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1. 发明授权

US10478867B2 Treatment liquid supply device using syringe, and wet treatment device 有权
公开(公告)号：US10478867B2
公开(公告)日：2019-11-19
申请号：US15532846
申请日：2015-12-02
申请人： NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
发明人： Shiro Hara , Sommawan Khumpuang , Akio Kobayashi , Takeshi Umino , Sonoko Matsuda
IPC分类号： B08B3/04 , B08B3/08 , B08B3/12 , H01L21/67
摘要： A treatment liquid supply device and a wet treatment device with which an extremely small quantity of the treatment liquid can be accurately supplied, as a method for supplying a treatment liquid to an extremely small wafer of half inch size, including: a syringe that sucks and discharges the treatment liquid; a treatment liquid bottle that is filled with the treatment liquid; a suction hose that has one end connected to the treatment liquid bottle and the other end connected to the syringe, and sucks the treatment liquid inside the treatment liquid bottle to the syringe; a supply hose that has one end connected to an intermediate section of the suction hose and serves to supply, to the surface of the wafer, the treatment liquid discharged by the syringe; and a three-way solenoid valve that controls opening/closing of each of the suction and supply hoses.

2. 发明申请

US20140320840A1 Exposure Apparatus and Exposure Method 有权
标题翻译：曝光装置和曝光方法
公开(公告)号：US20140320840A1
公开(公告)日：2014-10-30
申请号：US14363489
申请日：2012-12-04
申请人： National Institute of Advanced Industrial Science and Technology
发明人： Shiro Hara , Sommawan Khumpuang , Yoshiki Inuzuka , Yasuaki Yokoyama
IPC分类号： G03F7/20 , H01L21/677
CPC分类号： G03F7/70716 , G03F7/2051 , G03F7/70733 , H01L21/677 , H01L21/67733 , H01L21/67736 , H01L21/67796
摘要： To provide a mask aligner that can appropriately manage very small-quantity production and multiproduct production. The present invention is a mask aligner 1 that exposes a wafer W in a predetermined size through a mask M, and has a configuration that includes: a conveying device 5 for conveying the wafer W and the mask M; an exposure stage 3f on which the wafer W conveyed by the conveying device 5 is installed; a mask holder 3b that is mounted to face the exposure stage 3f and on which the mask M conveyed by the conveying device 5 is installed; and an LED light source 8c mounted to face the exposure stage 3f via the mask holder 3b.
摘要翻译：提供可以适当地管理非常小批量的生产和多产品生产的掩模对准器。本发明是一种掩模对准器1，其通过掩模M使预定尺寸的晶片W曝光，并具有包括：用于输送晶片W和掩模M的输送装置5; 曝光台3f，其上安装由输送装置5输送的晶片W; 安装在面对曝光台3f并且由传送装置5输送的面罩M安装在其上的面罩座3b; 以及经由掩模保持器3b安装成面向曝光台3f的LED光源8c。

3. 发明授权

US11011403B2 Transport container automatic clamping mechanism 有权
公开(公告)号：US11011403B2
公开(公告)日：2021-05-18
申请号：US16182891
申请日：2018-11-07
申请人： NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY , DESIGN NETWORK CO., LTD.
发明人： Shiro Hara , Hitoshi Maekawa , Hiroyuki Nishihara , Koji Sagisawa
IPC分类号： H01L21/677 , H01L21/673 , H01L21/687
摘要： An automatic clamping mechanism capable of automatically securing and releasing a wafer transport container to or from a manufacturing apparatus and having a small height dimension is provided at low cost. A wafer transport container is placed on a container placing table. A semiconductor wafer is loaded into the manufacturing apparatus main body from a wafer loading port while being placed on a container base part of the wafer transport container. An automatic clamping mechanism generates a press force component in a vertical direction at the wafer transport container and secures the wafer transport container to the container placing table by bringing claw parts of a plurality of clamping claws into contact with an inclined contact surface provided on a container lid part of the wafer transport container and pressing the inclined contact surface in a substantially horizontal direction.

