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1. 发明授权

US10544994B2 Sheet-shaped heat pipe 有权
公开(公告)号：US10544994B2
公开(公告)日：2020-01-28
申请号：US15712175
申请日：2017-09-22
申请人： Murata Manufacturing Co., Ltd.
发明人： Takuo Wakaoka , Atsushi Kishimoto , Tadamasa Miura
IPC分类号： F28D15/02 , F28D15/04 , F28F21/08 , H01L23/427 , F28D21/00 , F28D20/00
摘要： A sheet-shaped heat pipe includes a sheet-shaped container, a wick sealed in the container, and a working fluid sealed in the container, the sheet-shaped container including a first metal sheet and a second metal sheet, the first metal sheet and the second metal sheet being superposed in direct contact with each other at a peripheral edge portion, and the sheet-shaped container having a thickness of about 0.5 mm or less, and a thin heat dissipating plate that includes the sheet-shaped heat pipe.

2. 发明授权

US09797781B2 Thermistor device 有权
公开(公告)号：US09797781B2
公开(公告)日：2017-10-24
申请号：US14683211
申请日：2015-04-10
申请人： Murata Manufacturing Co., Ltd.
发明人： Tadamasa Miura , Shuichi Kawata , Yuki Yamamoto
IPC分类号： H01C7/10 , G01K7/22 , H01C7/02 , H01C7/04 , H01C1/14 , H01C1/012 , H01C7/00 , H01M2/34 , H01M10/48 , H01M10/0525
CPC分类号： G01K7/22 , H01C1/012 , H01C1/14 , H01C1/1406 , H01C1/1413 , H01C7/008 , H01C7/02 , H01C7/04 , H01M2/348 , H01M10/0525 , H01M10/486 , H01M2200/10
摘要： In order to further improve stress tolerance, a thermistor device includes a first base material member made of resin, a thermistor element including a thermistor thin film provided on a metal base material and first and second external electrodes provided on the thermistor thin film, and a first lead electrode and a second lead electrode provided on a principal surface of the first base material member, and connected to the first external electrode and the second external electrode. Each of the metal base material and the thermistor thin film undergoes a deflection between the first external electrode and the second external electrode.

3. 发明授权

US09373431B2 NTC thermistor element and method and method for producing the same 有权
标题翻译： NTC热敏电阻元件及其制造方法和方法
公开(公告)号：US09373431B2
公开(公告)日：2016-06-21
申请号：US14519210
申请日：2014-10-21
申请人： MURATA MANUFACTURING CO., LTD.
发明人： Hiroshi Ikeda , Tadamasa Miura
IPC分类号： H01C7/00 , H01C1/14 , H01C7/04 , H01C17/06
CPC分类号： H01C1/1413 , H01C7/04 , H01C7/042 , H01C17/06 , Y10T29/49085
摘要： A NTC thermistor element that includes a substrate composed of a ceramic material containing Mn, Ni, Fe and Ti; and a pair of external electrodes on the substrate. When the molar amount of Mn in the substrate is a [mol %] and the molar amount of Ni in the substrate is b [mol %], a and b satisfy a+b=100, 44.90≦a≦65.27 and 34.73≦b≦55.10. When the molar amount of Fe is c [mol %] and the molar amount of Ti is d [mol %], c and d satisfy 24.22≦c≦39.57 and 5.04≦d≦10.18 based on a+b=100.
摘要翻译：一种NTC热敏电阻元件，其包括由含有Mn，Ni，Fe和Ti的陶瓷材料构成的基板; 以及基板上的一对外部电极。当基板中的Mn的摩尔量为[mol％]且基板中的Ni的摩尔量为b [mol％]时，a和b满足a + b = 100,44.90和nlE; a＆nlE; 65.27和34.73＆ ; b＆nlE; 55.10。当Fe的摩尔量为c [mol％]且Ti的摩尔量为d [mol％]时，c和d满足24.22＆nlE; c＆nlE; 39.57和5.04＆nlE; d＆nlE; 10.18，基于a + b = 100。

4. 发明申请

US20130221584A1 THERMISTOR AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：热敏电阻及其制造方法
公开(公告)号：US20130221584A1
公开(公告)日：2013-08-29
申请号：US13858128
申请日：2013-04-08
申请人： MURATA MANUFACTURING CO., LTD.
发明人： Tadamasa Miura
IPC分类号： H01C17/00
CPC分类号： H01C17/00 , G01K7/22 , H01C1/1413 , H01C1/142 , H01C7/008 , H01C7/04 , H01C17/065 , H01C17/281 , Y10T29/49085
摘要： An NTC thermistor having a metal base material, a thermistor film layer formed on the metal base material, and a pair of split electrodes formed on the thermistor film layer. A ceramic slurry is applied onto a carrier film to form the thermistor film layer, a metal powder containing paste is applied onto the thermistor film layer to form the metal base material, and further an electrode paste is applied onto the metal base material to form the split electrodes. Thereafter, the three substances are integrally fired.
摘要翻译：具有金属基材的NTC热敏电阻，形成在金属基材上的热敏电阻膜层和形成在热敏电阻膜层上的一对分裂电极。将陶瓷浆料施加到载体膜上以形成热敏电阻膜层，将含金属粉末的糊剂施加到热敏电阻膜层上以形成金属基材，并且还将电极浆料施加到金属基材上以形成分离电极。此后，三种物质被整体烧制。

