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    • 3. 发明授权
    • MEMS on-chip inertial navigation system with error correction
    • 具有误差校正的MEMS片上惯性导航系统
    • US08151640B1
    • 2012-04-10
    • US12027247
    • 2008-02-06
    • Randall L. Kubena
    • Randall L. Kubena
    • G01C19/00
    • G01C19/5684
    • An on-chip navigation system, optionally combined with GPS (Global Positioning System) and/or an imaging array, which incorporates MEMS (MicroElectroMechanical Systems) components is possible by the use of careful material selection and novel bonding techniques used during fabrication. The use of MEMS components permits many of the components of a typical inertial navigation system to reside on a single chip. Because the components are in close proximity, the components can then be used to monitor the environmental changes of the chip, such as temperature and vibration, and correct for the resulting offsets of other components. This allows improved system performance even if the individual sensor components are not ideal.
    • 通过使用仔细的材料选择和在制造期间使用的新型结合技术,可以选择结合使用MEMS(微电子机械系统)部件的GPS(全球定位系统)和/或成像阵列的片上导航系统。 使用MEMS组件允许典型惯性导航系统的许多组件驻留在单个芯片上。 由于组件非常接近,因此可以使用组件来监视芯片的环境变化,例如温度和振动,并纠正其他组件产生的偏移。 这样即使各个传感器组件不理想,也可以提高系统性能。
    • 4. 发明授权
    • Method of fabricating an ultra thin quartz resonator component
    • 制造超薄石英谐振器元件的方法
    • US07802356B1
    • 2010-09-28
    • US12034852
    • 2008-02-21
    • David T. ChangRandall L. KubenaPamela R. Patterson
    • David T. ChangRandall L. KubenaPamela R. Patterson
    • H04R31/00
    • H03H9/172H03H3/04
    • A method for manufacturing a resonator is presented in the present application. The method includes providing a handle substrate, providing a host substrate, providing a quartz substrate comprising a first surface opposite a second surface, applying interposer film to the first surface of the quartz substrate, bonding the quartz substrate to the handle substrate wherein the interposer film is disposed between the quartz substrate and the handle substrate, thinning the second surface of the quartz substrate, removing a portion of the bonded quartz substrate to expose a portion of the interposer film, bonding the quartz substrate to the host substrate, and removing the handle substrate and the interposer film, thereby releasing the quartz substrate.
    • 在本申请中提出了一种用于制造谐振器的方法。 该方法包括提供处理衬底,提供主体衬底,提供包括与第二表面相对的第一表面的石英衬底,将中介层膜施加到石英衬底的第一表面,将石英衬底接合到处理衬底,其中插入膜 设置在石英基板和手柄基板之间,使石英基板的第二表面变薄,去除一部分键合的石英基板以暴露中间层膜的一部分,将石英基板接合到主基板,并且移除手柄 基板和内插膜,从而释放石英基板。
    • 8. 发明授权
    • Method of fabrication an ultra-thin quartz resonator
    • 制造超薄石英谐振器的方法
    • US08769802B1
    • 2014-07-08
    • US12831028
    • 2010-07-06
    • David T. ChangRandall L. KubenaPamela R. Patterson
    • David T. ChangRandall L. KubenaPamela R. Patterson
    • H04R31/00
    • H03H9/172H03H3/04
    • A method for manufacturing a resonator is presented in the present application. The method includes providing a handle substrate, providing a host substrate, providing a quartz substrate comprising a first surface opposite a second surface, applying interposer film to the first surface of the quartz substrate, bonding the quartz substrate to the handle substrate wherein the interposer film is disposed between the quartz substrate and the handle substrate, thinning the second surface of the quartz substrate, removing a portion of the bonded quartz substrate to expose a portion of the interposer film, bonding the quartz substrate to the host substrate, and removing the handle substrate and the interposer film, thereby releasing the quartz substrate.
    • 在本申请中提出了一种用于制造谐振器的方法。 该方法包括提供处理衬底,提供主体衬底,提供包括与第二表面相对的第一表面的石英衬底,将中介层膜施加到石英衬底的第一表面,将石英衬底接合到处理衬底,其中插入膜 设置在石英基板和手柄基板之间,使石英基板的第二表面变薄,去除一部分键合的石英基板以暴露中间层膜的一部分,将石英基板接合到主基板,并且移除手柄 基板和内插膜,从而释放石英基板。
    • 10. 发明授权
    • Quartz-based MEMS resonators and methods of fabricating same
    • 基于石英的MEMS谐振器及其制造方法
    • US08765615B1
    • 2014-07-01
    • US12816292
    • 2010-06-15
    • David T. ChangFrederic P. StrattonHung NguyenRandall L. Kubena
    • David T. ChangFrederic P. StrattonHung NguyenRandall L. Kubena
    • H01L21/302H01L21/311H01L21/3105
    • H01L21/31111B81B2201/0271B81C1/00238B81C2201/0194B81C2203/036B81C2203/038H01L21/31056H03H3/0072H03H2009/02291
    • A quart resonator for use in lower frequency applications (typically lower than the higher end of the UHF spectrum) where relatively thick quartz members, having a thickness greater than ten microns, are called for. A method for fabricating same resonator includes providing a first quart substrate; thinning the first quartz substrate to a desired thickness; forming a metallic etch stop on a portion of a first major surface of the first quartz substrate; adhesively attaching the first major surface of the first quartz substrate with the metallic etch stop formed thereon to a second quartz substrate using a temporary adhesive; etching a via though the first quartz substrate to the etch stop; forming a metal electrode on a second major surface of the first quartz substrate, the metal electrode penetrating the via in the first quartz substrate to make ohmic contact with the metallic etch stop; bonding the metal electrode formed on the second major surface of the first quartz substrate to a pad formed on a substrate bearing oscillator drive circuitry to form a bond there between; and dissolving the temporary adhesive to thereby release the second quartz substrate from the substrate bearing oscillator drive circuitry and a portion of the first quartz substrate bonded thereto via the bond formed between the metal electrode formed on the second major surface of the first quartz substrate to and the pad formed on the substrate bearing oscillator drive circuitry.
    • 用于低频应用(通常低于UHF频谱的较高端)的夸特谐振器,其中厚度大于10微米的相对较厚的石英构件被要求。 一种制造相同谐振器的方法包括提供第一夸脱基片; 将第一石英基板变薄至所需厚度; 在所述第一石英衬底的第一主表面的一部分上形成金属蚀刻停止件; 使用临时粘合剂将第一石英基板的第一主表面与其上形成的金属蚀刻停止粘合到第二石英基板上; 将通过第一石英衬底的通孔蚀刻到蚀刻停止部; 在所述第一石英衬底的第二主表面上形成金属电极,所述金属电极穿过所述第一石英衬底中的通孔以与所述金属蚀刻停止件欧姆接触; 将形成在第一石英衬底的第二主表面上的金属电极接合到形成在承载振荡器驱动电路的衬底上的焊盘,以在其之间形成结合; 并且将临时粘合剂溶解,从而从基板轴承振荡器驱动电路和第一石英基板的一部分经由形成在第一石英基板的第二主表面上的金属电极之间的键与第一石英基板接合的部分而释放第二石英基板 衬垫形成在承载振荡器驱动电路的衬底上。