4. 发明授权

US10286426B2 Columnar laminar flow generation device and method for generating columnar laminar flows 有权
公开(公告)号：US10286426B2
公开(公告)日：2019-05-14
申请号：US15260691
申请日：2016-09-09
申请人： NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY , LITHO TECH JAPAN CORPORATION , ORIENTAL MOTOR CO., LTD.
发明人： Shuuji Okuda , Sommawan Khumpuang , Shiro Hara , Sho Takeuchi , Yoshihisa Sensu , Takahiro Ito
IPC分类号： B08B5/02 , B08B15/00 , H01L21/67
摘要： A columnar laminar flow generation device includes: a placement part on which to place a processing target; a gas blow-out part having an opening; and a gas suction path; wherein the placement part is positioned in a space whose outer periphery surface is constituted by extending the interior wall of the opening in the direction vertical to the opening; the opening has, in its interior wall, a gas blow-out port through which a gas is blown out in one direction vertical to the opening; and the gas suction path is formed in such a way that it suctions the gas in the direction opposite to the one in which the gas is blown out. The columnar laminar generation device is capable of generating columnar laminar flows.

5. 发明授权

US10163819B2 Surface mount package and manufacturing method thereof 有权
公开(公告)号：US10163819B2
公开(公告)日：2018-12-25
申请号：US15529072
申请日：2015-11-24
申请人： NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
发明人： Shiro Hara , Sommawan Khumpuang , Fumito Imura , Michihiro Inoue , Arami Saruwatari
IPC分类号： H01L23/00 , H01L23/12 , H01L21/48 , H01L21/56 , H01L23/31 , H01L23/367 , H01L23/538 , H01L23/29
摘要： A method for manufacturing a surface-mount type package whose face parallel with the semiconductor chip surface has a circular cross-section, is characterized by including at least the following steps in this order: a first step in which a semiconductor chip is bonded onto a circular support substrate; a second step in which the semiconductor chip is sealed with resin; a third step in which the resin covering the pads of the semiconductor chip is removed; a fourth step in which a rewiring layer is formed; and a fifth step in which bumps are formed. The method can provide a surface-mount type package for semiconductor chips which is resistant to failures caused by thermal stress.

6. 发明授权

US09524895B2 Substrate transfer antechamber mechanism 有权
标题翻译：基材转移前处理机制
公开(公告)号：US09524895B2
公开(公告)日：2016-12-20
申请号：US14647685
申请日：2013-10-29
申请人： NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
发明人： Shiro Hara , Hitoshi Maekawa
IPC分类号： H01L21/677 , B25J18/02 , B25J9/00
CPC分类号： H01L21/67742 , B25J9/0027 , B25J18/02 , H01L21/67745 , H01L21/67748 , H01L21/67772 , H01L21/67778
摘要： There is provided a substrate transfer antechamber mechanism for a compact manufacturing apparatus that produces various types of devices in small volume using a small-diameter processing substrate at low cost. A container placement table, on which a wafer transfer container housing a semiconductor wafer is placed, is provided on an upper surface of an apparatus antechamber for a compact semiconductor manufacturing apparatus, and the apparatus antechamber includes therein a wafer elevating mechanism and a horizontal transfer mechanism. The wafer elevating mechanism moves down while holding from below a delivery bottom of the wafer transfer container, on which the semiconductor wafer remains placed, to transfer the semiconductor wafer into the apparatus antechamber. The horizontal transfer mechanism transfers the semiconductor wafer into a processing chamber using a transfer arm that receives the semiconductor wafer from the delivery bottom and extends.
摘要翻译：提供了一种用于小型制造装置的基板转移前室机构，其使用小直径处理基板以低成本产生小体积的各种类型的装置。在紧凑型半导体制造装置的装置前厅的上表面上设置有容纳有半导体晶片的晶片转移容器的容器放置台，该装置前后室包括晶片升降机构和水平输送机构。晶片升降机构向下移动，同时保持半导体晶片保持放置的晶片转移容器的输送底部的下方，以将半导体晶片转移到装置前室中。水平传送机构使用从传送底部接收半导体晶片并延伸的传送臂将半导体晶片传送到处理室。

