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    • 1. 发明授权
    • Method of manufacturing semiconductor wafers
    • 制造半导体晶圆的方法
    • US09123795B2
    • 2015-09-01
    • US14087883
    • 2013-11-22
    • Fujikoshi Machinery Corp.NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
    • Yoshio NakamuraDaizo IchikawaHaruo SumizawaShiro HaraSommawan KhumpuangShinichi Ikeda
    • H01L21/00H01L21/78
    • H01L21/78H01L21/02005H01L21/02008
    • A method of manufacturing semiconductor wafers which facilitates formation of orientation flat lines and allows beveling work without problems. The method of manufacturing semiconductor wafers includes steps wherein a plurality of small-diameter wafers is cut out from a large-diameter semiconductor wafer, the method including: a marking step of forming straight groove-like orientation flat lines by a laser beam so as to cross the respective small-diameter wafers in each row in the large-diameter semiconductor wafer, wherein cutout positions of the small-diameter wafers are aligned in rows in a specific direction, collectively for each of the rows; and a cutting step of cutting out the small-diameter wafers separately from the large-diameter semiconductor wafer, by a laser beam, after the marking step, in such a way that the orientation flat lines are located at required positions in the small-diameter wafers to be obtained.
    • 一种制造半导体晶片的方法,其有利于形成取向扁平线,并且可以毫无问题地进行斜切加工。 制造半导体晶片的方法包括从大直径半导体晶片切出多个小直径晶片的步骤,该方法包括:标记步骤,通过激光束形成直槽状定向扁平线,以便 跨越大直径半导体晶片中的每行中的各个小直径晶片,其中小直径晶片的切割位置对于每个行共同沿特定方向排成一行; 以及切割步骤,在所述标记步骤之后,通过激光束与所述大直径半导体晶片分开地切割所述小直径晶片,使得所述取向扁平线位于所述小直径的所需位置 要获得的晶圆。