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1. 发明授权

US09171938B2 Semiconductor element and method for manufacturing the same 有权
标题翻译：半导体元件及其制造方法
公开(公告)号：US09171938B2
公开(公告)日：2015-10-27
申请号：US12888835
申请日：2010-09-23
申请人： Shunpei Yamazaki , Junichiro Sakata , Akiharu Miyanaga , Masayuki Sakakura , Junichi Koezuka , Tetsunori Maruyama , Yuki Imoto
发明人： Shunpei Yamazaki , Junichiro Sakata , Akiharu Miyanaga , Masayuki Sakakura , Junichi Koezuka , Tetsunori Maruyama , Yuki Imoto
IPC分类号： H01L21/02 , H01L29/66 , H01L27/12 , H01L29/786
CPC分类号： H01L29/66969 , H01L21/02565 , H01L27/1225 , H01L29/7869
摘要： An object is to provide a thin film transistor and a method for manufacturing the thin film transistor including an oxide semiconductor with a controlled threshold voltage, high operation speed, a relatively easy manufacturing process, and sufficient reliability. An impurity having influence on carrier concentration in the oxide semiconductor layer, such as a hydrogen atom or a compound containing a hydrogen atom such as H2O, may be eliminated. An oxide insulating layer containing a large number of defects such as dangling bonds may be formed in contact with the oxide semiconductor layer, such that the impurity diffuses into the oxide insulating layer and the impurity concentration in the oxide semiconductor layer is reduced. The oxide semiconductor layer or the oxide insulating layer in contact with the oxide semiconductor layer may be formed in a deposition chamber which is evacuated with use of a cryopump whereby the impurity concentration is reduced.
摘要翻译：目的在于提供一种薄膜晶体管及其制造方法，该薄膜晶体管包括具有受控阈值电压，高操作速度，相对容易的制造工艺以及足够的可靠性的氧化物半导体。可以消除影响氧化物半导体层中的载流子浓度的杂质，例如氢原子或含有氢原子如H 2 O的化合物。可以与氧化物半导体层接触形成含有大量缺陷的氧化物绝缘层，例如悬挂键，使得杂质扩散到氧化物绝缘层中，并且氧化物半导体层中的杂质浓度降低。与氧化物半导体层接触的氧化物半导体层或氧化物绝缘层可以在使用低温泵抽真空的沉积室中形成，从而杂质浓度降低。

2. 发明授权

US08748223B2 Method for manufacturing oxide semiconductor film and method for manufacturing semiconductor device 有权
标题翻译：氧化物半导体膜的制造方法及半导体装置的制造方法
公开(公告)号：US08748223B2
公开(公告)日：2014-06-10
申请号：US12888846
申请日：2010-09-23
申请人： Shunpei Yamazaki , Junichiro Sakata , Akiharu Miyanaga , Masayuki Sakakura , Junichi Koezuka , Tetsunori Maruyama , Yuki Imoto
发明人： Shunpei Yamazaki , Junichiro Sakata , Akiharu Miyanaga , Masayuki Sakakura , Junichi Koezuka , Tetsunori Maruyama , Yuki Imoto
IPC分类号： H01L21/00 , H01L21/16
CPC分类号： H01L29/66742 , C23C14/086 , H01L21/02422 , H01L21/02554 , H01L21/02565 , H01L21/02631 , H01L29/7869
摘要： An object is to provide an oxide semiconductor having stable electric characteristics and a semiconductor device including the oxide semiconductor. A manufacturing method of a semiconductor film by a sputtering method includes the steps of holding a substrate in a treatment chamber which is kept in a reduced-pressure state; heating the substrate at lower than 400° C.; introducing a sputtering gas from which hydrogen and moisture are removed in the state where remaining moisture in the treatment chamber is removed; and forming an oxide semiconductor film over the substrate with use of a metal oxide which is provided in the treatment chamber as a target. When the oxide semiconductor film is formed, remaining moisture in a reaction atmosphere is removed; thus, the concentration of hydrogen and the concentration of hydride in the oxide semiconductor film can be reduced. Thus, the oxide semiconductor film can be stabilized.
摘要翻译：目的是提供具有稳定电特性的氧化物半导体和包括氧化物半导体的半导体器件。通过溅射法制造半导体膜的方法包括将基板保持在保持在减压状态的处理室中的步骤; 在低于400℃下加热基材。在去除处理室中的剩余水分的状态下引入除去氢气和水分的溅射气体; 以及使用设置在处理室中的金属氧化物作为目标，在基板上形成氧化物半导体膜。当形成氧化物半导体膜时，除去反应气氛中的剩余水分; 因此，可以降低氧化物半导体膜中的氢浓度和氢化物浓度。因此，可以使氧化物半导体膜稳定。

