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1. 外观设计

USD436085S1 Piezoelectric conversion type semiconductor device 失效
公开(公告)号：USD436085S1
公开(公告)日：2001-01-09
申请号：US29106665
申请日：1999-06-18
申请人： Takashi Takizawa , Tatsuya Itoh , Kazuyuki Itoh
设计人： Takashi Takizawa , Tatsuya Itoh , Kazuyuki Itoh

2. 外观设计

USD427977S Piezoelectric conversion type semiconductor device 失效
公开(公告)号：USD427977S
公开(公告)日：2000-07-11
申请号：US106663
申请日：1999-06-18
申请人： Takashi Takizawa , Tatsuya Itoh , Naoshi Tsukada
设计人： Takashi Takizawa , Tatsuya Itoh , Naoshi Tsukada

3. 外观设计

USD475950S1 Motor scooter 失效
公开(公告)号：USD475950S1
公开(公告)日：2003-06-17
申请号：US29163050
申请日：2002-06-27
申请人： Takuji Kawano , Kazuhiro Sakamoto , Yoshitaka Kubota , Takashi Takizawa
设计人： Takuji Kawano , Kazuhiro Sakamoto , Yoshitaka Kubota , Takashi Takizawa

4. 发明授权

US06548786B2 Circuit for driving a heater at a constant power 有权
标题翻译：以恒定功率驱动加热器的电路
公开(公告)号：US06548786B2
公开(公告)日：2003-04-15
申请号：US09851112
申请日：2001-05-09
申请人： Takashi Takizawa , Hiroshi Nishida
发明人： Takashi Takizawa , Hiroshi Nishida
IPC分类号： H05B102
CPC分类号： H05B1/0247 , G01N27/4067 , Y10T307/773
摘要： A current-limiting resistor is connected between a power-supply line and a heater provided near the oxygen-detecting element of limiting-current type oxygen sensor. A power MOSFET is connected between the heater and a ground line. The resistor and the heater have such resistances that a current I2 flowing through the resistor and the heater when the heater has a resistance R2 is about I1{square root over ((R1/R2))}, where I1 is a current flowing through the resistor and the heater when the heater has a resistance R1.
摘要翻译：在限流电氧传感器的氧检测元件附近设置的电源线和加热器之间连接有限流电阻。功率MOSFET连接在加热器和接地线之间。电阻器和加热器具有这样的电阻，当加热器具有电阻R2时流过电阻器和加热器的电流I2约为I1（平方根超过（（R1 / R2）），其中I1是流过电阻器的电流，当加热器有电阻R1时加热器。

5. 发明授权

US08975218B2 Grease composition comprising polymer alloy, a structure part enclosing the same and a method for producing the grease composition 有权
标题翻译：包含聚合物合金的润滑脂组合物，包含聚合物合金的结构部件和润滑脂组合物的制造方法
公开(公告)号：US08975218B2
公开(公告)日：2015-03-10
申请号：US13365531
申请日：2012-02-03
申请人： Kyosuke Ikuma , Yosuke Takao , Takashi Takizawa , Iwaki Hirooka , Yosuke Endo , Akihiko Urashima
发明人： Kyosuke Ikuma , Yosuke Takao , Takashi Takizawa , Iwaki Hirooka , Yosuke Endo , Akihiko Urashima
IPC分类号： C10M113/08 , C10M157/00 , C10M143/10 , C10M169/06
CPC分类号： C10M169/06 , C10M2203/1025 , C10M2205/022 , C10M2205/024 , C10M2205/0285 , C10M2205/04 , C10M2205/06 , C10M2207/0406 , C10M2207/1285 , C10M2207/2805 , C10N2220/021 , C10N2230/70 , C10N2250/10 , C10M2205/028 , C10M2205/026 , C10N2210/01
摘要： A grease composition having a thickener, a base oil containing a hydrocarbon oil, and a polymer alloy of an olefin copolymer and a styrene-based copolymer is disclosed.
摘要翻译：公开了一种具有增稠剂，含有烃油的基础油和烯烃共聚物和苯乙烯基共聚物的聚合物合金的润滑脂组合物。