5. 发明授权

US10420252B2 Electronic apparatus 有权
公开(公告)号：US10420252B2
公开(公告)日：2019-09-17
申请号：US15163222
申请日：2016-05-24
申请人： Murata Manufacturing Co., Ltd. , National University Corporation Chiba University
发明人： Tadamasa Miura , Yoshiyuki Yamashita , Hironao Ogura
IPC分类号： H05K7/20 , F28D20/00 , H01L23/427
摘要： Provided is an electronic apparatus that makes it possible to improve a heat transfer property from a heat generating element to a heat storage material. The electronic apparatus is provided with a heat generating element and a heat storage device for storing heat generated by the heat generating element. The heat storage device includes a reaction chamber containing a heat storage material for absorbing the heat generated by the heat generating element. The reaction chamber is defined by a first surface, a second surface opposed to the first surface, and a plurality of side surfaces connecting the first surface with the second surface. In the reaction chamber, a thermal conductivity of a peripheral part is smaller than a thermal conductivity of a central part of the reaction chamber.

6. 发明授权

US09831018B2 Electronic component 有权
公开(公告)号：US09831018B2
公开(公告)日：2017-11-28
申请号：US14937969
申请日：2015-11-11
申请人： Murata Manufacturing Co., Ltd.
发明人： Hiroshi Ikeda , Tadamasa Miura , Kiyohiro Koto
IPC分类号： H01C7/00 , H01C7/04 , H01C7/02 , H01C7/10
CPC分类号： H01C7/006 , H01C7/021 , H01C7/041 , H01C7/1013
摘要： An electronic component in which a metal layer is unlikely to be peeled from a substrate includes an insulating ceramic substrate, a ceramic layer diffusion-bonded to the substrate, a metal layer including a first principal surface and a second principal surface opposed to the first principal surface, with the first principal surface diffusion-bonded to the ceramic layer, and a characteristic layer diffusion-bonded to the second principal surface of the metal layer and prepared from a ceramic material, wherein the characteristic layer varies in resistance value with respect to ambient temperature or applied voltage.

7. 发明授权

US09184362B2 Electronic-component mounting structure 有权
标题翻译：电子部件安装结构
公开(公告)号：US09184362B2
公开(公告)日：2015-11-10
申请号：US13966317
申请日：2013-08-14
申请人： Murata Manufacturing Co., Ltd.
发明人： Tadamasa Miura
IPC分类号： H01L23/12 , H01L35/02 , H01C1/014 , H01C1/14 , H01C7/00 , H01C1/144 , H01L23/00
CPC分类号： H01L35/02 , H01C1/014 , H01C1/14 , H01C1/1406 , H01C1/1413 , H01C1/144 , H01C7/008 , H01L24/16 , H01L2924/00013 , H01L2924/0002 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
摘要： An electronic-component mounting structure includes an electronic component which includes a metal substrate, a semiconductor ceramic layer located on the metal substrate, a pair of split electrodes located on the semiconductor ceramic layer, and plating films located on the split electrodes and the metal substrate, and a mounting body on which lands to be connected to the respective split electrodes of the electronic component are provided. The position of a peripheral end portion of each land to be connected to the corresponding split electrode is located farther inside than the position of a peripheral end portion of the split electrode. In addition, a plane area of the land is smaller than that of the split electrode.
摘要翻译：一种电子部件安装结构，包括电子部件，其包括金属基板，位于金属基板上的半导体陶瓷层，位于半导体陶瓷层上的一对分裂电极以及位于分割电极和金属基板上的镀膜以及安装体，其上设置有与电子部件的各个分割电极连接的焊盘。要连接到相应的分裂电极的每个焊盘的外围端部的位置位于比分裂电极的外周端部的位置更远的位置。此外，焊盘的平面面积小于分割电极的平面面积。

