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1. 发明申请

US20140034369A1 WIRING SUBSTRATE, MULTI-PIECE WIRING SUBSTRATE, AND METHOD FOR PRODUCING SAME 有权
标题翻译：配线基板，多层接线基板及其制造方法
公开(公告)号：US20140034369A1
公开(公告)日：2014-02-06
申请号：US14110680
申请日：2012-02-01
申请人： Masami Hasegawa , Satoshi Hirayama , Naoki Kito
发明人： Masami Hasegawa , Satoshi Hirayama , Naoki Kito
IPC分类号： H05K1/02 , H05K3/10
CPC分类号： H05K1/02 , H05K1/0306 , H05K3/0029 , H05K3/0052 , H05K3/10 , H05K2201/0909 , H05K2201/09154 , H05K2203/1476 , Y10T29/49162
摘要： Provided are a ceramic wiring substrate having a side surface which realizes reliable chucking or hooking; a multi-piece wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the multi-piece wiring substrate array. The wiring substrate is formed of a ceramic material, has a square (rectangular) shape in plan view, and which has a front surface, a back surface, and side surfaces each being located between the front surface and the back surface, wherein each side surface has a belt-like uneven surface including a plurality of alternate and parallel convex portions and concave portions which are formed so as to extend along the front surface, and also has a fracture surface located on a side toward the back surface.
摘要翻译：提供一种陶瓷布线基板，其具有能够可靠地夹持或钩挂的侧面; 用于提供多个布线基板的多片式布线基板阵列; 以及可靠地制造多片式布线基板阵列的方法。布线基板由陶瓷材料形成，在平面图中具有正方形（矩形）形状，并且具有前表面，后表面和位于前表面和后表面之间的侧表面，其中每个侧面表面具有带状的不平坦表面，该表面包括多个交替平行的凸起部分和形成为沿前表面延伸的凹部，并且还具有位于背面侧的断裂面。

2. 发明申请

US20150107879A1 WIRING SUBSTRATE, MULTI-PIECE WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：配线基板，多层接线基板及其制造方法
公开(公告)号：US20150107879A1
公开(公告)日：2015-04-23
申请号：US14000568
申请日：2012-02-01
申请人： Masami Hasegawa , Satoshi Hirayama , Naoki Kito
发明人： Masami Hasegawa , Satoshi Hirayama , Naoki Kito
IPC分类号： H05K1/03 , C04B41/00 , H05K1/14
CPC分类号： H05K1/0306 , C04B41/0036 , H01L23/10 , H01L23/13 , H01L23/15 , H01L23/49805 , H01L2924/0002 , H05K1/14 , H05K3/0029 , H05K3/0052 , H05K3/0097 , H05K3/403 , H05K2201/017 , H05K2201/09036 , H05K2201/09045 , H05K2201/0909 , H05K2201/09154 , H01L2924/00
摘要： A wiring substrate includes a substrate main body which is formed of a ceramic laminate and has a rectangular shape in plan view, and which has a front surface and a back surface and has four side surfaces, each being located between the front surface and the back surface, and having a groove surface located on a side toward the front surface and a fracture surface located on a side toward the back surface; and a metalized layer which is formed on the front surface of the substrate main body so as to extend along the four side surfaces, and which has a rectangular frame shape in plan view, wherein a horizontal surface of the ceramic laminate of the substrate main body is exposed between the metalized layer and the groove surface of each side surface of the substrate main body.
摘要翻译：布线基板包括由陶瓷层叠体形成的矩阵形状的基板主体，并且具有前表面和后表面，并且具有四个侧表面，每个侧表面位于前表面和背面之间表面，并且具有位于朝向前表面的一侧的凹槽表面和位于朝向后表面的一侧的断裂表面; 以及金属化层，其形成在所述基板主体的前表面上，以便沿着所述四个侧表面延伸，并且在平面图中具有矩形框架形状，其中所述基板主体的陶瓷层叠体的水平表面在金属化层与基板主体的各侧面的槽面之间露出。