6. 发明授权

US07443035B2 Method of forming a penetration electrode and substrate having a penetration electrode 有权
标题翻译：形成具有穿透电极的穿透电极和基板的方法
公开(公告)号：US07443035B2
公开(公告)日：2008-10-28
申请号：US11447257
申请日：2006-06-06
申请人： Satoshi Yamamoto , Takashi Takizawa
发明人： Satoshi Yamamoto , Takashi Takizawa
IPC分类号： H01L23/34
CPC分类号： H01L21/76898 , H01L23/481 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K3/4038 , H05K3/4061 , H05K2201/0394 , H05K2203/016 , H05K2203/128 , H01L2924/00
摘要： A method of forming a penetration electrode in which an electroconductive substance is inserted into a micropore that has one end blocked off only by wiring and a pad formed by an electroconductive substance without the wiring and pad being broken. In this method of forming a penetration electrode, an electroconductive substance is inserted into the micropore that penetrates a substrate and that has one aperture blocked off by an electroconductive thin film. After a protective member that holds the electroconductive thin film is provided on a surface on the electroconductive thin film side of the substrate, an electroconductive substance is inserted from the other aperture of the micropore.
摘要翻译：一种形成穿透电极的方法，其中将导电物质插入到仅通过布线封闭的一端的微孔和由导电物质形成的焊盘而不会损坏布线和焊盘。在这种形成穿透电极的方法中，将导电物质插入到穿透基底的微孔中，并且其一个孔被导电薄膜阻挡。在保持导电薄膜的保护部件设置在基板的导电薄膜侧的表面上之后，从微孔的另一个孔插入导电物质。

7. 外观设计

USD390833S Piezolectric conversion type semiconductor device 失效
公开(公告)号：USD390833S
公开(公告)日：1998-02-17
申请号：US67087
申请日：1997-03-04
申请人： Takashi Takizawa , Tatsuya Ito , Hiroshi Nishida
设计人： Takashi Takizawa , Tatsuya Ito , Hiroshi Nishida

8. 发明授权

US4648247A Low-temperature showcase 失效
标题翻译：低温展示柜
公开(公告)号：US4648247A
公开(公告)日：1987-03-10
申请号：US790268
申请日：1985-10-22
申请人： Takashi Takizawa , Tsutomu Tanaka
发明人： Takashi Takizawa , Tsutomu Tanaka
IPC分类号： A47F3/04 , F25B5/02 , F25B47/02
CPC分类号： A47F3/0447 , F25B47/022 , F25B5/02 , F25B2347/021 , Y10T74/18856
摘要： A low-temperature showcase in which a double air curtain can be formed for commodity inlet-outlet opening provided in one side of its main body comprising: a heat exchanger in an inner passage being positioned upstream of and at a predetermined distance from another heat exchanger in an outer passage with respect to the same direction of air flows, a partition wall defining the inner and outer passages and having a first window at a portion thereof between the two heat exchangers, a closure plate for opening or closing the first window to close or open the inner passage downstream of the first window, and first control unit for giving instructions to the closure plate for its operation, the first control unit being operative to instruct the closure plate to open the first window and close the inner passage downstream of the first window when the heat exchanger in the inner passage is operated for defrosting with the heat exchanger in the outer passage operated for refrigeration, whereby the air flow through the heat exchanger in the inner passage is guided into the outer passage through the opened first window and cooled by being passed through the heat exchanger in the outer passage.
摘要翻译：一种低温陈列柜，其中可以形成用于在其主体的一侧设置的商品入口 - 出口的双气帘，包括：内通道中的热交换器，位于与另一热交换器在相对于相同空气流动方向的外部通道中，限定内部通道和外部通道并且在其两个热交换器之间的部分具有第一窗口的分隔壁，用于打开或关闭第一窗口以闭合的封闭板或打开第一窗口下游的内部通道，以及第一控制单元，用于向封闭板指示其操作，第一控制单元可操作以指示封闭板打开第一窗口并将第一窗口的下游的内部通道关闭第一窗口，当内部通道中的热交换器被操作以用于用于制冷的外部通道中的热交换器进行除霜时，其中b 通过内部通道中的热交换器的空气流被引导到通过打开的第一窗口的外部通道中，并且通过穿过外部通道中的热交换器而被冷却。

