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    • 6. 发明授权
    • Encapsulation for organic device
    • 有机装置封装
    • US07518142B2
    • 2009-04-14
    • US11761770
    • 2007-06-12
    • Uwe HoffmannJose Manuel Dieguez-CampoFrank StahrKlaus Schade
    • Uwe HoffmannJose Manuel Dieguez-CampoFrank StahrKlaus Schade
    • H01L35/24
    • H01L51/5253H01L2251/558
    • The present invention concerns a thin-film encapsulation structure for electronic devices with organic substances, especially OLEDs or other organic optoelectronic devices as well as corresponding components and a process for the production with a primary, inorganic barrier layer (5), which is directly arranged on the device or the surface to be encapsulated; a planarization layer (6) arranged on the primary, inorganic barrier layer, the thickness of said planarization layer selected such that it is thicker than the simple value of the distance between highest peak and deepest valley of the surface of the primary barrier layer or the surface of the device under the primary barrier layer or the surface to be encapsulated, as well as a secondary barrier layer (14) arranged on the planarization layer.
    • 本发明涉及一种具有有机物质的电子器件的薄膜封装结构,特别是OLED或其它有机光电子器件以及相应的部件,以及用于生产具有主要无机阻挡层(5)的方法,其直接布置 在要封装的设备或表面上; 布置在初级无机阻挡层上的平坦化层(6),所述平坦化层的厚度被选择为比主要阻挡层的表面的最高峰和最深谷之间的距离的简单值 主要阻挡层或待封装表面下的器件表面,以及布置在平坦化层上的次级阻挡层(14)。
    • 9. 发明申请
    • METHOD OF PROVIDING AN ENCAPSULATION LAYER STACK, COATING DEVICE AND COATING SYSTEM
    • 提供封装层堆叠,涂层器件和涂层系统的方法
    • US20090098293A1
    • 2009-04-16
    • US11872545
    • 2007-10-15
    • Uwe HoffmannJose Manuel Dieguez-Campo
    • Uwe HoffmannJose Manuel Dieguez-Campo
    • B05D1/36C23C14/00C23C16/00C23C14/34
    • H01L21/67207H01L21/56H01L21/6715H01L51/5256H01L51/56H01L2924/0002H01L2924/00
    • A coating system or encapsulation module 1 is coupled with a substrate handling module 2, wherein substrates 3a to be encapsulated and substrates 3b that already have an encapsulation layer stack deposited thereon are handled in a nitrogen atmosphere. The substrate handling module 2 comprises a magazine 4 for storing substrates 3a to be coated and encapsulated substrates 3b. A handling device 5 unloads the substrates 3a to be coated from the magazine 4 and loads encapsulated substrates 3b into the magazine 4. The encapsulation module 1 has a first ink-jet coating chamber 10a. In said first ink-jet coating chamber 10a a photoresist layer is deposited on the substrate 3a by means of an ink-jet printing method. The ink-jet printing method is carried out in an atmosphere of about 10 mbar. Then the substrate 3a is transported into a first CVD (chemical vapor deposition) coating chamber 11a. In the CVD coating chamber 11a a first silicon nitride layer is deposited on the substrate 3a, i.e. on the photoresist layer, by using a CVD coating method at a pressure of about 10−2 mbar to 10−3 mbar. This process is repeated in second and third ink-jet coating chambers 10b, 10c and second and third CVD coating chambers 11b, 11c, respectively.
    • 涂覆系统或封装模块1与衬底处理模块2耦合,其中待封装的衬底3a和已经具有沉积在其上的封装层堆叠的衬底3b在氮气气氛中处理。 基板处理模块2包括用于存储待涂覆的基板3a和封装的基板3b的盒4。 处理装置5将要被涂布的基板3a从盒体4卸载,并将封装的基板3b装载到盒体4中。封装模块1具有第一喷墨涂布室10a。 在所述第一喷墨涂布室10a中,通过喷墨打印方法将光致抗蚀剂层沉积在基板3a上。 喷墨打印方法在约10毫巴的气氛中进行。 然后将基板3a输送到第一CVD(化学气相沉积)涂覆室11a中。 在CVD涂覆室11a中,通过在大约10-2毫巴至10-3毫巴的压力下使用CVD涂覆法,在衬底3a上,即在光致抗蚀剂层上沉积第一氮化硅层。 在第二和第三喷墨涂布室10b,10c和第二和第三CVD涂层室11b,11c中分别重复该过程。
    • 10. 发明申请
    • PROCESSING DEVICE AND METHOD FOR PROCESSING A SUBSTRATE
    • 处理装置和处理基板的方法
    • US20080261409A1
    • 2008-10-23
    • US12056934
    • 2008-03-27
    • Uwe HoffmannJose Manuel Dieguez-Campo
    • Uwe HoffmannJose Manuel Dieguez-Campo
    • H01L21/31
    • H01L51/56C23C14/12C23C14/564C23C14/568H01L51/5253
    • A processing device for producing a layer system including at least one layer of an organic light emitting semiconductor material (OLED), comprises (1) a configuration of one or more treatment stations for processing the substrate in the treatment stations and (2) a first encapsulation module for providing an encapsulation element on the layer system deposited on the substrate. Furthermore, the processing device comprises at least a second encapsulation module, and is configured to provide the encapsulation element on the coated substrate in the first or second encapsulation module alternatively. By providing two encapsulation modules, the second module may be cleaned during a continuous operation of the processing device, while the first encapsulation module is generating an encapsulation on a coated substrate. In this way, a continuous operation of a coating device for depositing an OLED coating and an encapsulation element on the OLED coating is provided.
    • 一种用于生产包括至少一层有机发光半导体材料(OLED)的层系统的处理装置,包括(1)用于处理处理站中的衬底的一个或多个处理站的配置,以及(2) 封装模块,用于在沉积在基板上的层系统上提供封装元件。 此外,处理装置至少包括第二封装模块,并且被配置为可替换地在第一封装模块或第二封装模块中的涂覆基板上提供封装元件。 通过提供两个封装模块,第二模块可以在处理装置的连续操作期间被清洁,而第一封装模块在涂覆的基板上产生封装。 以这种方式,提供了用于在OLED涂层上沉积OLED涂层和封装元件的涂覆装置的连续操作。