3. 发明授权

US08987604B2 Wiring substrate, multi-piece wiring substrate, and method for producing same 有权
标题翻译：布线基板，多片布线基板及其制造方法
公开(公告)号：US08987604B2
公开(公告)日：2015-03-24
申请号：US14110680
申请日：2012-02-01
申请人： Masami Hasegawa , Satoshi Hirayama , Naoki Kito
发明人： Masami Hasegawa , Satoshi Hirayama , Naoki Kito
IPC分类号： H05K1/03 , H05K1/02 , H05K3/00 , H05K3/10
CPC分类号： H05K1/02 , H05K1/0306 , H05K3/0029 , H05K3/0052 , H05K3/10 , H05K2201/0909 , H05K2201/09154 , H05K2203/1476 , Y10T29/49162
摘要： Provided are a ceramic wiring substrate having a side surface which realizes reliable chucking or hooking; a multi-piece wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the multi-piece wiring substrate array. The wiring substrate is formed of a ceramic material, has a square (rectangular) shape in plan view, and which has a front surface, a back surface, and side surfaces each being located between the front surface and the back surface, wherein each side surface has a belt-like uneven surface including a plurality of alternate and parallel convex portions and concave portions which are formed so as to extend along the front surface, and also has a fracture surface located on a side toward the back surface.
摘要翻译：提供一种陶瓷布线基板，其具有能够可靠地夹持或钩挂的侧面; 用于提供多个布线基板的多片式布线基板阵列; 以及可靠地制造多片式布线基板阵列的方法。布线基板由陶瓷材料形成，在平面图中具有正方形（矩形）形状，并且具有前表面，后表面和位于前表面和后表面之间的侧表面，其中每个侧面表面具有带状的不平坦表面，该表面包括多个交替平行的凸起部分和形成为沿着前表面延伸的凹部，并且还具有位于背面侧的断裂面。

4. 发明授权

US09295151B2 Wiring substrate, multi-piece wiring substrate, and method for manufacturing same 有权
标题翻译：布线基板，多片布线基板及其制造方法
公开(公告)号：US09295151B2
公开(公告)日：2016-03-22
申请号：US14000568
申请日：2012-02-01
申请人： Masami Hasegawa , Satoshi Hirayama , Naoki Kito
发明人： Masami Hasegawa , Satoshi Hirayama , Naoki Kito
IPC分类号： H05K1/03 , H05K3/00 , H05K3/40 , H01L23/13 , H01L23/10 , H01L23/498 , C04B41/00 , H05K1/14 , H01L23/15
CPC分类号： H05K1/0306 , C04B41/0036 , H01L23/10 , H01L23/13 , H01L23/15 , H01L23/49805 , H01L2924/0002 , H05K1/14 , H05K3/0029 , H05K3/0052 , H05K3/0097 , H05K3/403 , H05K2201/017 , H05K2201/09036 , H05K2201/09045 , H05K2201/0909 , H05K2201/09154 , H01L2924/00
摘要： A wiring substrate includes a substrate main body which is formed of a ceramic laminate and has a rectangular shape in plan view, and which has a front surface and a back surface and has four side surfaces, each being located between the front surface and the back surface, and having a groove surface located on a side toward the front surface and a fracture surface located on a side toward the back surface; and a metalized layer which is formed on the front surface of the substrate main body so as to extend along the four side surfaces, and which has a rectangular frame shape in plan view, wherein a horizontal surface of the ceramic laminate of the substrate main body is exposed between the metalized layer and the groove surface of each side surface of the substrate main body.
摘要翻译：布线基板包括由陶瓷层叠体形成的矩阵形状的基板主体，并且具有前表面和后表面，并且具有四个侧表面，每个侧表面位于前表面和背面之间表面，并且具有位于朝向前表面的一侧的凹槽表面和位于朝向后表面的一侧的断裂表面; 以及金属化层，其形成在所述基板主体的前表面上，以便沿着所述四个侧表面延伸，并且在平面图中具有矩形框架形状，其中所述基板主体的陶瓷层叠体的水平表面在金属化层与基板主体的各侧面的槽面之间露出。

