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    • 2. 发明授权
    • Charged particle beam device, defect observation device, and management server
    • 带电粒子束装置,缺陷观察装置和管理服务器
    • US08779360B2
    • 2014-07-15
    • US13809923
    • 2011-06-22
    • Kozo MiyakeJunko KonishiTakehiro HiraiKenji Obara
    • Kozo MiyakeJunko KonishiTakehiro HiraiKenji Obara
    • H01J37/153
    • H01J37/153G01N23/00H01J37/28H01J2237/24592H01J2237/2817
    • Provided is a charged particle beam device that prevents the increase in processing trouble caused by deterioration in the reviewing performance (e.g., overlooking of defects) by detecting an operation abnormality affecting the performance of the device or a possibility of such an abnormality in the middle of a processing sequence of a sample and giving a feedback in real time. In each processing step of the charged particle beam device, monitoring items representing the operating status of the device (control status of the electron beam, an offset amount at the time of wafer positioning, a defect coordinate error offset amount, etc.) are monitored during the processing sequence of a sample and stored as history information. In the middle of the processing sequence, a comparative judgment between the value of each monitoring item and the past history information corresponding to the monitoring item is made according to preset judgment criteria. When the width of fluctuation from the past history information deviates from a reference range, an alert is issued.
    • 提供了一种带电粒子束装置,其通过检测影响装置的性能的操作异常或在中间的这种异常的可能性来防止由于检查性能的劣化(例如,忽视缺陷)引起的加工故障的增加 样品的处理顺序并实时提供反馈。 在带电粒子束装置的每个处理步骤中,监视表示装置的运行状态(电子束的控制状态,晶片定位时的偏移量,缺陷坐标误差偏移量等)的监视项目 在样品的处理顺序期间并存储为历史信息。 在处理顺序的中间,根据预先设定的判断基准,进行各监视项目的值与对应于监视项目的过去历史信息的比较判断。 当过去历史信息的波动宽度偏离参考范围时,发出警报。
    • 3. 发明申请
    • CHARGED PARTICLE BEAM DEVICE, DEFECT OBSERVATION DEVICE, AND MANAGEMENT SERVER
    • 充电颗粒光束装置,缺陷观察装置和管理服务器
    • US20130112893A1
    • 2013-05-09
    • US13809923
    • 2011-06-22
    • Kozo MiyakeJunko KonishiTakehiro HiraiKenji Obara
    • Kozo MiyakeJunko KonishiTakehiro HiraiKenji Obara
    • G01N23/00
    • H01J37/153G01N23/00H01J37/28H01J2237/24592H01J2237/2817
    • Provided is a charged particle beam device that prevents the increase in processing trouble caused by deterioration in the reviewing performance (e.g., overlooking of defects) by detecting an operation abnormality affecting the performance of the device or a possibility of such an abnormality in the middle of a processing sequence of a sample and giving a feedback in real time. In each processing step of the charged particle beam device, monitoring items representing the operating status of the device (control status of the electron beam, an offset amount at the time of wafer positioning, a defect coordinate error offset amount, etc.) are monitored during the processing sequence of a sample and stored as history information. In the middle of the processing sequence, a comparative judgment between the value of each monitoring item and the past history information corresponding to the monitoring item is made according to preset judgment criteria. When the width of fluctuation from the past history information deviates from a reference range, an alert is issued.