3. 发明授权

US08338827B2 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08338827B2
公开(公告)日：2012-12-25
申请号：US12612021
申请日：2009-11-04
申请人： Shunpei Yamazaki , Junichiro Sakata , Tetsunori Maruyama , Yuki Imoto , Yuji Asano , Junichi Koezuka
发明人： Shunpei Yamazaki , Junichiro Sakata , Tetsunori Maruyama , Yuki Imoto , Yuji Asano , Junichi Koezuka
IPC分类号： H01L29/10
CPC分类号： H01L29/66742 , C04B35/58 , C04B2235/3284 , C04B2235/3286 , H01L27/1225 , H01L29/66969 , H01L29/78618 , H01L29/7869
摘要： In a thin film transistor which uses an oxide semiconductor, buffer layers containing indium, gallium, zinc, oxygen, and nitrogen are provided between the oxide semiconductor layer and the source and drain electrode layers.
摘要翻译：在使用氧化物半导体的薄膜晶体管中，在氧化物半导体层和源极和漏极电极层之间设置包含铟，镓，锌，氧和氮的缓冲层。

4. 发明授权

US08378393B2 Conductive oxynitride and method for manufacturing conductive oxynitride film 有权
标题翻译：导电氮氧化物及其制造方法
公开(公告)号：US08378393B2
公开(公告)日：2013-02-19
申请号：US12609032
申请日：2009-10-30
申请人： Junichiro Sakata , Tetsunori Maruyama , Yuki Imoto , Yuji Asano , Junichi Koezuka
发明人： Junichiro Sakata , Tetsunori Maruyama , Yuki Imoto , Yuji Asano , Junichi Koezuka
IPC分类号： H01L29/78
CPC分类号： C23C14/5846 , C04B35/58 , C04B2235/3284 , C04B2235/3286 , C23C14/0057 , C23C14/0676 , H01L27/1225 , H01L27/124 , H01L29/7869
摘要： An electrode formed using a transparent conductive oxide is likely to be crystallized by heat treatment performed in the manufacturing process of a semiconductor device. In the case of a thin film element using an electrode having a significantly uneven surface due to crystallization, a short circuit is likely to occur and thus reliability of the element is degraded. An object is to provide a light-transmitting conductive oxynitride which is not crystallized even if subjected to heat treatment and a manufacturing method thereof. It is found that an oxynitride containing indium, gallium, and zinc, to which hydrogen atoms are added as impurities, is a light-transmitting conductive film which is not crystallized even if heated at 350° C. and the object is achieved.
摘要翻译：使用透明导电氧化物形成的电极可能通过在半导体器件的制造过程中进行的热处理而结晶化。在使用由于结晶而具有显着不平坦表面的电极的薄膜元件的情况下，可能发生短路，因此元件的可靠性降低。本发明的目的是提供即使经受热处理也不结晶的透光导电氮氧化物及其制造方法。发现含有氢原子作为杂质的含有铟，镓和锌的氮氧化物是透光性导电膜，即使在350℃下加热也不会结晶，实现了目的。

5. 发明授权

US09202827B2 Driver circuit and semiconductor device 有权
标题翻译：驱动电路和半导体器件
公开(公告)号：US09202827B2
公开(公告)日：2015-12-01
申请号：US12641446
申请日：2009-12-18
申请人： Jun Koyama , Junichiro Sakata , Tetsunori Maruyama , Yuki Imoto , Yuji Asano , Junichi Koezuka
发明人： Jun Koyama , Junichiro Sakata , Tetsunori Maruyama , Yuki Imoto , Yuji Asano , Junichi Koezuka
IPC分类号： H01L27/12 , H01L29/786
CPC分类号： H01L27/1255 , H01L27/12 , H01L27/1225 , H01L27/127 , H01L28/20 , H01L29/24 , H01L29/78606 , H01L29/7869
摘要： The silicon nitride layer 910 formed by plasma CVD using a gas containing a hydrogen compound such as silane (SiH4) and ammonia (NH3) is provided on and in direct contact with the oxide semiconductor layer 905 used for the resistor 354, and the silicon nitride layer 910 is provided over the oxide semiconductor layer 906 used for the thin film transistor 355 with the silicon oxide layer 909 serving as a barrier layer interposed therebetween. Therefore, a higher concentration of hydrogen is introduced into the oxide semiconductor layer 905 than into the oxide semiconductor layer 906. As a result, the resistance of the oxide semiconductor layer 905 used for the resistor 354 is made lower than that of the oxide semiconductor layer 906 used for the thin film transistor 355.
摘要翻译：通过使用含有氢化合物如硅烷（SiH 4）和氨（NH 3）的气体的等离子体CVD形成的氮化硅层910设置在与用于电阻器354的氧化物半导体层905上并直接接触，并且氮化硅在用于薄膜晶体管355的氧化物半导体层906上设置层910，氧化硅层909用作阻挡层。因此，与氧化物半导体层906相比，在氧化物半导体层905中引入更高浓度的氢。结果，使用于电阻器354的氧化物半导体层905的电阻比氧化物半导体层的电阻低 906用于薄膜晶体管355。

