连接到第二位线。