5. 发明授权

US08952269B2 Wiring substrate, multi-piece wiring substrate array, and manufacturing method therefor 有权
标题翻译：布线基板，多片布线基板阵列及其制造方法
公开(公告)号：US08952269B2
公开(公告)日：2015-02-10
申请号：US14111486
申请日：2012-02-01
申请人： Masami Hasegawa , Satoshi Hirayama , Naoki Kito
发明人： Masami Hasegawa , Satoshi Hirayama , Naoki Kito
IPC分类号： H05K1/11 , B32B3/00 , H05K1/03 , H05K3/00 , H05K3/38 , H05K3/40
CPC分类号： H05K1/0306 , H05K1/113 , H05K3/0044 , H05K3/0052 , H05K3/381 , H05K3/403 , H05K2201/0909 , H05K2201/09181 , H05K2201/09845 , H05K2203/107 , Y10T29/49124 , Y10T428/24479 , Y10T428/24612
摘要： Provided are a wiring substrate; a multi-piece wiring substrate array; and a method for reliably producing the multi-piece wiring substrate array. The wiring substrate includes a substrate main body, which has first and second main surfaces, side surfaces, a groove surface, and a fracture surface; and a notch which has a concave shape in plan view, and which is provided on a side surface on a side toward the first main surface, wherein, in the side surface having the notch, the boundary between the groove surface and the fracture surface has first curved portions on opposite sides of the notch, the first curved portions being convex toward the first main surface in side view; and also has a second curved portion on a second-main-surface side of the notch, the second curved portion being convex toward the second main surface of the substrate main body in side view.
摘要翻译：提供布线基板; 多件式布线基板阵列; 以及可靠地制造多片式布线基板阵列的方法。布线基板包括具有第一和第二主表面，侧表面，凹槽表面和断裂表面的基板主体; 以及在平面图中具有凹形的凹口，并且设置在朝向第一主表面的一侧的侧表面上，其中在具有凹口的侧表面中，凹槽表面和断裂面之间的边界具有第一弯曲部分在凹口的相对侧上是第一弯曲部分，在侧视图中朝着第一主表面凸出; 并且在凹口的第二主表面侧上还具有第二弯曲部分，第二弯曲部分在侧视图中朝向基板主体的第二主表面凸出。

6. 发明申请

US20140037912A1 WIRING SUBSTRATE, MULTI-PIECE WIRING SUBSTRATE ARRAY, AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：接线基板，多层接线基板阵列及其制造方法
公开(公告)号：US20140037912A1
公开(公告)日：2014-02-06
申请号：US14111486
申请日：2012-02-01
申请人： Masami Hasegawa , Satoshi Hirayama , Naoki Kito
发明人： Masami Hasegawa , Satoshi Hirayama , Naoki Kito
IPC分类号： H05K1/03 , H05K3/00
CPC分类号： H05K1/0306 , H05K1/113 , H05K3/0044 , H05K3/0052 , H05K3/381 , H05K3/403 , H05K2201/0909 , H05K2201/09181 , H05K2201/09845 , H05K2203/107 , Y10T29/49124 , Y10T428/24479 , Y10T428/24612
摘要： Provided are a wiring substrate; a multi-piece wiring substrate array; and a method for reliably producing the multi-piece wiring substrate array. The wiring substrate includes a substrate main body, which has first and second main surfaces, side surfaces, a groove surface, and a fracture surface; and a notch which has a concave shape in plan view, and which is provided on a side surface on a side toward the first main surface, wherein, in the side surface having the notch, the boundary between the groove surface and the fracture surface has first curved portions on opposite sides of the notch, the first curved portions being convex toward the first main surface in side view; and also has a second curved portion on a second-main-surface side of the notch, the second curved portion being convex toward the second main surface of the substrate main body in side view.
摘要翻译：提供布线基板; 多件式布线基板阵列; 以及可靠地制造多片式布线基板阵列的方法。布线基板包括具有第一和第二主表面，侧表面，凹槽表面和断裂表面的基板主体; 以及在平面图中具有凹形的凹口，并且设置在朝向第一主表面的一侧的侧表面上，其中在具有凹口的侧表面中，凹槽表面和断裂面之间的边界具有第一弯曲部分在凹口的相对侧上是第一弯曲部分，在侧视图中朝着第一主表面凸出; 并且在凹口的第二主表面侧上还具有第二弯曲部分，第二弯曲部分在侧视图中朝向基板主体的第二主表面凸出。