6. 发明授权

US09260779B2 Light-transmitting conductive film, display device, electronic device, and manufacturing method of light-transmitting conductive film 有权
标题翻译：透光导电膜，显示装置，电子装置以及透光性导电膜的制造方法
公开(公告)号：US09260779B2
公开(公告)日：2016-02-16
申请号：US12781894
申请日：2010-05-18
申请人： Junichi Koezuka , Tetsunori Maruyama , Takayuki Saito , Yuki Imoto , Noriaki Uto , Yuta Endo , Hitomi Shionoya , Takuya Hirohashi , Shunpei Yamazaki
发明人： Junichi Koezuka , Tetsunori Maruyama , Takayuki Saito , Yuki Imoto , Noriaki Uto , Yuta Endo , Hitomi Shionoya , Takuya Hirohashi , Shunpei Yamazaki
IPC分类号： C23C14/08 , C23C14/34 , C23C14/06 , C23C14/58 , C23C14/54
CPC分类号： H01B1/02 , C23C14/0676 , C23C14/3414 , C23C14/541 , C23C14/5806
摘要： An object is to provide a transparent conductive film having favorable transparency and conductivity at low cost. Another object is to reduce the resistivity of a transparent conductive film formed using conductive oxynitride including zinc and aluminum. Another object is to provide a transparent conductive film that is formed using conductive oxynitride including zinc and aluminum. When aluminum and nitrogen are made to be included in a transparent conductive film formed using oxide including zinc to form a transparent conductive film that is formed using conductive oxynitride including zinc and aluminum, the transparent conductive film can have reduced resistivity. Heat treatment after the formation of the transparent conductive film that is formed using conductive oxynitride including zinc and aluminum enables reduction in resistivity of the transparent conductive film.
摘要翻译：本发明的目的是提供一种透明导电膜，其具有良好的透明性和低导电性。另一个目的是降低使用包括锌和铝的导电氮氧化物形成的透明导电膜的电阻率。另一个目的是提供使用包括锌和铝的导电氮氧化物形成的透明导电膜。当使用包含锌的氧化物形成的透明导电膜中包含铝和氮以形成使用包括锌和铝的导电氮氧化物形成的透明导电膜时，透明导电膜可以具有降低的电阻率。在形成使用包括锌和铝的导电氮氧化物形成的透明导电膜之后的热处理使得能够降低透明导电膜的电阻率。

7. 发明申请

US20120097942A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件及制造半导体器件的方法
公开(公告)号：US20120097942A1
公开(公告)日：2012-04-26
申请号：US13274512
申请日：2011-10-17
申请人： Yuki Imoto , Tetsunori Maruyama , Takatsugu Omata , Yusuke Nonaka , Tatsuya Honda , Akiharu Miyanaga
发明人： Yuki Imoto , Tetsunori Maruyama , Takatsugu Omata , Yusuke Nonaka , Tatsuya Honda , Akiharu Miyanaga
IPC分类号： H01L29/786 , H01L21/34
CPC分类号： H01L29/7869 , H01L21/02554 , H01L21/02565 , H01L21/02631 , H01L29/4908
摘要： It is an object of an embodiment of the present invention to reduce leakage current between a source and a drain in a transistor including an oxide semiconductor. As a first gate film in contact with a gate insulating film, a compound conductor which includes indium and nitrogen and whose band gap is less than 2.8 eV is used. Since this compound conductor has a work function of greater than or equal to 5 eV, preferably greater than or equal to 5.5 eV, the electron concentration in an oxide semiconductor film can be maintained extremely low. As a result, the leakage current between the source and the drain is reduced.
摘要翻译：本发明的一个实施例的目的是减少包括氧化物半导体的晶体管中的源极和漏极之间的漏电流。作为与栅极绝缘膜接触的第一栅极膜，使用包含铟和氮并且其带隙小于2.8eV的复合导体。由于该复合导体具有大于或等于5eV，优选大于或等于5.5eV的功函数，所以氧化物半导体膜中的电子浓度可以保持极低。结果，源极和漏极之间的漏电流减小。