7. 发明授权

US09478452B2 Small production device and production system using the same 有权
标题翻译：小型生产设备和生产系统使用相同
公开(公告)号：US09478452B2
公开(公告)日：2016-10-25
申请号：US14768352
申请日：2014-02-17
申请人： NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
发明人： Shiro Hara , Hitoshi Maekawa , Shizuka Nakano
IPC分类号： H01L21/677 , H01L21/67
CPC分类号： H01L21/67778 , H01L21/67155 , H01L21/67167 , H01L21/67276 , H01L21/67739 , H01L21/67745
摘要： A production system to facilitate the commonization of front chambers among a plurality of production devices that are different in the kind of a process to be performed for a processing substrate.Control units are provided separately in a processing chamber and a front chamber of a small production device. When the processing-chamber control unit outputs a load request signal, the front-chamber control unit loads a processing substrate to the processing chamber, and outputs a load acknowledgment signal. When the load acknowledgment signal is input, the processing-chamber control unit performs a process for the processing substrate, and outputs an unload request signal after the completion of the process. When the unload request signal is input, the front-chamber control unit unloads the processing substrate, and outputs an unload acknowledgment signal. When the unload acknowledgment signal is input, the processing chamber starts the preparation of the next process.
摘要翻译：控制单元分别设置在小型生产装置的处理室和前室中。当处理室控制单元输出负载请求信号时，前室控制单元将处理衬底加载到处理室，并输出负载确认信号。当输入负载确认信号时，处理室控制单元执行处理衬底的处理，并且在完成处理之后输出卸载请求信号。当输入卸载请求信号时，前室控制单元卸载处理基板，并输出卸载确认信号。当输入卸载确认信号时，处理室开始准备下一个处理。

8. 发明授权

US11056410B2 Method of manufacturing semiconductor package using alignment mark on wafer 有权
公开(公告)号：US11056410B2
公开(公告)日：2021-07-06
申请号：US16497283
申请日：2018-03-28
申请人： NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
发明人： Shiro Hara , Sommawan Khumpuang , Fumito Imura
IPC分类号： H01L23/12 , H01L21/56 , H01L21/677 , H01L23/544
摘要： A method of manufacturing a semiconductor package and a semiconductor package in which positional alignment between a wafer and a substrate until the wafer is mounted and packaged on the substrate is achieved accurately. A wafer is mounted on a package substrate by using first alignment marks and D-cuts as benchmarks, and then a mold resin layer is formed on the wafer in a state in which the first alignment mark is exposed. A part of the mold resin layer is removed by using the D-cuts exposed from the mold resin layer as benchmarks, so that the first alignment marks can be visually recognized. A second alignment marks are formed on the mold resin layer by using the first alignment marks as benchmarks. A Cu redistribution layer to be conducted to a pad portion is formed on a mold resin layer by using the second alignment marks as benchmarks.

9. 发明授权

US10332768B2 Compact manufacturing device, and inter-device transport system for production line 有权
公开(公告)号：US10332768B2
公开(公告)日：2019-06-25
申请号：US15531962
申请日：2015-12-01
申请人： NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
发明人： Shiro Hara , Hitoshi Maekawa
IPC分类号： H01L21/677 , H01L21/687
摘要： A compact manufacturing device to automatically transport a wafer transport container. The compact manufacturing device comprises a processing chamber and a device front chamber provided inside a housing, a container mounting table provided in the housing to mount a substrate transport container accommodating a processing substrate, and a container transport mechanism. The container transport mechanism delivers the substrate transport container to the adjacent compact manufacturing device along a container transport path and/or receives the substrate transport container from adjacent compact manufacturing device along the container transport path when a plurality of the compact manufacturing devices are provided in parallel.

10. 发明授权

US10304675B2 System for integrating preceding steps and subsequent steps 有权
公开(公告)号：US10304675B2
公开(公告)日：2019-05-28
申请号：US15531237
申请日：2015-11-16
申请人： NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
发明人： Michihiro Inoue , Shiro Hara , Fumito Imura , Arami Saruwatari , Sommawan Khumpuang
IPC分类号： H01L21/677 , H01L21/673 , H01L21/02 , H01L23/00 , H01L23/544
摘要： A semiconductor manufacturing system has a series of steps, from manufacturing of a semiconductor on a wafer until packaging, that can be easily linked. A semiconductor chip manufacturing device manufactures a semiconductor chip, and a semiconductor packaging device packages the semiconductor chip by attaching the semiconductor chip to a package substrate which is larger than the wafer. The semiconductor chip manufacturing device includes a PLAD system for loading the wafer into and out of the semiconductor chip manufacturing device through a shuttle which is capable of housing the wafer. The semiconductor packaging device includes a PLAD system capable of loading the package substrate into and out of the semiconductor packaging device through a shuttle which is capable of housing the package substrate. The shuttles have container bodies of a same shape.

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