7. 发明授权

US09232643B2 Ceramic wiring board, multi-piece ceramic wiring board, and method for producing same 有权
标题翻译：陶瓷接线板，多片陶瓷接线板及其制造方法
公开(公告)号：US09232643B2
公开(公告)日：2016-01-05
申请号：US14006047
申请日：2012-02-01
申请人： Masami Hasegawa , Satoshi Hirayama , Naoki Kito
发明人： Masami Hasegawa , Satoshi Hirayama , Naoki Kito
IPC分类号： H05K1/00 , H05K1/03 , H05K3/10 , H05K1/02 , H05K3/00 , H05K3/46 , H05K3/40
CPC分类号： H05K1/0298 , H05K1/0306 , H05K3/0029 , H05K3/0052 , H05K3/403 , H05K3/46 , H05K2201/0909 , H05K2201/09154 , H05K2201/09181 , H05K2203/0346 , Y10T29/49155
摘要： Provided are a ceramic wiring substrate; a multi-piece ceramic wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the wiring substrate array. The ceramic wiring substrate includes a substrate main body, which has a front surface, a back surface, side surfaces, a groove surface located on a side toward the front surface, and a fracture surface located on a side toward the back surface; and a notch which has a concave shape in plan view, and which is provided on at least one of the side surfaces so as to extend between the front surface and the back surface, wherein, in the side surface having the notch, the boundary between the groove surface and the fracture surface has curved portions on opposite sides of the notch, the curved portions being convex toward the front surface of the substrate main body in side view.
摘要翻译：提供一种陶瓷布线基板; 用于提供多个布线基板的多片陶瓷布线基板阵列; 以及可靠地制造布线基板阵列的方法。陶瓷布线基板包括：基板主体，具有前表面，后表面，侧面，位于前表面侧的槽表面和位于背面侧的断裂面; 以及在平面图中具有凹形形状的凹口，并且设置在至少一个侧面上，以便在前表面和后表面之间延伸，其中在具有凹口的侧表面中，凹槽表面和断裂表面在凹口的相对侧上具有弯曲部分，弯曲部分在侧视图中朝向基板主体的前表面凸出。

8. 发明申请

US20140034372A1 CERAMIC WIRING BOARD, MULTI-PIECE CERAMIC WIRING BOARD, AND METHOD FOR PRODUCING SAME 有权
标题翻译：陶瓷接线板，多层陶瓷接线板及其制造方法
公开(公告)号：US20140034372A1
公开(公告)日：2014-02-06
申请号：US14006047
申请日：2012-02-01
申请人： Masami Hasegawa , Satoshi Hirayama , Naoki Kito
发明人： Masami Hasegawa , Satoshi Hirayama , Naoki Kito
IPC分类号： H05K1/02 , H05K3/46
CPC分类号： H05K1/0298 , H05K1/0306 , H05K3/0029 , H05K3/0052 , H05K3/403 , H05K3/46 , H05K2201/0909 , H05K2201/09154 , H05K2201/09181 , H05K2203/0346 , Y10T29/49155
摘要： Provided are a ceramic wiring substrate; a multi-piece ceramic wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the wiring substrate array. The ceramic wiring substrate includes a substrate main body, which has a front surface, a back surface, side surfaces, a groove surface located on a side toward the front surface, and a fracture surface located on a side toward the back surface; and a notch which has a concave shape in plan view, and which is provided on at least one of the side surfaces so as to extend between the front surface and the back surface, wherein, in the side surface having the notch, the boundary between the groove surface and the fracture surface has curved portions on opposite sides of the notch, the curved portions being convex toward the front surface of the substrate main body in side view.
摘要翻译：提供一种陶瓷布线基板; 用于提供多个布线基板的多片陶瓷布线基板阵列; 以及可靠地制造布线基板阵列的方法。陶瓷布线基板包括：基板主体，具有前表面，后表面，侧面，位于前表面侧的槽表面和位于背面侧的断裂面; 以及在平面图中具有凹形形状的凹口，并且设置在至少一个侧面上，以便在前表面和后表面之间延伸，其中在具有凹口的侧表面中，凹槽表面和断裂表面在凹口的相对侧上具有弯曲部分，弯曲部分在侧视图中朝向基板主体的前表面凸出。