8. 发明授权

US08546892B2 Semiconductor device and method for manufacturing semiconductor device 有权
标题翻译：半导体装置及半导体装置的制造方法
公开(公告)号：US08546892B2
公开(公告)日：2013-10-01
申请号：US13274512
申请日：2011-10-17
申请人： Yuki Imoto , Tetsunori Maruyama , Takatsugu Omata , Yusuke Nonaka , Tatsuya Honda , Akiharu Miyanaga
发明人： Yuki Imoto , Tetsunori Maruyama , Takatsugu Omata , Yusuke Nonaka , Tatsuya Honda , Akiharu Miyanaga
IPC分类号： H01L21/70
CPC分类号： H01L29/7869 , H01L21/02554 , H01L21/02565 , H01L21/02631 , H01L29/4908
摘要： It is an object of an embodiment of the present invention to reduce leakage current between a source and a drain in a transistor including an oxide semiconductor. As a first gate film in contact with a gate insulating film, a compound conductor which includes indium and nitrogen and whose band gap is less than 2.8 eV is used. Since this compound conductor has a work function of greater than or equal to 5 eV, preferably greater than or equal to 5.5 eV, the electron concentration in an oxide semiconductor film can be maintained extremely low. As a result, the leakage current between the source and the drain is reduced.
摘要翻译：本发明的一个实施例的目的是减少包括氧化物半导体的晶体管中的源极和漏极之间的漏电流。作为与栅极绝缘膜接触的第一栅极膜，使用包含铟和氮并且其带隙小于2.8eV的复合导体。由于该复合导体具有大于或等于5eV，优选大于或等于5.5eV的功函数，所以氧化物半导体膜中的电子浓度可以保持极低。结果，源极和漏极之间的漏电流减小。

9. 发明授权

US09196738B2 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US09196738B2
公开(公告)日：2015-11-24
申请号：US12965197
申请日：2010-12-10
申请人： Junichiro Sakata , Tetsunori Maruyama , Yuki Imoto
发明人： Junichiro Sakata , Tetsunori Maruyama , Yuki Imoto
IPC分类号： H01L21/336 , H01L29/786
CPC分类号： H01L29/7869 , H01L27/124 , H01L29/24
摘要： Many of the physical properties of a silicon semiconductor have already been understood, whereas many of the physical properties of an oxide semiconductor have been still unclear. In particular, an adverse effect of an impurity on an oxide semiconductor has been still unclear. In view of the above, a structure is disclosed in which an impurity that influences electrical characteristics of a semiconductor device including an oxide semiconductor layer is prevented or is eliminated. A semiconductor device which includes a gate electrode, an oxide semiconductor layer, and a gate insulating layer provided between the gate electrode and the oxide semiconductor layer and in which the nitrogen concentration in the oxide semiconductor layer is 1×1020 atoms/cm3 or less is provided.
摘要翻译：已经理解了硅半导体的许多物理性质，而氧化物半导体的许多物理性质仍然不清楚。特别是杂质对氧化物半导体的不利影响还不清楚。鉴于上述，公开了防止或消除影响包括氧化物半导体层的半导体器件的电特性的杂质的结构。设置在栅电极和氧化物半导体层之间并且氧化物半导体层中的氮浓度为1×1020原子/ cm3以下的栅极，氧化物半导体层和栅极绝缘层的半导体装置为提供。

10. 发明授权

US08828794B2 Method of manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US08828794B2
公开(公告)日：2014-09-09
申请号：US13413684
申请日：2012-03-07
申请人： Shunpei Yamazaki , Yuhei Sato , Keiji Sato , Tetsunori Maruyama , Junichi Koezuka
发明人： Shunpei Yamazaki , Yuhei Sato , Keiji Sato , Tetsunori Maruyama , Junichi Koezuka
IPC分类号： H01L21/42 , H01L21/84 , H01L21/336 , H01L27/12 , H01L29/786
CPC分类号： H01L21/40 , H01L21/02175 , H01L21/02252 , H01L21/02565 , H01L21/02636 , H01L21/02664 , H01L21/324 , H01L21/383 , H01L21/477 , H01L27/1225 , H01L29/66742 , H01L29/66969 , H01L29/7869
摘要： In a manufacturing process of a transistor including an oxide semiconductor film, oxygen doping treatment is performed on the oxide semiconductor film, and then heat treatment is performed on the oxide semiconductor film and an aluminum oxide film provided over the oxide semiconductor film. Consequently, an oxide semiconductor film which includes a region containing more oxygen than a stoichiometric composition is formed. The transistor formed using the oxide semiconductor film can have high reliability because the amount of change in the threshold voltage of the transistor by a bias-temperature stress test (BT test) is reduced.
摘要翻译：在包括氧化物半导体膜的晶体管的制造过程中，对氧化物半导体膜进行氧掺杂处理，然后对氧化物半导体膜和设置在氧化物半导体膜上的氧化铝膜进行热处理。因此，形成包含比化学计量组成物多的氧的区域的氧化物半导体膜。使用氧化物半导体膜形成的晶体管可以具有高的可靠性，因为通过偏压 - 温度应力测试（BT测试）的晶体管的阈值电压的变化量减小。

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