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    • 10. 发明授权
    • Metal film/aromatic polyimide film laminate
    • 金属膜/芳香族聚酰亚胺薄膜层压板
    • US06699572B2
    • 2004-03-02
    • US09957869
    • 2001-09-21
    • Tomohiko YamamotoToshihiko AnnoToshiyuki NishinoTakashi Amane
    • Tomohiko YamamotoToshihiko AnnoToshiyuki NishinoTakashi Amane
    • B32B702
    • C08J7/047B32B15/08C08G73/1042C08J2379/08C08J2479/00C08L79/08H05K1/0346Y10T428/2495Y10T428/24959Y10T428/24967Y10T428/24975Y10T428/264Y10T428/265Y10T428/31681Y10T428/31721
    • A metal film/aromatic polyimide film laminate is composed of a composite aromatic polyimide film and a metal film, in which the composite aromatic polyimide film is composed of an aromatic polyimide substrate film having a linear expansion coefficient of 5×10−6 to 30×10−6 cm/cm/° C. in the temperature range of 50-200° C. (measured in machine direction), and a thin aromatic polyimide layer of polyimide prepared from a carboxylic acid component comprising a mixture of 3,3′,4,4′-biphenyltetracarboxylic dianhydride and 2,3,3′,4′-biphenyltetracarboxylic dianhydride in a molar ratio of 50:50 to 90:10 and an aromatic diamine component composed of 1,3-bis(4-aminophenoxy)benzene or a mixture of 1,3-bis(4-aminophenoxy)benzene and p-phenylenediamine and/or diaminodiphenyl ether in a molar ratio of 10/90 or more. Tg of the thin polyimide layer is 210-310° C. The metal film is fixed to the thin polyimide layer at a 90° peel resistance of 0.5 kg/cm or higher, while the thin polyimide layer is bonded to the substrate film at a 90° peel resistance higher than that between the metal film and the thin layer.
    • 金属膜/芳香族聚酰亚胺膜层叠体由复合芳香族聚酰亚胺膜和金属膜构成,其中复合芳香族聚酰亚胺膜由线性膨胀系数为5×10 -6〜30×10 6的芳香族聚酰亚胺基材膜构成, 在50-200℃的温度范围(在机器方向上测量),并且由包含3,3'的混合物的羧酸组分制备的聚酰亚胺薄芳香族聚酰亚胺层为-6> cm / cm / ,4,4'-联苯四羧酸二酐和摩尔比为50:50至90:10的2,3,3',4'-联苯四羧酸二酐和由1,3-双(4-氨基苯氧基) 苯或1,3-二(4-氨基苯氧基)苯和对苯二胺和/或二氨基二苯醚的摩尔比为10/90以上的混合物。 薄聚酰亚胺层的Tg为210〜310℃。金属膜以0.5kg / cm以上的90°剥离电阻固定在薄聚酰亚胺层上,同时将薄聚酰亚胺层以 90°剥离阻力高于金属膜与薄层之间的剥离强度。