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    • 8. 发明授权
    • Method of forming crystalline oxide semiconductor film
    • 形成结晶氧化物半导体膜的方法
    • US09546416B2
    • 2017-01-17
    • US13221140
    • 2011-08-30
    • Shunpei Yamazaki
    • Shunpei Yamazaki
    • C30B25/00C23C14/08C23C14/54C23C14/56C30B29/16C30B25/10
    • C23C14/08C23C14/086C23C14/541C23C14/564C30B25/10C30B25/105C30B29/16
    • An oxide semiconductor film with excellent crystallinity is formed. At the time when an oxide semiconductor film is formed, as a substrate is heated to a temperature of higher than or equal to a first temperature and lower than a second temperature, a part of the substrate having a typical length of 1 nm to 1 μm is heated to a temperature higher than or equal to the second temperature. Here, the first temperature means a temperature at which crystallization occurs with some stimulation, and the second temperature means a temperature at which crystallization occurs spontaneously without any stimulation. Further, the typical length is defined as the square root of a value obtained in such a manner that the area of the part is divided by the circular constant.
    • 形成具有优异结晶度的氧化物半导体膜。 在形成氧化物半导体膜时,作为基板被加热至高于或等于第一温度且低于第二温度的温度时,具有典型长度为1nm至1μm的基板的一部分 被加热到高于或等于第二温度的温度。 这里,第一温度是指在某种刺激下发生结晶的温度,第二温度是指没有任何刺激自发发生结晶的温度。 此外,典型长度被定义为以使得部件的面积除以圆形常数的方式获得的值的平方根。