9. 发明授权

US07814651B2 Method for fabricating a through-hole interconnection substrate 有权
标题翻译：通孔互连基板的制造方法
公开(公告)号：US07814651B2
公开(公告)日：2010-10-19
申请号：US11739575
申请日：2007-04-24
申请人： Tatsuo Suemasu , Takashi Takizawa
发明人： Tatsuo Suemasu , Takashi Takizawa
IPC分类号： H01K3/10
CPC分类号： H05K3/4038 , H01L21/288 , H01L21/3063 , H01L21/486 , H01L21/76898 , H01L23/481 , H01L25/0657 , H01L2224/0401 , H01L2224/05551 , H01L2224/0557 , H01L2224/05572 , H01L2224/05582 , H01L2224/05644 , H01L2224/05671 , H01L2224/11424 , H01L2224/13009 , H01L2224/13144 , H01L2225/06513 , H01L2225/06541 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K2203/128 , Y10T29/49117 , Y10T29/49155 , Y10T29/49165 , H01L2924/00014 , H01L2924/0105 , H01L2924/00012 , H01L2224/05552
摘要： A blind hole (3) is formed on a substrate (1) from a first side of the substrate toward a second side of the substrate (1). A conductor (11) is filled in the blind hole (3). The substrate (1) is removed from the opposite side to expose the conductor (13) filled in the blind hole (3).
摘要翻译：在基板（1）上从基板的第一侧向基板（1）的第二侧形成盲孔（3）。导体（11）填充在盲孔（3）中。从相对侧移除基板（1）以露出填充在盲孔（3）中的导体（13）。

10. 发明授权

US06743499B2 Metal filling method and member with filled metal sections 有权
标题翻译：金属填充方法和填充金属部件的构件
公开(公告)号：US06743499B2
公开(公告)日：2004-06-01
申请号：US10247264
申请日：2002-09-19
申请人： Tatsuo Suemasu , Takashi Takizawa
发明人： Tatsuo Suemasu , Takashi Takizawa
IPC分类号： B32B1500
CPC分类号： H01L21/76877 , C23C2/00 , C23C2/02 , C23C2/26 , H01L21/288 , H01L21/76882 , H01L21/76898 , H01L25/0657 , H01L2224/05556 , H01L2224/05572 , H01L2224/05573 , H01L2224/13025 , H01L2224/16 , H01L2924/00014 , H05K3/3468 , H05K3/4038 , H05K3/4076 , H05K3/426 , H05K2201/0305 , H05K2201/09572 , H05K2203/044 , H05K2203/085 , H05K2203/1394 , Y10S428/901 , Y10T428/24851 , Y10T428/24917 , Y10T428/31678 , H01L2224/05599
摘要： In the formation of through wirings in a silicon substrate and so forth, there was a need for the development of a technology that would allow metal to be reliably filled particularly in the vicinity of openings of through holes and other fine holes. This invention provides a metal filling method and member with filled metal sections in which, in the inflow and filling of a plating solution into through holes 11 of a substrate 10 by immersing said substrate 10 in heated and melted conductive metal, filled metal sections are formed by preliminarily forming a metal layer 15 on the inner surface of one of the ends of through holes 11 of this substrate 10 as well as on substrate top surface 13 around those openings, removing substrate 10 on which inflow and filling of the plating solution into through holes 11 has been completed from the plating solution, and then cooling to solidify the plating solution that has been filled into the through holes.
摘要翻译：在硅衬底等中形成通过布线的方法中，需要开发一种能够使金属被可靠地填充到特别是通孔和其它细孔的开口附近的技术。本发明提供了一种金属填充方法和具有填充金属部分的部件，其中，通过将所述基板10浸入加热和熔化的导电金属中，在将电镀液流入和填充到基板10的通孔11中时，形成填充的金属部分通过在该基板10的通孔11的一个端部的内表面以及围绕这些开口的基板顶表面13上预先形成金属层15，去除基板10，电镀液的流入和填充通过从电镀液中完成孔11，然后冷却固化已经填充到通孔中的电镀液。

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