9. 发明授权

US6139904A Method of making a printed board 有权
标题翻译：制作印刷电路板的方法
公开(公告)号：US6139904A
公开(公告)日：2000-10-31
申请号：US422119
申请日：1999-10-20
申请人： Kozo Yamasaki , Osamu Hisada , Katsuhiko Hasegawa , Naoki Kito , Satoshi Hirano , Yutaro Kameyama
发明人： Kozo Yamasaki , Osamu Hisada , Katsuhiko Hasegawa , Naoki Kito , Satoshi Hirano , Yutaro Kameyama
IPC分类号： H05K3/00 , H05K3/12 , H05K3/28 , H05K3/40 , H05K3/42 , H05K3/46 , B05D5/12
CPC分类号： H05K3/4069 , H05K3/0094 , H05K2201/0355 , H05K2201/09509 , H05K2201/0959 , H05K2201/09909 , H05K2203/0191 , H05K2203/025 , H05K2203/0554 , H05K3/1216 , H05K3/1225 , H05K3/429
摘要： A method of making a printed board is provided. The printed board has a base provided with a plurality of through via conductors having through holes extending completely between upper and lower surfaces of the base and closed by resin fillings and a plurality of blind via conductors having depressions closed by resin fillings. The method comprises the steps of preparing the base provided with the through via conductors having the through holes and the blind via conductors having the depressions, filling the through holes of the through via conductors and the depressions of the blind via conductors with resin paste by printing, while at the same time forming, on an upper surface of the base and at locations around the through holes of the through via conductors and the depressions of the blind via conductors, a plurality of projections made of the above described resin paste by printing, and curing the resin paste, thereby forming the resin fillings in the through holes of the through via conductors and the depressions of the blind via conductors. By this method, the upper surfaces of the resin fillings in the through holes and the depressions are not caused to recede or sink and become lower in level than the upper surface of the base but can be maintained higher in level than the upper surface of the base, thus making it possible to dispense with a manufacturing step for closing receding spaces and manufacture the printed board at lower cost.
摘要翻译：提供制造印刷电路板的方法。印刷电路板具有设置有多个通孔导体的底座，其具有完全在基底的上表面和下表面之间延伸并且被树脂填充物封闭的通孔，以及多个通过树脂填充物封闭的凹陷的盲孔通孔导体。该方法包括以下步骤：制备具有通孔的通孔的底座和具有凹陷的盲通孔导体，通过印刷填充通孔导体的通孔和盲孔通孔的凹陷同时在基底的上表面和贯通通孔导体的通孔周围的位置和盲通孔导体的凹陷处形成多个由上述树脂浆料制成的突起，并固化树脂膏，从而在通孔导体的通孔和盲通孔导体的凹陷中形成树脂填充物。通过这种方法，通孔中的树脂填充物的上表面和凹部不会比底座的上表面下降或下降而变低，而是可以保持比上表面的水平高从而可以省略用于关闭后退空间的制造步骤，并以较低的成本制造印刷电路板。

10. 发明授权

US06674017B1 Multilayer-wiring substrate and method for fabricating same 有权
标题翻译：多层布线基板及其制造方法
公开(公告)号：US06674017B1
公开(公告)日：2004-01-06
申请号：US09471332
申请日：1999-12-23
申请人： Kozo Yamasaki , Osamu Hisada , Katsuhiko Hasegawa , Naoki Kito , Satoshi Hirano
发明人： Kozo Yamasaki , Osamu Hisada , Katsuhiko Hasegawa , Naoki Kito , Satoshi Hirano
IPC分类号： H01R1204
CPC分类号： H05K3/421 , H05K3/0023 , H05K3/0035 , H05K3/0055 , H05K3/426 , H05K3/4602 , H05K2201/096 , H05K2201/09745 , H05K2203/0353 , Y10T29/49156 , Y10T29/49167
摘要： A multilayer-wiring substrate having a via hole structure and method for fabricating the same. Referring to FIGS. 1(a) and 1(b), after a via-hole 5 is formed by exposure and development in lithography or by laser-drilling, a bottom portion of the via-hole 5 is subjected to resin-etching so as to expose a surface 4A of a lower conductor 4 as shown in FIG. 3(b). The exposed surface 4A of the lower conductor 4 is chemically etched so that the conductor 4 is undercut. As a result, undesired material 5B such as adhered residual resin shown in FIG. 3(b) is completely removed. In etching the conductor 4 at the bottom of the via hole 5, the lower conductor 4 is preferably etched in an amount of 5-30% of the thickness of the lower conductor 4 to form a depression or recess 6A at a via hole bottom 5C as shown in FIG. 3(b), thereby reliably establishing electrical continuity between the lower conductor 4 and the upper conductor 8 by means of a via-hole conductor 7 as shown in FIG. 3(c).
摘要翻译：具有通孔结构的多层布线基板及其制造方法。参见图如图1（a）和（b）所示，在通过曝光和显影在光刻或激光钻孔中形成通孔5之后，对通孔5的底部进行树脂蚀刻，以暴露如图1所示的下导体4的表面4A。 3（b）。对下导体4的暴露表面4A进行化学蚀刻，使得导体4被切削。结果，不希望的材料5B，如图1所示的残留树脂。 3（b）被完全去除。在对通孔5的底部的导体4进行蚀刻时，下导体4优选以下导体4的厚度的5-30％的量蚀刻，以在通孔底部5C形成凹部或凹部6A 如图1所示。如图3（b）所示，从而通过通孔导体7可靠地建立下导体4和上导体8之间的电连续性，如图3（b）所示。图3（c）。

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