8. 发明授权

US08624703B2 Semiconductor ceramic element and method for producing same 有权
标题翻译：半导体陶瓷元件及其制造方法
公开(公告)号：US08624703B2
公开(公告)日：2014-01-07
申请号：US13794852
申请日：2013-03-12
申请人： Murata Manufacturing Co., Ltd.
发明人： Tadamasa Miura
IPC分类号： H01C7/10
CPC分类号： H01C7/008 , G01K7/16 , H01C7/021 , H01C7/041 , H01C7/06 , H01C7/18 , H01L28/24
摘要： A semiconductor ceramic element includes an element main body where a PTC section including a semiconductor ceramic which has PTC characteristics and an NTC section including a semiconductor ceramic which has NTC characteristics are integrated by co-firing while suppressing interdiffusion. The element main body is formed in such a way that a PTC substrate is first obtained by firing a semiconductor ceramic material to serve as the PTC section at a predetermined temperature, and a paste containing a semiconductor ceramic material to serve as the NTC section is then applied or printed on the PTC substrate, followed by co-firing at a temperature lower than the predetermined temperature.
摘要翻译：半导体陶瓷元件包括元件主体，其中包括具有PTC特性的半导体陶瓷的PTC部分和包括具有NTC特性的半导体陶瓷的NTC部分通过共同烧制而被一体化，同时抑制相互扩散。元件主体以这样的方式形成，首先通过在预定温度下烧制半导体陶瓷材料作为PTC部分而获得PTC基板，然后将含有作为NTC部分的半导体陶瓷材料的糊料施加或印刷在PTC基板上，随后在低于预定温度的温度下共烧。

9. 发明授权

US09153762B2 Electronic component package structure 有权
标题翻译：电子元件封装结构
公开(公告)号：US09153762B2
公开(公告)日：2015-10-06
申请号：US13966514
申请日：2013-08-14
申请人： Murata Manufacturing Co., Ltd.
发明人： Tadamasa Miura
IPC分类号： H01L31/058 , H01L35/02 , H01C7/00 , H01L35/34 , H01C1/012 , H01C17/065 , H01C7/04 , H01C1/14 , H01C1/142
CPC分类号： H01L35/02 , H01C1/012 , H01C1/1413 , H01C1/142 , H01C7/008 , H01C7/04 , H01C7/042 , H01C17/06533 , H01L35/34
摘要： A thermistor includes a metal substrate, a semiconductor ceramic layer on the metal substrate, and a pair of split electrodes on the semiconductor layer. The semiconductor ceramic layer is formed by a solid-phase method. The metal substrate includes ceramic particles and is not interrupted in the direction of thickness by the ceramic particles or a pillar defined by a chain of the ceramic particles. Preferably, the metal substrate and the ceramic layer of the thermistor have a thickness of about 10 μm to about 80 μm and about 1 μm to about 10 μm, respectively.
摘要翻译：热敏电阻包括金属基板，金属基板上的半导体陶瓷层和半导体层上的一对分裂电极。半导体陶瓷层通过固相法形成。金属基材包括陶瓷颗粒，并且不会被陶瓷颗粒或由陶瓷颗粒链形成的柱子在厚度方向上中断。优选地，热敏电阻的金属基板和陶瓷层分别具有约10μm至约80μm和约1μm至约10μm的厚度。

10. 发明申请

US20150070127A1 NTC THERMISTOR ELEMENT AND METHOD AND METHOD FOR PRODUCING THE SAME 有权
标题翻译： NTC热敏元件及其制造方法及方法
公开(公告)号：US20150070127A1
公开(公告)日：2015-03-12
申请号：US14519210
申请日：2014-10-21
申请人： MURATA MANUFACTURING CO., LTD.
发明人： Hiroshi Ikeda , Tadamasa Miura
IPC分类号： H01C1/14 , H01C17/06 , H01C7/04
CPC分类号： H01C1/1413 , H01C7/04 , H01C7/042 , H01C17/06 , Y10T29/49085
摘要： A NTC thermistor element that includes a substrate composed of a ceramic material containing Mn, Ni, Fe and Ti; and a pair of external electrodes on the substrate. When the molar amount of Mn in the substrate is a [mol %] and the molar amount of Ni in the substrate is b [mol %], a and b satisfy a+b=100, 44.90≦a≦65.27 and 34.73≦b≦55.10. When the molar amount of Fe is c [mol %] and the molar amount of Ti is d [mol %], c and d satisfy 24.22≦c≦39.57 and 5.04≦d≦10.18 based on a+b=100.
摘要翻译：一种NTC热敏电阻元件，其包括由含有Mn，Ni，Fe和Ti的陶瓷材料构成的基板; 以及基板上的一对外部电极。当基板中的Mn的摩尔量为[mol％]且基板中的Ni的摩尔量为b [mol％]时，a和b满足a + b = 100,44.90和nlE; a＆nlE; 65.27和34.73＆ ; b＆nlE; 55.10。当Fe的摩尔量为c [mol％]且Ti的摩尔量为d [mol％]时，c和d满足24.22＆nlE; c＆nlE; 39.57和5.04＆nlE; d＆nlE; 10.18，基于a + b = 100。

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