    • 提供了一种带电粒子束装置,其通过检测影响装置的性能的操作异常或在中间的这种异常的可能性来防止由于检查性能的劣化(例如,忽视缺陷)引起的加工故障的增加 样品的处理顺序并实时提供反馈。 在带电粒子束装置的每个处理步骤中,监视表示装置的运行状态(电子束的控制状态,晶片定位时的偏移量,缺陷坐标误差偏移量等)的监视项目 在样品的处理顺序期间并存储为历史信息。 在处理顺序的中间,根据预先设定的判断基准,进行各监视项目的值与对应于监视项目的过去历史信息的比较判断。 当过去历史信息的波动宽度偏离参考范围时,发出警报。
    • 8. 发明申请
    • CHARGED PARTICLE BEAM APPARATUS THAT PERFORMS IMAGE CLASSIFICATION ASSISTANCE
    • 执行图像分类协助的充电颗粒光束装置
    • US20140185918A1
    • 2014-07-03
    • US14238561
    • 2012-07-04
    • Takehiro HiraiKenji ObaraKozo Miyake
    • Takehiro HiraiKenji ObaraKozo Miyake
    • G06T7/00
    • G06T7/0004H01J2237/2817H01L22/12H01L22/20
    • An increase in the number of evaluation points of a semiconductor wafer is effective in improving evaluation accuracy of a manufacturing process. However, a method of automatically evaluating and classifying of these evaluation points by a defect review apparatus is lower in accuracy as compared with a manual work, and it is difficult to perfectly automate the method by these apparatuses. Therefore, the judgment as to whether the evaluation point is actually a defect is entrusted to manual evaluation, limiting the number of evaluable points. The present invention aims at lightening a burden of the manual work in process margin evaluation in a semiconductor manufacturing process.The present invention automatically judges the good or bad of an observation object on the basis of information obtained from an image of the observation object on a wafer; displays a judgment result on a screen; displays the observation object, extracted from the judgment result, that requires to be corrected on the basis of the good or bad of the observation object from a user; and corrects the judgment result to the extracted and displayed observation object on the basis of an instruction from the user.
    • 半导体晶片的评价点的数量的增加对提高制造工序的评价精度是有效的。 然而,与手动工作相比,通过缺陷检查装置自动评估和分类这些评估点的方法的准确度较低,并且难以通过这些装置完美地自动化该方法。 因此,评估点是否实际上是缺陷的判断被委托给手动评估,限制了可评价点的数量。 本发明旨在减轻半导体制造过程中的工艺边缘评估中的手工工作的负担。 本发明基于从晶片上的观察对象的图像获得的信息自动判断观察对象的好坏; 在屏幕上显示判断结果; 根据用户的观察对象的好坏显示需要根据判断结果提取的观察对象的需要进行校正的观察对象; 并且根据来自用户的指示将判断结果校正到所提取和显示的观察对象。
    • 9. 发明授权
    • Method and apparatus for reviewing defect
    • 检查缺陷的方法和装置
    • US09342879B2
    • 2016-05-17
    • US14347127
    • 2012-07-06
    • Yohei MinekawaKenji NakahiraMinoru HaradaTakehiro HiraiRyo Nakagaki
    • Yohei MinekawaKenji NakahiraMinoru HaradaTakehiro HiraiRyo Nakagaki
    • G06K9/00G06T7/00
    • G06T7/0004G06T7/001G06T2207/10061G06T2207/20016G06T2207/30148
    • A method for reviewing defect, comprising the steps of: as an image acquisition step, imaging a surface of a sample using arbitrary image acquisition condition selected from a plurality of image acquisition conditions and obtaining a defect image; as a defect position calculation step, proceeding the defect image obtained by the image acquisition step and calculating a defect position on the surface of the sample; as a defect detection accuracy calculation step, obtaining a defect detection accuracy of the defect position calculated by the defect position calculation step; and as a conclusion determination step, determinating whether the defect detection accuracy obtained by the defect detection accuracy calculation step meets a predetermined requirement or not; wherein until it is determined that the defect detection accuracy obtained by the defect detection accuracy calculation step meets a predetermined in the conclusion determination step, the image acquisition condition is selected from the plurality of image acquisition conditions once again and the image acquisition step, the defect position calculation step, the defect detection accuracy calculation step and the conclusion determination step are repeated.
    • 一种检查缺陷的方法,包括以下步骤:作为图像获取步骤,使用从多个图像获取条件中选择的任意图像获取条件对样本的表面进行成像并获得缺陷图像; 作为缺陷位置计算步骤,进行通过图像获取步骤获得的缺陷图像,并计算样本表面上的缺陷位置; 作为缺陷检测精度计算步骤,获得由缺陷位置计算步骤计算的缺陷位置的缺陷检测精度; 以及作为结论确定步骤,确定由缺陷检测精度计算步骤获得的缺陷检测精度是否满足预定要求; 其中直到确定由缺陷检测精度计算步骤获得的缺陷检测精度在结论确定步骤中达到预定值时,再次从多个图像获取条件中选择图像获取条件,并且图像获取步骤,缺陷 位置计算步骤,重复缺陷检测精度计算步骤和结论确定步骤。